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    China smartphone market rebounded in April, with Apple poised to benefit most
    May 27, 18:51
    Huawei’s Tau law draws DeepSeek-style buzz amid chip restrictions
    May 27, 18:50
    NEWS TAGGED PACKAGING
    Thursday 28 May 2026
    Peking University's true-3D EDA tool gives Huawei's LogicFolding chip roadmap critical design link

    Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering...

    Thursday 28 May 2026
    Huawei Tau Law series 3: Global chip experts split over China's post-Moore push
    Huawei's "Tau (τ) Scaling Law," unveiled at ISCAS 2026 on May 25, has become a global semiconductor flashpoint, drawing scrutiny from financial institutions, media outlets, chip...
    Thursday 28 May 2026
    UMC readies price hikes, kicks off 2027 customer talks
    UMC held its shareholders' meeting on May 27, with CEO Jason Wang saying that as AI applications expand rapidly, long-term semiconductor demand still has room for growth. In addition...
    Wednesday 27 May 2026
    WinWay weighs Texas shift after AI chip testing surge in North America
    US efforts to rebuild its semiconductor supply chain are exposing a critical gap in domestic packaging and testing capacity, a bottleneck that industry sources expect to ease only...
    Wednesday 27 May 2026
    Broadcom and Taiwan's chipmakers ride ASIC wave
    The world's largest chip designers are steadily growing more bullish on the future of cloud artificial intelligence (AI) chips known as ASICs (application-specific integrated circuits)...
    Wednesday 27 May 2026
    AI infrastructure spending lifts Taiwan electronics sector outlook
    Cloud providers' large-scale investments in AI infrastructure have strengthened demand for Taiwan's electronics supply chain, boosting optimism among local manufacturers, according...
    Wednesday 27 May 2026
    Quality Innovation Powering AI: ZEISS Makes COMPUTEX Forum Debut

    ZEISS, a global leader in optics and optoelectronics, will bring the quality discussion to the official COMPUTEX 2026 Forum stage for the first time this year, highlighting...

    Wednesday 27 May 2026
    Huawei Tau Law series 2: Advanced packaging, AI interconnects, EDA lead the way
    Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking,...
    Tuesday 26 May 2026
    The US$16.5 Billion Bet: How Co-Packaged Optics Will Rewire AI's Backbone by 2030
    As AI clusters continue to scale, traditional interconnect architectures are facing new limits in bandwidth, power efficiency, and system integration. Co-Packaged Optics is emerging...
    Tuesday 26 May 2026
    AMD and Nvidia deepen investments in Taiwan semiconductor ecosystem

    When AMD CEO Lisa Su arrived in Taiwan on May 20, she announced plans to invest more than US$10 billion with local supply-chain partners...

    Tuesday 26 May 2026
    Intel's Rio Rancho fab becomes test case for AI-era chip packaging
    Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions...
    Tuesday 26 May 2026
    Huawei eyes AI storage breakthrough with DoB packaging, 245TB SSD roadmap
    Huawei has released its Data Storage 2030 white paper, setting out a technology roadmap for the global storage industry over the next five to...
    Tuesday 26 May 2026
    GUC showcases VSORA Jotunn8 AI processor at TSMC Europe Symposium

    Global Unichip Corp. (GUC), the Advanced ASIC Leader, will showcase Jotunn8, a next-generation data center AI inference processor developed by VSORA, at the TSMC Europe...

    Tuesday 26 May 2026
    Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026
    Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices...
    Monday 25 May 2026
    Nvidia's reporting pivot and AMD's US$10B Taiwan bet signal a new frontier in AI chip war
    Nvidia's structural pivot to isolate its ACIE market and AMD's US$10 billion investment in Taiwan infrastructure signal a profound realignment in the AI chip war. Both developments...
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    Research Report Database
    BIZ FOCUS
    Apr 28, 08:00
    AI anti-fraud solution wins virtual asset security hackathon
    Monday 27 April 2026
    SK hynix receives 2026 IEEE Corporate Innovation Award
    Monday 27 April 2026
    Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
    Friday 24 April 2026
    NewPower Named HPE 2026 Partner of the Year
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook