Global semiconductor manufacturing equipment sales will drop 10.5% to US$57.6 billion in 2019 from last year's historic peak of US$64.4 billion but stage a 2020 recovery and set a...

Robust orders for 5G smartphone application processors from the world's major Android phone vendors will allow backend house ASE Technology Holding to enjoy a particularly strong...

Taiwan's CMOS image sensor (CIS) packaging specialists including Kingpak Technology, Xintec,VisEra Technologies and Tong Hsing Electronic Industries are expected to benefit significantly...

The market for packaging materials for 5G mmWave transmission modules is set to heat up in 2020, with LTCC (low temperature co-fired ceramic) likely to replace LCP (liquid crystal...

Chip-on-film (COF) substrate supplier JMC Electronics has seen orders for large-size display driver IC packaging slow down in the fourth quarter of 2019, for which the company is...

As shipments of midrange 5G smartphones are expected to expand significantly in 2020, the resultant strong demand for chipsets will be a major revenue growth driver for Taiwan's backend...

System-in-package (SiP) will gain significant growth momentum in 2020 as it will be badly needed to process wireless connectivity devices including RF front-end modules, antenna modules...

Wuhan Hongxin Semiconductor Manufacturing (HSMC), a logic IC foundry founded in late 2017, is gearing up for 14nm and 7nm process manufacturing eyeing to be China's most advanced...

Taiwan-based leadframe maker Jih Lin Technology expects its revenues to resume growth in 2020 on renewed demand for diverse leadframes from international IDMs for packaging automotive...

FOPLP (fan-out panel level package) will be a new option that is not meant to support pushes to 7nm, 5nm or even more advanced nodes but rather to provide a packaging solution that...

Taiwan-based backend equipment supplier All Ring Tech is optimistic about its business prospect for 2020 as it has tapped into the supply chains of Taiwan's leading wafer foundry...

ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, will be ramping up its capex next year to better meet growing demand for packaging high-speed fiber-optic...

Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors and other niche ICs, expects its 2020 revenues to hit a new high on...

ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, has reported net profit shot up 115.7% sequentially to a 13-quarter high of NT$268 million (US$8.78 million)...

TSMC's planned advanced packaging plant in Miaoli, Northern Taiwan has passed environmental impact assessment, enabling the foundry house to kick off construction of the new fab in...

The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of about US$6.62 billion for the construction of new fab facilities, installation...

CMOS image sensor (CIS) packaging specialist Kingpak Technology has reported consolidated revenues of NT$205 million (US$6.8 million) for October 2019, surging 30% sequentially and...

Global chipmakers are keenly developing Wi-Fi 6 chip solutions to support sub-6-GHz 5G smartphones, the mainstream new-generation models estimated to register annual shipments of...

IC backend house ASE Technology Holding expects to enjoy a better-than-regular performance for the first quarter of 2020 thanks to strong high-end chips packaging orders for 5G phones,...

China's semiconductor industry has experienced a more reasonable structural adjustment with IC design replacing packaging and testing as the largest segment in terms of revenue contribution...

ASE Group has developed an Ansys customization toolkit (ACT) workflow to enhance its IC packaging and development process.

Taiwan semiconductor backend supply chain players are poised to ramp up their shipments and revenues in line with aggressive rollout of diverse 5G chip solutions by major chipmakers,...

Japan IDM Rohm Semiconductor will strengthen sales of power components for industrial and automotive applications in Taiwan through local distribution agents, seeing opportunities...

Samsung Electronics has announced the development of 12-layer 3D-TSV chip packaging technology.

Niche-market IC packaging house Xintec is eyeing its return to profitability this year, according to industry observers.