The trade tensions between Japan and Korea are expected to drive up memory prices, prompting the chip and module vendors to accelerate inventory adjustments, after which they will increase orders for their supply chain partners, including backend service providers. But NAND flash makers are not being carried away by the price rally, focusing efforts on advancing their technologies to capture opportunities from the datacenter and high-end enterprise market segments. in Taiwan, specialty DRAM and flash memory chipmaker Winbond Electronics is building a new fab that is scheduled to start volume production by 2021.
Memory backend firms see clear order visibility throughout 4Q19: Taiwan-based memory backend specialists have seen clear order visibility through the fourth quarter of 2019, as they have directly or indirectly tapped into the supply chains of major non-Korea memory suppliers including Toshiba Memory (TMC) and Micron unaffected by Japan's tighter control on exports of key semiconductor chemical materials to Korea, according to industry sources.
NAND flash vendors gearing up for datacenter market boom: NAND flash vendors are gearing up to roll out their high-end solutions for datacenter and high-end enterprise products while stepping up their pace of technology transitions. Competition among them is set to be fierce in 2020, according to industry sources.
Winbond on track to open new memory fab by 2021: Specialty DRAM and flash memory chipmaker Winbond Electronics on July 22 held a beam-raising ceremony for its new 12-inch wafer plant in Kaohsiung, southern Taiwan. The new facility is on track to have Winbond's in-house developed 20nm process technology ready for commercial production by 2021.