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NEWS TAGGED CHIPBOND
Thursday 16 September 2021
Backend firms to see strong 5G RF module demand for iPad mini 6
Backend houses including ASE Technology and Chipbond Technology are poised to enjoy robust orders for processing 5G RF modules, driven by demand for Apple's just-unveiled iPad mini...
Tuesday 14 September 2021
DDI backend houses to strengthen high-end testing capacity expansions in 2022
Display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies will remain focused on expanding high-end testing capacity in 2022 to satisfy growing...
Monday 6 September 2021
UMC, Chipbond to form partnership through share swap
Pure-play foundry United Microelectronics (UMC) has announced plans to form a strategic partnership with Chipbond Technology, a display driver IC (DDI) backend specialist, through...
Tuesday 3 August 2021
COF substrate, probe card demand stays robust for processing DDI chips
Tape COF substrates and probe cards continue to see robust demand for processing display driver ICs (DDI), which will buoy revenue performance at related suppliers in the third quarter,...
Monday 2 August 2021
DDI backend quotes trending upward
Display driver IC (DDI) backend quotes will be rising again in the third quarter of 2021 to reflect supply-side constraints, according to industry sources.
Thursday 22 July 2021
HiSilicon faces difficulty gaining manufacturing support for OLED DDI
HiSilicon is gearing up in-house development of OLED display driver chips (DDI), but has encountered difficulty in gaining sufficient support from foundries and OSATs capable of providing...
Friday 16 July 2021
ChipMOS, Chipbond may further raise backend quotes in 2H21
Backend houses ChipMOS Technologies and Chipbond Technology are expected to raise again their backend service quotes later in the second half of 2021, as robust demand for car-use...
Thursday 1 July 2021
Skyworks to increase outsourcing for PA orders from China
Skyworks will be stepping up its RF power amplifier (PA) production outsourcing to Taiwanese partners to fulfill orders placed by China-based smartphone vendors, while providing its...
Wednesday 16 June 2021
Hermes Testing poised to tap cantilever probe card market
Hermes Testing Solutions (HTSI), a unit of chipmaking equipment supplier Hermes-Epitek, is poised to develop and manufacture cantilever probe cards with the technology already transferred...
Tuesday 15 June 2021
DDI backend services, materials see order visibility throughout 2021
Display driver IC (DDI) backend specialists ChipMos Technologies and Chipbond Technology, and related COF and COG packaging materials vendors including Niching Industrial have seen...
Friday 21 May 2021
OSE to expand EMS services, boost partnership with Chipbond
Orient Semiconductor Electronics (OSE) is looking to scale up its EMS business beyond the electronics sector, while strengthening its collaboration with backend house Chipbond Technology...
Thursday 13 May 2021
DDI packaging materials demand stays robust
Demand for packaging materials for processing high-end display driver ICs (DDI) remains strong, as backend houses including Chipbond Technology and ChipMOS Technologies still maintain...
Wednesday 12 May 2021
Taiwan OSATs see order preparation times extended
Major Taiwan-based OSATs including ASE Technology, Powertech Technology (PTI), Chipbond Technology and ChipMOS Technologies have seen their order preparation times extended to three...
Wednesday 5 May 2021
Driver IC backend capacity utilization unstable
Display driver IC (DDI) backend specialists Chipbond Technology and ChipMOS Technologies have seen unstable capacity utilization for processing small- to medium-size applications...
Wednesday 31 March 2021
Tape COF substrate supply to become tight for processing OLED DDI
The supply of tape COF substrates is expected to fall short of demand in 2021, due to growing COF packaging demand for OLED display driver ICs (DDI) , according to industry sources...