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    TSMC, Intel race to unclog AI's packaging bottleneck
    4min ago
    Advanced packaging emerges as new battleground in AI chip race between Taiwan and US
    Apr 9, 18:45
    AD Technology targets KRW 1 trillion revenue with 2nm CPU platform by 2029-2030
    Apr 9, 18:45
    South Korean panel profits expected to rise despite chipflation
    Apr 9, 18:45
    NEWS TAGGED PACKAGING
    Friday 10 April 2026
    Exclusive: Samsung weighs Vietnam semiconductor testing facility

    According to sources familiar with the matter, Samsung is in discussions with the Vietnamese government...

    Friday 10 April 2026
    AUO eyes CPO and LEO satellites as Innolux pushes FOPLP growth
    AUO and Innolux are accelerating their expansion beyond traditional display panels, with Innolux's non-display revenue surpassing 51% in 2025, mainly driven by automotive applications...
    Thursday 9 April 2026
    Corning's shift into AI server components could reshape data-center energy and supply-chain dynamics
    Corning marks its 175th anniversary in 2026, celebrating a long history of materials innovation that began with contributions to Thomas Edison's light bulb and later the optical fiber...
    Thursday 9 April 2026
    Geopolitics and AI is redrawing the global chip packaging landscape
    The AI computing boom is reshaping where semiconductors get packaged. Geopolitical pressure and supply chain diversification are pushing capacity well beyond its traditional strongholds...
    Wednesday 8 April 2026
    Corning to showcase breakthrough tech at Touch Taiwan 2026
    Corning will present materials and connectivity innovations at Touch Taiwan 2026 in support of global AI infrastructure, semiconductor packaging, and consumer electronics supply chains,...
    Wednesday 8 April 2026
    Intel and Musk's Terafab revive IDM collaboration as chipmaker pushes turnaround
    Intel's industrial ecosystem is converging on a vertically integrated chip model, as Intel joins the Terafab project led by SpaceX, xAI, and Tesla—marking both a revival of the...
    Tuesday 7 April 2026
    FOPLP and WMCM emerge as key to fan-out packaging competitive field
    The advanced packaging market is entering a structural turning point. Among emerging technologies, fan-out packaging has hit a sweet spot between cost and performance, making it a...
    Tuesday 7 April 2026
    Intel challenges TSMC CoWoS as Amazon, Google reportedly explore alternatives

    AI-driven demand is pushing advanced chip packaging to its limits, exposing constraints in TSMC's CoWoS capacity and forcing hyperscalers...

    Tuesday 7 April 2026
    Weekly news roundup: China's special AI chip supply ends; TSMC plans 12 fabs in Arizona
    Below are the most-read DIGITIMES Asia stories from the week of March 30-April 5, 2026:
    Tuesday 7 April 2026
    Tescan Showcase Integrated Failure Analysis Solutions at SEMICON China 2026

    Tescan will showcase its integrated semiconductor failure analysis solutions at SEMICON China 2026, covering key stages from non-destructive testing and defect exposure...

    Monday 6 April 2026
    China 2.5D packaging demand surges, supporting Korean backend equipment growth
    China's semiconductor equipment market is emerging as a critical growth engine for South Korean suppliers, driven by accelerating AI deployment and tighter restrictions on US vendors...
    Saturday 4 April 2026
    Semco raises ABF substrate prices as AI server demand surges
    The explosive growth in artificial intelligence (AI) servers and high-performance computing (HPC) is driving up the value of key components like ABF substrates. With ongoing bottlenecks...
    Thursday 2 April 2026
    Copper price surge drives quarterly lead frame price hikes
    Lead frame packaging suppliers are hiking prices to pass along rising costs sweeping through the semiconductor supply chain. Gold, silver, and copper prices continue to climb sharply,...
    Thursday 2 April 2026
    Ajinomoto faces stakeholder pressure to raise ABF prices
    UK-based fund Palliser Capital announced on March 31 that it has become one of the top 25 shareholders of Ajinomoto and has requested a price increase of more than 30% for its semiconductor...
    Thursday 2 April 2026
    Samsung, SK Hynix reportedly ramp hybrid bonding push for next-gen HBM

    Samsung Electronics and SK Hynix are reportedly stepping up efforts to advance hybrid bonding for next-generation high-bandwidth memory...

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    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook