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Friday 16 January 2026
Biwin Storage profit jumps 427% as memory cycle turns
China's domestic memory module maker Biwin Storage Technology has released the A-share market's first major 2025 profit outlook, signalling a sharp earnings rebound as memory prices...
Friday 16 January 2026
Vietnam to set up national semiconductor chip prototyping center
Vietnam's Ministry of Science and Technology has decided to establish a national center for semiconductor chip prototyping, a move aimed at developing high-quality human resources...
Friday 16 January 2026
Top 10 chart: Regenerated wafers and AI-linked packaging lift Taiwan chip materials sector
Taiwan's semiconductor materials sector delivered a mixed performance in December 2025, highlighting a widening gap between advanced and mature segments of the supply chain. Upstream...
Thursday 15 January 2026
TSMC retains pricing power using Apple and AI dual structure
Generative AI is reshaping TSMC's customer structure. While Apple remains TSMC's largest single customer by revenue share, the rapid growth of high-performance computing (HPC) businesses...
Thursday 15 January 2026
Foxconn-HCL semiconductor joint venture to be named India Chip Private Limited
Electronics manufacturing services major Foxconn and India's HCL Group have formally named their semiconductor joint venture India Chip Private Limited, according to a regulatory filing...
Thursday 15 January 2026
Exclusive: T-Glass shortage ripples through memory and advanced packaging markets

The global memory industry is confronting a growing capacity crunch, one that is increasingly rippling upstream to a shortage of glass...

Thursday 15 January 2026
Rising memory prices lift Taiwan supply chain earnings

The global memory industry entered a clear upturn in the second half of 2025 as both spot and contract prices rose sharply, lifting earnings...

Thursday 15 January 2026
China's WUS to build US$300m optical-electrical PCB hub for AI systems
WUS Printed Circuit (Kunshan) Co. plans to invest up to US$300 million in a high-density optical-electrical printed circuit board (PCB) project aimed at supporting next-generation...
Wednesday 14 January 2026
Advanced packaging crunch lifts ASE, KYEC to new highs
TSMC will hold its earnings call on January 15, 2026. Supply chain sources expect AI chip demand to remain strong in 2026, while TSMC's advanced packaging and testing capacity continues...
Wednesday 14 January 2026
SK Hynix to invest in new advanced packaging plant amid AI memory demand
SK Hynix has announced plans to invest KRW19 trillion (US$13.02 billion) to construct a new advanced packaging facility, P&T7, in Cheongju, North Chungcheong Province, South Korea...
Wednesday 14 January 2026
TSMC turns Arizona gamble into goldmine as suppliers ride 10-year wave
After five years of struggling with double construction timelines and billion-dollar regulatory hurdles, TSMC has quietly transformed its Arizona operations into a profit engine, and...
Wednesday 14 January 2026
CPO module output to grow by 137% annually as Taiwan fosters key photonic tech
Market research firm Yole Group has forecasted a 43% compound annual growth rate (CAGR) for the photonic integrated circuit (PIC) sector, with co-packaged optics (CPO) module output...
Wednesday 14 January 2026
Trymax ?? Plasma-based etching, stripping and curing process equipment maker

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum,...

Tuesday 13 January 2026
Taiwan OSAT sector posts broad 2025 revenue gains as AI testing offsets weak consumer recovery
Taiwan's outsourced semiconductor assembly and test (OSAT) industry closed December 2025 with a pattern that investors have increasingly come to expect: revenue growth was widespread...
Tuesday 13 January 2026
Taiwan pushes silicon photonics frontier R&D to defend semiconductor edge in AI era
Taiwan dominates advanced semiconductor manufacturing, but mounting competition in emerging technologies is exposing structural gaps. To secure its position in the AI and data-center...