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NEWS TAGGED PACKAGING
Monday 12 October 2026
Chinese thermal materials maker SJ Electronics to build US$70 million plant in Penang
PEN SJ Electronics, a subsidiary of China's SJ Electronics, will invest more than US$70 million in an advanced packaging materials and thermal management facility at Batu Kawan Industrial...
Monday 12 October 2026
Sigurd, Winstek align optical testing push as AI demand shifts toward connectivity
Optical communications is becoming a key global bottleneck as AI workloads expand, and Sigurd is positioning itself to benefit. The IC test and packaging company said demand is rising...
Monday 12 October 2026
Former iPhone display plant in Japan reportedly to enter AI chip supply chain
A former iPhone display factory in Mobara, Japan, is set for a new role in the semiconductor supply chain, with Shinko Electric Industries planning to convert the site into a production...
Monday 12 October 2026
Weekly news roundup: Musk's Terafab faces reality check; Samsung HBM4E clears quality validation
This week's (October 5 to October 11, 2026) coverage highlights intensifying efforts to build resilient semiconductor and AI hardware supply chains. Elon Musk's Terafab project faces...
Monday 12 October 2026
India roundup: AI data center buildout accelerates as semiconductor push continues to broaden

India's technology buildout is deepening across semiconductors and AI infrastructure, with chip IP, packaging and equipment initiatives advancing...

Saturday 10 October 2026
TPCA Show 2026 to spotlight AI computing, Unimicron chair keynote
As explosive AI computing demand drives hardware architecture change, Taiwan Printed Circuit Association (TPCA) is set to open its annual flagship event, with the 21st International...
Saturday 10 October 2026
JNTC bets US$259 million on glass substrates ahead of 2028 ramp
South Korea's JNTC plans to invest KRW347 billion (approx. US$259 million) in glass substrate manufacturing as it reports a sharp reduction in copper-filling time for thick glass cores,...
Saturday 10 October 2026
Advanced packaging leads Malaysia's push up the chip value chain as AI reshapes demand, says Yole analyst
Malaysia is moving from traditional semiconductor back-end manufacturing toward higher value-added work, with advanced packaging set to drive growth over the next two to three years,...
Friday 9 October 2026
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
GF said on October 8, 2026, that it has signed a multi-year, US$2 billion manufacturing agreement with TSMC to produce silicon interposers for TSMC's CoWoS ecosystem at its Malta,...
Friday 9 October 2026
Applied Materials, Intel target AI chip bottlenecks with interconnect scaling and Foveros 3D
AI chip manufacturing demands are accelerating development of advanced logic and packaging technologies, prompting Applied Materials and Intel to expand their collaboration on next-generation...
Thursday 8 October 2026
India's chip packaging plants start exporting, but scale, skills, and subsidies test the next phase
India's outsourced semiconductor assembly and test (OSAT) sector has moved from inaugurations to its first export shipments. The challenge now is scale. The new plants are small, still...
Thursday 8 October 2026
Malaysia's chip push: a new island and pressure from Washington and Beijing
Malaysia's plan to climb the semiconductor value chain is colliding with two constraints: a shortage of land in Penang, the heart of its chip industry, and mounting pressure to pick...
Wednesday 7 October 2026
Towa returns strategic chip packaging production to Japan as AI demand accelerates
Towa plans to build a new factory in Kyoto Prefecture to produce assembly and packaging equipment for advanced semiconductors used in artificial intelligence applications.
Wednesday 7 October 2026
Apple Watch sensor demand and InP supply tightness lift TASC's 2H26 outlook
Taiwan-Asia Semiconductor Corporation (TASC) expects a stronger second half of 2026 as new Apple Watch demand lifts sensor orders. The company said weak consumer electronics demand...
Wednesday 7 October 2026
Semicon 2.0 widens focus beyond fabs: Dassault Systèmes pitches virtual twins to India's chipmakers
Dassault Systèmes is pitching its virtual twin software as the link between India's chip design base and the factories and packaging plants now being built under the country's...