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NEWS TAGGED PACKAGING
Monday 24 November 2025
TSMC ramps 3/2nm and CoWoS capacity amid 24-hour production push
Despite Nvidia's strong third quarter of fiscal 2026 performance, surpassing forecasts for 12 consecutive quarters, global market concerns over AI remain. According to supply chain...
Monday 24 November 2025
Intel's EMIB becomes potential alternative to TSMC's CoWoS
TSMC's advanced CoWoS packaging capacity has become extremely tight, resulting in only a few leading AI chipmakers having the means to book capacity in large quantities. Other ASIC...
Monday 24 November 2025
VSORA and GUC Partner on Jotunn8 Datacenter AI Inference Processor

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced a collaboration with VSORA to deliver turnkey ASIC design services supporting the onschedule tapeout...

Friday 21 November 2025
Nexperia shockwaves hit auto industry as Europe and Japan slash output

The Dutch government recently suspended its administrative order against Nexperia and returned control of the chipmaker to its Chinese...

Friday 21 November 2025
ASE and SPIL draw attention as Nvidia pushes for expanded US packaging capacity
Nvidia reported strong third-quarter results for fiscal 2026 (ending October 2025), driven by robust sales of its Blackwell Ultra chips. Cloud data center revenue rose over 60% year-on-year...
Friday 21 November 2025
Eternal reportedly eyes 2026 growth with TSMC supply chain entry
Eternal is accelerating its push into semiconductor materials, expecting significant contributions by 2026. Its precision equipment shipments surged in the fourth quarter of 2025...
Friday 21 November 2025
South Korean tech giants rush into glass substrates despite mounting fears of overinvestment
South Korea's largest conglomerates are pouring resources into glass substrates, a next-generation semiconductor packaging material that promises better thermal stability and power...
Thursday 20 November 2025
Ligitek Electronics to invest in silicon photonics in cleanroom facilities with government support
Taiwan-based LED manufacturer Ligitek Electronics announced plans to enter the silicon photonics (SiPh) sector, investing tens of millions of New Taiwan dollars in cleanroom equipment...
Thursday 20 November 2025
ASML expands into advanced CoWoS packaging with new I-line system
Kuan-Cheng Hsu, ASML's Taiwan and Southeast Asia customer marketing head, highlighted that AI-driven semiconductor demand is entering its strongest growth cycle ever, accelerating...
Thursday 20 November 2025
Nvidia partners with Amkor, SPIL, and Menlo Micro to boost US IC backend capacity
Nvidia has announced key partnerships to expand its supply chain and manufacturing capacity in the US, aiming to meet rising global demand for artificial intelligence (AI) computing...
Thursday 20 November 2025
Amkor invests US$177M to expand AI chip packaging in South Korea
Amkor, one of the largest US-based outsourced semiconductor assembly and test (OSAT) providers, has begun investing over KRW260 billion (approx. US$177 million) in South Korea to...
Wednesday 19 November 2025
Global semiconductor IDM investment in ASEAN

Introduction

Tuesday 18 November 2025
Panjit acquires Torex Vietnam to boost global packaging and testing capacity
Panjit International has approved the use of US$10.03 million of internal funds to acquire a 95% stake in Torex Vietnam Semiconductor (Torex Vietnam), a subsidiary of Torex Semiconductor,...
Tuesday 18 November 2025
Panjit's MOSFET becomes top 3Q25 revenue contributor
Power semiconductor integrated device manufacturer (IDM) Panjit International has announced its consolidated financial results for the third quarter of 2025. Although quarterly revenue...
Tuesday 18 November 2025
PGC Strengthens Cloud and AI ASIC Acceleration with Synopsys' Next-Generation Interface and Memory IP on Advanced Nodes

As AI workloads scale across global cloud infrastructure, chip designers face a persistent challenge: balancing compute throughput, bandwidth, and power efficiency amid...