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    NEWS TAGGED PACKAGING
    Wednesday 2 September 2026
    MediaTek pushes advanced packaging and supply chain to keep pace with AI
    Speaking at the 3DIC Global Summit at SEMICON Taiwan 2026, MediaTek general manager T.Y. Lau revealed the publicly disclosed cost structure of the B200 accelerator, saying that after...
    Wednesday 2 September 2026
    Marvell sees silicon photonics scaling from late 2027, with Taiwan and TSMC at the center
    Marvell SVP and chief technology officer Radha Nagarajan offered a clearer timeline for the commercialisation of co-packaged optics, or CPO, during a media briefing at SEMICON Taiwan...
    Wednesday 2 September 2026
    Hardware isn't the problem — TSMC exec flags software, substrate gaps in 3D IC
    Speaking at the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA) Global Summit on September 1, Jun He, TSMC Vice President of Advanced Packaging Technology and Service, noted that...
    Wednesday 2 September 2026
    AI demand push expands wafer industry's growth outlook
    AI is reshaping demand well beyond chips, and GlobalWafers chair Doris Hsu said this shift is lifting the strategic importance of silicon wafers across the semiconductor supply chain...
    Wednesday 2 September 2026
    Taiwan materials makers see new opening in chip packaging shift
    Taiwan's semiconductor materials suppliers are seeking gains from square packaging and co-packaged optics as advanced manufacturing evolves. The changes could help local firms move...
    Wednesday 2 September 2026
    SEMICON Taiwan 2026 signals a broader race for AI-era semiconductor leadership
    SEMICON Taiwan 2026 will draw more than 1,300 companies and 4,300 booths to Taipei from September 2 to 4, setting new records as the industry show expands beyond chipmaking into packaging,...
    Wednesday 2 September 2026
    Apple's M6 and M5 Ultra break rule tying process to chip strength
    Apple has unveiled new Mac mini and Mac Studio models, equipped respectively with its first 2-nanometer chip, the M6, and the four-die M5 Ultra. Most notably, the latest 2-nanometer...
    Wednesday 2 September 2026
    Innolux targets advanced packaging with debut of Chip Last tech
    Driven by the rapid growth of AI, high-performance computing (HPC), and automotive electronics, semiconductor architecture is shifting toward high-efficiency chiplets and heterogeneous...
    Wednesday 2 September 2026
    AI packaging demand surges, ASE EVP identifies two manufacturing bottlenecks
    On the eve of the official opening of SEMICON Taiwan 2026, the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA), initiated by SEMI, TSMC, and ASE, held the 3DIC Global Summit on...
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers

    As AI, high-performance computing (HPC), and advanced packaging continue to move toward higher levels of power integration, chip power consumption is rising rapidly....

    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry

    Taiwan is home to the world's most advanced semiconductor ecosystem. The island produces over 60% of global contract chip manufacturing and dominates key segments from...

    Wednesday 2 September 2026
    Manz Asia Broadens ECD Platform for Mass Panel-Level Packaging

    Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands. As...

    Wednesday 2 September 2026
    Nvidia pushes into HBM base dies as NVHBM battle heats up
    The competition in high-bandwidth memory (HBM) is moving beyond DRAM stack height, bandwidth, and packaging to the base die at the very bottom of the package. As Nvidia pushes its...
    Tuesday 1 September 2026
    Samsung Electro-Mechanics takes glass substrates to Semicon Taiwan
    As AI packages grow larger, the next substrate battleground is rapidly extending from traditional organic materials to glass. Samsung Electro-Mechanics (SEMCO) will make its first...
    Tuesday 1 September 2026
    TSMC delays CoWoS orders as CoPoS plans take shape
    TSMC's reported delay in placing 2027 advanced packaging equipment orders has sparked market speculation that the company sees excess CoWoS capacity ahead. But equipment suppliers...
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    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
    Wednesday 2 September 2026
    Take Control of Your Process: Onto Innovation at SEMICON Taiwan 2026
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