Slowdowns in handsets and other consumer electronics areas have prompted brand device vendors to accelerate their pace of inventory correction, but the vendors and core chip suppliers...
Taiwan's OSATs are not only facing a notable decline in packaging demand for commodity MOSFET, MCU, PMIC and CMOS image sensors (CIS) for handset and PC applications, but also a situation...
Packaging demand for consumer electronics ICs including commodity MCUs, MOSFETs, lower-end logic ICs and power management ICs (PMICs) has contracted significantly amid lackluster...
IC analysis and inspection lab Material Science Service (MSScorps) is upbeat about its longer-term business prospects, citing brisk demand for advanced packaging and third-generation...
High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive,...
An opening ceremony has been held recently at TSMC's 3DIC R&D center in Japan to mark the completion of cleanroom construction at the facility, according to the Taiwan-based fo...
ASE Technology has obtained packaging orders for power modules used in electric vehicle (EV) charging piles while enjoying a ramp-up in orders for automotive microcontroller units...
Unlike ASE Technology and other first-tier OSATs who still see robust order momentum from their IDM customers, smaller-size players including Greatek Electronics, Lingsen Precision...
Taiwan-based leadframe makers Jih Lin Technology and Shuen Der Industry (SDI) have seen clear order visibility through the end of 2023, buoyed by strong demand for automotive power...
TSMC at the company's annual technology symposium for North America unveiled its next-generation N2 process powered by nanosheet transistors. N2 is scheduled to begin production in...
Chip demand for 5G, AI, and automotive applications continues to grow robustly, but substrates needed to process related chips will remain in short supply until at least 2025, which...
The rising demands of 5G smartphone, electrical vehicles and data centers drive semiconductor components rapid expansion. The industries increase the investments of advanced packaging...
Demand for BT substrates, aQFN leadframes and other IC packaging materials continues ramping up, thanks to robust demand for network chips and devices, according to industry source...
Robust AI and HPC processor orders have boosted TSMC's chip-on-wafer-on-substrate (CoWoS) packaging capacity utilization to nearly 100%, according to industry sources.