Taiwan-based display driver IC (DDI) backend specialists expect to post flat sequential revenue growth in the fourth quarter of 2021, as tight foundry capacity constrains their fabless...
The development of the China power restriction policy will have to be observed for at least one year before assessing changes it may pose to electronics supply chains or whether backend...
Since the outbreak of the COVID-19 epidemic, the global electronics supply chain has been bogged down by the effects of the "broken chain," uneven component supply, and frequent price...
Taiwan's makers of RF and PA devices hope MediaTek can lead the local supply chain to meet competition from Qualcomm in tapping the mmWave 5G market, according to industry sources...
Display driver IC backend specialists Chipbond Technology and ChipMOS Technologies are looking to enhance their high-end testing capability, eyeing promising growth in demand for...
Backend houses including ASE Technology and Chipbond Technology are poised to enjoy robust orders for processing 5G RF modules, driven by demand for Apple's just-unveiled iPad mini...
Display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies will remain focused on expanding high-end testing capacity in 2022 to satisfy growing...
Pure-play foundry United Microelectronics (UMC) has announced plans to form a strategic partnership with Chipbond Technology, a display driver IC (DDI) backend specialist, through...
Tape COF substrates and probe cards continue to see robust demand for processing display driver ICs (DDI), which will buoy revenue performance at related suppliers in the third quarter,...
Display driver IC (DDI) backend quotes will be rising again in the third quarter of 2021 to reflect supply-side constraints, according to industry sources.
HiSilicon is gearing up in-house development of OLED display driver chips (DDI), but has encountered difficulty in gaining sufficient support from foundries and OSATs capable of providing...
Backend houses ChipMOS Technologies and Chipbond Technology are expected to raise again their backend service quotes later in the second half of 2021, as robust demand for car-use...
Skyworks will be stepping up its RF power amplifier (PA) production outsourcing to Taiwanese partners to fulfill orders placed by China-based smartphone vendors, while providing its...
Hermes Testing Solutions (HTSI), a unit of chipmaking equipment supplier Hermes-Epitek, is poised to develop and manufacture cantilever probe cards with the technology already transferred...
Display driver IC (DDI) backend specialists ChipMos Technologies and Chipbond Technology, and related COF and COG packaging materials vendors including Niching Industrial have seen...
