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    China controls 80% of global AI glasses production
    2h 53min ago
    LMOC ramps silicon photonics output with new MOCVD expansion plan
    2h 53min ago
    Transsion profits halved in 2025 because of memory price increases
    2h 54min ago
    CSPs ramp up AI capex as supply chain gains confidence
    2h 54min ago
    Concrete ESG standards needed as Phase 3-3 offshore wind development launches
    2h 54min ago
    NEWS TAGGED PACKAGING
    Saturday 31 January 2026
    Nvidia CEO tells TSMC to "work harder" as 2026 demand surges; reveals 10-year capacity doubling plan

    Nvidia CEO Jensen Huang hosted a high-profile banquet in Taipei on January 31, 2026, for the leaders of Taiwan's semiconductor ecosystem.

    Friday 30 January 2026
    KLA: AI-driven process control boom lifts 2026 semiconductor equipment demand

    US semiconductor equipment maker KLA said growing AI infrastructure demand is accelerating investment in advanced logic chips, high-bandwidth...

    Friday 30 January 2026
    ABF substrate crunch reshapes market: Unimicron leads and rivals close in

    AI server architectures are rapidly shifting toward ultra-high-density designs, keeping advanced CoWoS packaging capacity persistently tight...

    Friday 30 January 2026
    From Shenzhen to Global Opportunity: The BIWIN Mini SSD Ecosystem Application Seminar

    The "From Shenzhen to Global Opportunity: BIWIN Mini SSD Ecosystem Application Seminar", jointly hosted by BIWIN and Intel, was successfully concluded at the Intel Greater...

    Friday 30 January 2026
    Lam Research hits US$20.6 billion revenue high, sees 2026 WFE spending at US$135 billion
    Lam Research, a leading supplier of semiconductor manufacturing equipment dubbed the "US version of ASML," capped off fiscal 2025 with stellar performance, fueled by surging AI demand...
    Friday 30 January 2026
    Tex Year Industries eyes strong 1H26 growth on India, Vietnam capacity, and specialty chemicals
    Tex Year Industries anticipates returning to growth in 2026 following a slight revenue decline in 2025, driven by expanded production capacity in India and Vietnam and the maturation...
    Friday 30 January 2026
    Greatek hits full capacity on AI-driven flip chip, QFN packaging demand
    Powertech Technology (PTI) and its subsidiary test and assembly firm Greatek jointly held an online investor conference to discuss future operations. Greatek president Yu-Chang Chi...
    Thursday 29 January 2026
    China's MCU sector trends from price cutting to margin repair
    China's microcontroller (MCU) vendors have started raising prices, led by Cmsemicon's increases across MCU and related products, marking the first upward move in a market that has...
    Thursday 29 January 2026
    Analysis: China's chip price spiral has begun; a grey rhino threatening the 2026 supply chain
    China's semiconductor supply chain is sending a clear signal: a wave of "chip inflation" driven by mature-node manufacturing, memory, and packaging costs is no longer theoretical;...
    Thursday 29 January 2026
    Exclusive: TSMC reshapes advanced packaging expansion, shifting AP8, AP7, and US fab plans
    The surge in generative AI (GenAI) and high-performance computing (HPC) demand has pushed advanced semiconductor packaging to become the most critical and constrained capacity bottleneck...
    Thursday 29 January 2026
    UMC accelerates advanced packaging and silicon photonics development as AI drives demand
    As artificial intelligence (AI) applications expand globally, United Microelectronics Corporation (UMC) is intensifying its efforts in advanced packaging and silicon photonics (SiPh)...
    Thursday 29 January 2026
    Cmsemicon triggers MCU, NOR Flash price hikes of up to 50% in widening China chip cost cycle
    Chinese microcontroller (MCU) supplier Cmsemicon has raised prices on its MCU and NOR Flash products by 15% to 50%, citing tighter chip supply and higher packaging and testing costs...
    Thursday 29 January 2026
    Scientech's growth signals shift in semiconductor investment toward packaging and system integration
    As artificial intelligence (AI) and high-performance computing (HPC) expand rapidly, the global semiconductor industry is redirecting investments from advanced process nodes to advanced...
    Wednesday 28 January 2026
    Powertech will invest NT$43.3 billion to accelerate FOPLP, targets mass production in 1H27
    In response to growing demand from AI and high-performance computing (HPC) for advanced packaging capacity such as fan-out panel-level packaging (FOPLP), Powertech chairman DK Tsai...
    Wednesday 28 January 2026
    Powertech posts 4Q25 profit high, eyes growth momentum into 2026
    Memory testing and packaging firm Powertech Technology (PTI) reported that its revenue and earnings met expectations in the fourth quarter of 2025. Quarterly revenue reached NT$21.41...
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    Research Report Database
    BIZ FOCUS
    Jan 30, 12:05
    Taiwan's Tron Future Tech to Debut Advanced Drone Interception and Multi-cam Tracking Solutions at Singapore Airshow 2026
    Friday 30 January 2026
    The Future of Online Gaming Entertainment
    Friday 30 January 2026
    From Shenzhen to Global Opportunity: The BIWIN Mini SSD Ecosystem Application Seminar
    Wednesday 28 January 2026
    Ministry of Economic Affairs Launches 2026 Best AI Awards
    Special Report
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook