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NEWS TAGGED PACKAGING
Thursday 20 August 2026
Intel Malaysia packaging expansion draws HBM flows from Taiwan

South Korean export data showed a sharp shift in high-bandwidth memory, or HBM, shipments toward Malaysia and away from Taiwan, according...

Thursday 20 August 2026
Innolux turns panel fabs into FOPLP capacity, banking on sticky advanced packaging ties

Innolux is accelerating its dual-track transformation and asset-light strategy, with second-quarter 2026 earnings per share rising 185%...

Thursday 20 August 2026
Henkel Launches LOCTITE ABLESTIK CDF900 Series Conductive Die Attach Film

Henkel Adhesive Technologies today announced the launch of Loctite ABLESTIK CDF900, its next-generation conductive die attach film (cDAF) series, at SEMICON Taiwan 2026...

Wednesday 19 August 2026
Manz Asia targets PLP demand with three lines and three sizes
Manz Asia is broadening its push into panel-level packaging (PLP) as interest in the technology continues to rise. General manager Robert Lin said the company has shipped more than...
Wednesday 19 August 2026
PLP splits roles as FOPLP focuses on cost and CoPoS courts AI chips
As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and...
Wednesday 19 August 2026
Elite Advanced Laser says AI optical Shortage could last for years as orders outpace capacity
Elite Advanced Laser Corp. said persistent shortages in the AI optical supply chain are likely to continue for years, as demand for high-speed connections continues to outpace supply...
Wednesday 19 August 2026
Hanmi Semiconductor scales up bonding capacity with US$91.4 million plant buy amid AI packaging boom

Amid a global shortage of AI semiconductor equipment, Hanmi Semiconductor announced on August 18 that it will acquire a factory owned...

Wednesday 19 August 2026
Charts: New capacity is starting to show up in Taiwan's packaging and test revenue
Ardentec credits a new fab entering volume production for the sharpest monthly jump in the sub-sector; ELASER's revenue nearly doubled year on year on customer demand.
Tuesday 18 August 2026
LG Electronics lands first OSAT order for chip packaging LDI

LG Electronics has secured its first order for laser direct imaging (LDI) equipment used in semiconductor packaging, marking an early...

Tuesday 18 August 2026
Xintec readies 12-inch IVR backside copper for TSMC's next-gen AI chips

TSMC is expanding cooperation with packaging and testing affiliate Xintec as it develops next-generation power delivery and advanced packaging...

Tuesday 18 August 2026
TSC sees semiconductor material prices rise up to 15% as petrochemical costs squeeze supply

Topco Scientific (TSC) said at its second-quarter 2026 earnings conference that rising upstream petrochemical costs are pushing up...

Tuesday 18 August 2026
Daxin Materials accelerates semiconductor push with 12 products in mass production
Daxin Materials is expanding its semiconductor footprint, with semiconductor materials accounting for nearly 23% of revenue in the second quarter of 2026. The company expects the segment...
Tuesday 18 August 2026
Analysis: China's AI chip ambitions collide with Ajinomoto's 95% grip on ABF film

China's semiconductor self-reliance campaign is moving beyond lithography machines and advanced processors into less visible materials...

Tuesday 18 August 2026
Arm faces capacity squeeze as CPU demand tops US$2 billion

Arm Holdings' expansion from asset-light IP licensing into finished data center processors is putting the company into direct competition...

Monday 17 August 2026
AMD eyes Taalas: will the system ditch HBM, advanced packaging, and 3D stacking?
The AI compute landscape was jolted in February 2026 by Taalas, a Canadian startup founded by former AMD and NVIDIA architect Ljubisa Bajic. Emerging with an unconventional "Model-Based"...