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    Samsung locks 70% of memory output as HBM spot prices soar
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    Cisco: CPO is ready for mass deployment amid surging AI data-center demand
    5min ago
    Huawei's revenue climbs 9.6%, but AI, chips and HarmonyOS exact heavier R&D toll
    9min ago
    South Korea-India joint venture opens semiconductor materials plant, targets China-free supply chain
    11min ago
    Commentary: CXMT's HBM3E leap gives China's AI chipmakers a new path to scale
    14min ago
    China's humanoid robot cost cuts run into three bottlenecks
    15min ago
    India expands chip ambitions with full Semicon 2.0 notification
    18min ago
    NEWS TAGGED PACKAGING
    Tuesday 1 September 2026
    Taiwan's G2C+ Alliance members target global markets
    Artificial intelligence (AI) chips are driving a new wave of integration competition among Taiwan semiconductor equipment makers. Taiwan's G2C+ strategic alliance, comprised of C Sun,...
    Tuesday 1 September 2026
    SEMICON Taiwan 2026 to spotlight AI-driven semiconductor supply chain shifts
    SEMICON Taiwan 2026 is set to open soon as Semiconductor Equipment and Materials International said AI is pushing a new wave of technology upgrades across the global chip industry...
    Tuesday 1 September 2026
    Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing

    As transistor scaling becomes more difficult and costly, advanced packaging has become one of the most important paths for extending Moore's Law. Technologies such as...

    Tuesday 1 September 2026
    Chinese OSAT earnings surge on AI packaging demand, but recurring profit tells a narrower story
    Five listed Chinese outsourced semiconductor assembly and test providers reported first-half 2026 results in the last two weeks of August, showing net profit growth of up to 317%,...
    Monday 31 August 2026
    Gudeng sees double-digit advanced packaging growth from 2027
    Demand for AI and high-performance computing (HPC) continues to drive semiconductor process development, with advanced nodes and advanced packaging entering a new cycle of capacity...
    Monday 31 August 2026
    TSMC tackles the AI I/O wall with two COUPE bandwidth paths and deeper heterogeneous integration
    TSMC is sharpening its silicon photonics (SiPh) roadmap to address the widening gap between AI compute growth and chip-to-chip data movement, unveiling two bandwidth-scaling paths...
    Monday 31 August 2026
    ASE: CPO scale-out demands deeper supply-chain coordination for mass production
    SEMICON Taiwan 2026 kicked off its pre-show program with the Silicon Photonics Global Summit.
    Monday 31 August 2026
    Shanghai's 15th Five-Year Plan bets on chips, AI, advanced packaging
    On August 26, the Shanghai municipal government released its 15th Five-Year Plan for the Development of Strategic Emerging Industries, setting a target for added value in strategic...
    Monday 31 August 2026
    South Korea risks 'HBM 2.0' trap in emerging CPO market
    Co-packaged optics (CPO) is emerging as a critical next-generation technology for AI infrastructure, but unless South Korea strengthens its integration and validation capabilities,...
    Monday 31 August 2026
    Weekly news roundup: US pressures Korea chip investment, MediaTek wins Google TPU, Apple debuts 2nm M6
    Semiconductor investment, AI chips, advanced packaging and data center infrastructure dominated the week, with South Korea facing US pressure, India scaling chip manufacturing, and...
    Monday 31 August 2026
    India roundup: India broadens semiconductor and AI ambitions across manufacturing, design, materials and data centers
    India's semiconductor ambitions are expanding from packaging and testing to chip design, materials, mobile devices and data centers. New investments by CG Power, Infineon, Foxconn,...
    Monday 31 August 2026
    Podcast highlights: Xiaomi's 3nm chip cap, HBM in Malaysia, and Nvidia's margin tradeoff
    Can Xiaomi's in-house chip reach 2nm? Is HBM rerouting to Malaysia TSMC giving Intel a pass? Can Nvidia hold a 75% gross margin or protect market share? Ahead of Apple's September...
    Monday 31 August 2026
    Tex Year's specialty chemicals push could reshape its growth mix as AI and optics expand
    Tex Year is widening its specialty chemicals business beyond LCDs and electronics into AI servers, in-vehicle electronics, Mini LED, and optical lenses, while also targeting optical...
    Saturday 29 August 2026
    Samsung bets on JWMT: can glass substrates flip the script for South Korea in advanced packaging?
    As artificial intelligence (AI) chips continue to scale up in physical size, semiconductor competition is rapidly extending beyond front-end node scaling into advanced packaging. The...
    Friday 28 August 2026
    AI packaging race heats up: Taiwan OSATs plan US$14.6 billion capex

    The AI investment cycle is spreading from leading-edge wafer fabrication into semiconductor packaging and testing, with Taiwan's largest...

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    BIZ FOCUS
    Aug 31, 08:00
    NewPower Worldwide expands credit facility to $750M for growth
    Monday 31 August 2026
    Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON
    Thursday 27 August 2026
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
    Tuesday 25 August 2026
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
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