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    Why Wiwynn chose El Paso for its first US plant
    2min ago
    Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging
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    NEWS TAGGED PACKAGING
    Wednesday 16 September 2026
    Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges

    AI, high-performance computing, and advanced packaging are accelerating demand for glass substrates, but smaller through-glass vias...

    Wednesday 16 September 2026
    Samsung reportedly pushes conventional memory modules to partners in Vietnam and India as HBM crowds its back end
    Samsung Electronics is reportedly handing the growth in its commodity memory module business to outside assemblers in Vietnam, India, and the Philippines, a sign of how completely...
    Wednesday 16 September 2026
    Glass substrates, TGV set to reshape 2027 advanced packaging race
    As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...
    Wednesday 16 September 2026
    Hanmi Semiconductor reportedly lands first back-end foothold at Terafab
    Hanmi Semiconductor has reportedly secured an order to supply advanced packaging equipment to Elon Musk's Terafab, marking the first known entry by a South Korean back-end equipment...
    Wednesday 16 September 2026
    MediaTek keeps Dimensity 9600 Pro on HBPoP as cost drives decisions

    MediaTek officially unveiled the Dimensity 9600 Pro on September 15, 2026, drawing significant industry attention to its choice of packaging...

    Wednesday 16 September 2026
    Apple, Intel links sharpen focus on Lens Technology's next glass growth markets
    Lens Technology is pushing its precision-glass expertise into two higher-value markets that could reshape its growth profile: Apple-linked foldable devices and Intel-linked through-glass-via...
    Wednesday 16 September 2026
    US-based Teradyne opens Bengaluru office to support India's semiconductor push
    Teradyne has opened a new office in Bengaluru as India expands its chipmaking ambitions, which could affect supply chains, pricing, and manufacturing capacity worldwide. The move gives...
    Wednesday 16 September 2026
    Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec
    The global surge in AI demand is accelerating change across the semiconductor industry, and as Moore's Law scaling faces physical limits, chipmaking is no longer only about shrinking...
    Wednesday 16 September 2026
    FSC teams with South Korean maker on TGV equipment for glass substrates
    Fu Chun Shin Machinery Manufacture (FSC), a major plastic injection molding machine maker, is expanding further into semiconductors by teaming up with Korean-Chinese joint venture...
    Tuesday 15 September 2026
    Interview: Corning sees CPO, glass core as new semiconductor battlegrounds

    As artificial intelligence applications accelerate, surging global semiconductor demand is pushing advanced packaging, co-packaged optics...

    Tuesday 15 September 2026
    Beyond H100: China's GPU makers chase scale, not just parity

    China's domestic GPU industry is entering a tougher phase: matching high-end accelerator performance is no longer enough. Vendors must...

    Tuesday 15 September 2026
    Samsung's Cheonan plant reallocates packaging capacity from Exynos to HBM
    Samsung Electronics is accelerating the restructuring of its semiconductor packaging footprint. Its Cheonan facility is gradually phasing out packaging operations for the Exynos mobile...
    Tuesday 15 September 2026
    TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
    TSMC's 3nm, 2nm, and CoWoS advanced packaging capacity remained in short supply in late 2026's third quarter, as changes in major customer orders and front-end and back-end supply...
    Tuesday 15 September 2026
    XPeng's Turing chip expands beyond cars
    XPeng Motors is extending its self-developed Turing AI chip from intelligent electric vehicles (EVs) into humanoid robots, broadening the processor's role in the company's Physical...
    Monday 14 September 2026
    DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up
    Taiwanese chip packaging firms are advancing fan-out panel-level packaging (FOPLP) and glass-substrate development as AI processors demand ever-larger reticle sizes and more complex...
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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
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