Samsung Electronics has announced the development of 12-layer 3D-TSV chip packaging technology.
Consumer NAND flash prices rally in China
5h 29min ago in Before Going to Press
GCS, Epistar strengthen tie-up
5h 32min ago in Before Going to Press
ASE obtains major backend orders for 5G smartphone chips
5h 52min ago in Before Going to Press
TWS chip market to face eliminations
5h 57min ago in Before Going to Press
Lens module maker Genius optimistic about 2020
6h 10min ago in Before Going to Press
Zhen Ding to raise funds for IC substrate business
6h 18min ago in Before Going to Press
MediaTek to roll out another 5G SoC later in December
6h 25min ago in Before Going to Press
TSMC poised to post up to 5% revenue growth in 2019
TV panel inventory dragged down by suppliers production cutback
Global AIO PC shipments will continue shrinking in 2019.
For 2019, Taiwan-based server shipments will pick up another 7% on year.
Worldwide shipments of smartphone application processors are expected to fall.