News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Friday 3 July 2026

Intel takes aim at TSMC's CoWoS lead with EMIB-T

As transistor density scaling slows, chipmakers are leaning on advanced packaging to keep improving accelerator performance. A SemiAnalysis roundup of this year's IEEE Electronic Components...

Friday 3 July 2026

BOE targets AI packaging with Micro LED optical interconnect and glass substrate CPO

BOE, China's leading display panel maker, is accelerating its move into next-generation packaging technologies for the AI era. The company...

Friday 3 July 2026

How TSMC quietly turned its supply chain into a 'second fleet'

TSMC has accelerated efforts to localize its supply chain in recent years, using joint development, joint validation, and long-term...

Friday 3 July 2026

Global server demand is set to stay strong through 2027 as supply chain pressure widens

Global server demand is expected to stay strong through 2027, with implications for cloud operators, hardware makers, and data center...

Friday 3 July 2026

SK Hynix puts US$64 billion into Cheongju chip buildout

SK Hynix plans to invest KRW100 trillion (approx. US$64.38 billion) to build new NAND memory chip and advanced packaging facilities in Cheongju, betting that AI demand will keep tightening...

Thursday 2 July 2026

China power chip makers raise prices, exposing AI server squeeze on mature-node supply

China's power semiconductor makers are entering a broader price-hike cycle, as AI server demand, raw material inflation, and tight...

Thursday 2 July 2026

GIS pivots to semiconductors and optics as memory shortages hit touch demand

Touch module maker General Interface Solution Holding (GIS) said the second half of 2026 will be more challenging as global memory...

Wednesday 1 July 2026

Samsung, SK Hynix southwest fab plans put Gwangju's silicon photonics ambitions in focus

Samsung Electronics' and SK Hynix's planned memory investments in South Korea's southwest have mostly been viewed as a push to balance regional development and tap into local renewable...

Wednesday 1 July 2026

China's chip material makers riding the AI boom close in on Japan

Chinese semiconductor material manufacturers are accelerating investments in advanced products as Beijing pushes for greater self-sufficiency,...

Wednesday 1 July 2026

South Korea's southwest chip hub plan faces supplier gap

South Korea's plan to build a KRW800 trillion (approx. US$51 billion) memory fab cluster in the southwestern Honam region is running into an inconvenient fact: the region has the country's...

Wednesday 1 July 2026

AI fuels OSAT pricing power as chip packaging orders fill through 2027

Cloud AI demand is reshaping the seasonal cycle of the semiconductor industry, with capacity tightness spreading from front-end manufacturing to back-end packaging and testing. Since...

Wednesday 1 July 2026

Naphtha supply risk adds pressure to semiconductor materials

A crude oil shortage tied to the US-Iran war is raising concern about naphtha, a refinery byproduct used deep in industrial supply chains. While a direct semiconductor shortage is...

Wednesday 1 July 2026

South Korea's southwest chip hub grows from memory fabs into full semiconductor and AI ecosystem

South Korea's government laid out a detailed plan on June 30 for building its southwest region into a major new semiconductor production base, with SK, Samsung Electronics and Amkor...

Wednesday 1 July 2026

SK Hynix talent hunt targets HBM's next frontiers while drawing Samsung employees' attention

SK Hynix's latest senior hiring drive has reignited debate in South Korea's semiconductor industry, with the move seen as more than...

Tuesday 30 June 2026

TSMC fast-tracks CoPoS—whole supply chain under gag order

TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to...

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