CONNECT WITH US
NEWS TAGGED PACKAGING
Monday 13 April 2026
Global chip equipment sales reach record US$135 billion as AI drives investment surge

Worldwide semiconductor manufacturing equipment sales rose 15% to a record US$135.1 billion in 2025 from US$117.1 billion a year earlier,...

Monday 13 April 2026
Japan funds AI chip ecosystem around Rapidus

Japan is accelerating efforts to rebuild a domestic advanced semiconductor ecosystem, with Rapidus at the center of a state-backed push...

Monday 13 April 2026
Global chip sales expect to top US$1 trillion in 2026 on AI demand

Taiwan's semiconductor supply chain posted stronger-than-expected results in the first quarter of 2026, as artificial intelligence (AI)...

Monday 13 April 2026
Silicon photonics scaling hits wafer testing bottleneck
AI demand is pushing data transmission to its limits, making 2026 a critical year for silicon photonics (SiPh) and co-packaged optics (CPO) to move into large-scale deployment. The...
Monday 13 April 2026
Weekly news roundup: Shortages spread to MLCCs; SK Hynix reportedly in talks with Microsoft and Google
Below are the most-read DIGITIMES Asia stories from the week of April 6-April 13, 2026:
Monday 13 April 2026
TPK and ASE to launch advanced semiconductor TGV packaging with 3Q26 pilot line
Touch panel maker TPK is partnering with semiconductor packaging giant ASE to enter the advanced through-glass via (TGV) packaging technology sector, focusing on developing glass substrates...
Monday 13 April 2026
FormFactor and MPI vie to break SiPh test bottleneck as ficonTEC reportedly exits
As AI data centers officially enter the silicon photonics (SiPh) era, the industry faces severe challenges in testing accuracy and throughput on the path toward mass production of...
Sunday 12 April 2026
China's Hwatsing ships 1,000th CMP system, targets advanced chip manufacturing growth

Hwatsing Technology has emerged as one of China's most prominent domestic suppliers of chemical mechanical planarization (CMP) equipment,...

Saturday 11 April 2026
ASE leads US$3.4B advanced testing push in Renwu
Global OSAT leader ASE continued its expansion into advanced processes as its subsidiary ASE Test held a groundbreaking ceremony on April 10, 2026, at the Renwu Industrial Park. ASE...
Friday 10 April 2026
Merck's material and equipment push could speed CPO and advanced packaging adoption
Merck presented integrated materials and inspection tools at Touch Taiwan 2026 as the panel industry pivots toward chip-on-panel (CPO) and advanced packaging. The company emphasized...
Friday 10 April 2026
China OSATs step up investment drive as AI demand lifts advanced packaging race

China's outsourced semiconductor assembly and test (OSAT) sector is accelerating capacity expansion and technology upgrades, with leading...

Friday 10 April 2026
Exclusive: SpaceX delays FOPLP, PCB yield as execs plan April Taiwan visit
Elon Musk's SpaceX is facing production challenges at its newly built fan-out panel-level packaging (FOPLP) and printed circuit board (PCB) factories in Texas, delaying full-scale...
Friday 10 April 2026
CoWoS capacity emerges as AI bottleneck as TSMC’s advanced packaging grows at 80% CAGR
Global advanced packaging capacity is currently in severe shortage. Nvidia has already reserved most of TSMC's leading-edge capacity, particularly its CoWoS packaging technology. According...
Friday 10 April 2026
Exclusive: Samsung weighs Vietnam semiconductor testing facility

According to sources familiar with the matter, Samsung is in discussions with the Vietnamese government...

Friday 10 April 2026
AUO eyes CPO and LEO satellites as Innolux pushes FOPLP growth
AUO and Innolux are accelerating their expansion beyond traditional display panels, with Innolux's non-display revenue surpassing 51% in 2025, mainly driven by automotive applications...