BOE, China's leading display panel maker, is accelerating its move into next-generation packaging technologies for the AI era. The company...

TSMC has accelerated efforts to localize its supply chain in recent years, using joint development, joint validation, and long-term...

Global server demand is expected to stay strong through 2027, with implications for cloud operators, hardware makers, and data center...

China's power semiconductor makers are entering a broader price-hike cycle, as AI server demand, raw material inflation, and tight...

Touch module maker General Interface Solution Holding (GIS) said the second half of 2026 will be more challenging as global memory...

Chinese semiconductor material manufacturers are accelerating investments in advanced products as Beijing pushes for greater self-sufficiency,...

SK Hynix's latest senior hiring drive has reignited debate in South Korea's semiconductor industry, with the move seen as more than...

TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to...

As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating...