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ASE to raise US$200 million through ECB

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia Monday 29 June 2015 0

Advanced Semiconductor Engineering (ASE) has unveiled plans to raise US$200 million via an euro-convertible bond (ECB) issue, and set the conversion price of the ECBs at NT$54.55 (US$1.76).

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