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NEWS TAGGED CHIPBOND
Tuesday 22 December 2020
Taiwan OSAT firms see clear order visibility through mid-2021
Taiwan-based OSAT services providers have seen clear order visibility through mid-2021, thanks to robust demand for 5G and Wi-Fi chips, power management ICs (PMIC), and display driver...
Monday 21 December 2020
Taiwan OSAT firms to see output value break US$20 billion in 2021, says Digitimes Research
The combined output value of Taiwan's OSAT firms is estimated to grow by over 15% to US$18.5 billion in 2020 and to US$20 billion in 2021, according to Digitimes Research.
Wednesday 16 December 2020
Backend firms see strong demand for DDI, NAND controller chips
Taiwan-based backend houses have seen strong demand for display driver ICs and NAND flash controller chips, with clear order visibility through the second quarter of 2021, according...
Monday 7 December 2020
Taiwan backend houses see orders boom
Taiwan backend houses will continue to embrace orders shifted by chipmakers from Chinese peers, as "risk control" has become a major concern among global chipmakers now that the US...
Friday 4 December 2020
Chipbond to expand backend capacity for RF, PA devices, driver ICs
Taiwan's backend house Chipbond Technology has disclosed plans to build additional testing capacity to satisfy robust demand for display driver ICs, RF and PA components.
Monday 30 November 2020
Novatek driver ICs cut into iPad supply chain, say sources
Novatek Microelectronics reportedly has signed a deal with Apple that will allow the Taiwan-based IC maker to begin shipping its LCD driver ICs for iPad devices in the second half...
Monday 23 November 2020
ASE Technology to raise backend service quotes by 5-10% in 1Q21
Taiwan's top OSAT firm ASE Technology will hike backend service quotes by 5-10% starting first-quarter 2021 to reflect increased cost and tight capacity supply for some products,...
Tuesday 10 November 2020
Driver IC backend firms see clear order visibility through 1H21
Display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies have enjoyed a ramp-up in orders for handset-use TDDI chips, with clear order visibility...
Monday 9 November 2020
Chipbond posts record October revenue
Taiwan-based Chipbond Technology, a backend house specializing in display driver ICs, saw its October revenue hit a record high for the third consecutive month.
Tuesday 27 October 2020
Taiwan driver IC backend houses gaining from Samsung exit from LCD
Taiwan's driver IC backend firms have seen small-volume rush orders as a result of Samsung Electronics' gradual exit from the LCD panel market, according to industry sources said.
Monday 26 October 2020
Driver ICs tight supply: Q&A with Chipbond chairman FJ Wu
The supply of display driver ICs has fallen short of demand, while capacities at 8-inch foundries stay tight. Backend houses are mulling raising their quotes to reflect the tight...
Tuesday 20 October 2020
Chipbond, OSE form alliance for flash, 5G RF modules packaging
Display driver IC backend specialist Chipbond Technology and memory modules backend and EMS service provider Orient Semiconductor Electronics (OSE) have formed a long-term strategic...
Friday 16 October 2020
Tape COF substrate demand falling, likely to rebound in 1Q21
Tape COF substrate demand has been falling thanks partly to insufficient foundry support for LCD driver ICs, and may not pick up until the first quarter of 2021, prompting some makers...
Thursday 15 October 2020
ASE to post slight revenue growth in 4Q20, says report
Backend house ASE Technology is expected to see its consolidated revenue consisting of sales generated by its core IC ATM (assembly, test and material) business and EMS subsidiary...
Tuesday 13 October 2020
COF, COG packaging materials shipments ramping up
Taiwan's IC materials distributors including Niching Industrial have seen a significant surge in shipments of COF and COG packaging materials and thermal solutions since the third...