Chroma Ate, which provides integrated and customized solutions for test and measurement instruments, has reported net profits increased 24% sequentially to NT$580 million (US$19.8...

The global semiconductor packaging materials market will expand from US$17.6 billion in revenue logged in 2019 to US$20.8 billion in 2024, a 3.4% compound annual growth rate (CAGR),...

IC substrate maker Unimicron Technology is slated to complete construction of a new plant in Yangmei, northern Taiwan by the end of 2020, followed by process optimization and validation...

ASE Technology Holding has continued committing equity investments to build up its FC-AiP (flip chip-antenna in package) packaging capacity seeking to maintain its leading position...

LED chipmaker Epistar has seen shipments for fine-pitch RGB mini LED displays increase significantly in the third quarter of 2020, with orders to last into the fourth quarter, according...

Taiwan-based logic IC packaging firm Greatek Electronics, an affiliate of Powertech Technology (PTI), has indirectly cut into the supply chain of Sony's next-generation PS5 gaming...

Memory backend specialist Powertech Technology (PTI) is set to move its FoPLP (fan-out panel level package) technology into volume production starting early 2022, according to company...

Global sales of semiconductor manufacturing equipment by original equipment manufacturers are projected to increase 6% to US$63.2 billion in 2020 compared to US$59.6 billion in 2019,...

China's top-3 backend houses JCET, Huatian Technology and Tongfu Microelectronics, now all among the world's top-10 IC assembly and testing firms, are gaining increasing business...

Taiwan-based All Ring Tech and Laser Tek have both seen clear order visibility so far in third-quarter 2020 for PCB and passive component manufacturing equipment.

TSMC has seen capacity utilization rates for 16nm and more mature processs pick up recently, and has demanded sufficient supplies from related materials providers through October,...

IC materials distributors Topco Scientific and Wah Lee Industrial saw their revenues for second-quarter and first-half 2020 register impressive increases thanks mainly to clients...

Leading IC backend house ASE Technology Holding saw its revenues for both second-quarter and first-half 2020 hit record highs, thanks mainly to high capacity utilization for wire...

Whenever Moore's Law has seemingly reached its physical limits, there have been always new tech innovations emerging to break the limits, with EUV process and advanced packaging technology...

Chang Wah Electromaterials (CWE), a Taiwan-based distributor of packaging material and equipment, has disclosed plans to grow its stake in Tian Zheng International Precision Machinery,...

Taiwan-based IC substrate makers continue to improve their AiP (antenna in package) substrate production yield rates seeking to gain a firm presence in AiP packaging that is expected...

IC backend houses have seen demand pick up recently for processing TV SoCs and chip solutions for set-top boxes (STB) and other household appliances while chip demand for handset...

Formosa Advanced Technologies (FATC), an affiliate of memory maker Na Ya Technology and specializing in memory chips packaging and testing, remains upbeat about backend demand for...

Grand Plastic Technology (GPTC), specializing in wet process facilities, will see equipment orders for TSMC's new advanced packaging plant in Taiwan start generating revenues in 2021,...

Intel and TSMC are head to head in 3D packaging technology. While Intel has unveiled its Lakefield processors 3D-packaged...

Intel has launched its first heterogeneous chip architecture made using its Foveros 3D chip stacking technology, while TSMC is looking to commercialize its SoIC (system on integrated...

Innolux plans to expand its business beyond the current focus of panel manufacturing to include automation equipment and semiconductors leveraging the expertise it has gained from...

Display driver IC backend specialist Chipbond Technology is constructing a new plant designed mainly for processing RF and PA components for use in 5G devices, which will significantly...

New US trade sanctions against Huawei will bring "uncontrollable variables" to the IC market in the second half of 2020, according to Canon Huang, chairman and president for IC packaging...

Demand for power modules and module leadframes used in automotive and industrial control applications is expected to surge in the fourth quarter with shipments in the third quarter...