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NEWS TAGGED PACKAGING
Wednesday 6 July 2022
IC inspection labs to embrace strong 3Q22
Slowdowns in handsets and other consumer electronics areas have prompted brand device vendors to accelerate their pace of inventory correction, but the vendors and core chip suppliers...
Tuesday 5 July 2022
OSATs cautious in handling contract violations by consumer chips vendors
Taiwan's OSATs are not only facing a notable decline in packaging demand for commodity MOSFET, MCU, PMIC and CMOS image sensors (CIS) for handset and PC applications, but also a situation...
Monday 4 July 2022
Consumer IC packaging demand unlikely to rebound till 1Q23
Packaging demand for consumer electronics ICs including commodity MCUs, MOSFETs, lower-end logic ICs and power management ICs (PMICs) has contracted significantly amid lackluster...
Monday 4 July 2022
Semco to spend more on FCBGA substrate production
Samsung Electro-Mechanics (Semco) has announced plans to spend more on its FCBGA packaging substrate production in South Korea and Vietnam.
Tuesday 28 June 2022
MSScorps sees promising demand for advanced packaging, 3rd-gen semiconductors
IC analysis and inspection lab Material Science Service (MSScorps) is upbeat about its longer-term business prospects, citing brisk demand for advanced packaging and third-generation...
Monday 27 June 2022
Chipmakers focus on heat dissipation in manufacturing process upgrades
High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive,...
Monday 27 June 2022
TSMC completes cleanroom construction at R&D center in Japan
An opening ceremony has been held recently at TSMC's 3DIC R&D center in Japan to mark the completion of cleanroom construction at the facility, according to the Taiwan-based fo...
Friday 24 June 2022
ASE Technology obtains orders for EV charging piles
ASE Technology has obtained packaging orders for power modules used in electric vehicle (EV) charging piles while enjoying a ramp-up in orders for automotive microcontroller units...
Wednesday 22 June 2022
Second-tier OSATs see uncertainty in order visibility for 2H22
Unlike ASE Technology and other first-tier OSATs who still see robust order momentum from their IDM customers, smaller-size players including Greatek Electronics, Lingsen Precision...
Wednesday 22 June 2022
Taiwan leadframe makers enjoy brisk orders for automotive power modules
Taiwan-based leadframe makers Jih Lin Technology and Shuen Der Industry (SDI) have seen clear order visibility through the end of 2023, buoyed by strong demand for automotive power...
Friday 17 June 2022
TSMC debuts N2 process utilizing nanosheet transistors
TSMC at the company's annual technology symposium for North America unveiled its next-generation N2 process powered by nanosheet transistors. N2 is scheduled to begin production in...
Friday 17 June 2022
Substrate-free FOPLP technology gaining ground in advanced packaging market
Chip demand for 5G, AI, and automotive applications continues to grow robustly, but substrates needed to process related chips will remain in short supply until at least 2025, which...
Wednesday 15 June 2022
Panel level packaging boosts massive growth by perceived cost advantage and productivity benefits
The rising demands of 5G smartphone, electrical vehicles and data centers drive semiconductor components rapid expansion. The industries increase the investments of advanced packaging...
Wednesday 15 June 2022
IC packaging materials demand remains strong
Demand for BT substrates, aQFN leadframes and other IC packaging materials continues ramping up, thanks to robust demand for network chips and devices, according to industry source...
Tuesday 14 June 2022
TSMC runs CoWoS packaging lines at nearly full utilization
Robust AI and HPC processor orders have boosted TSMC's chip-on-wafer-on-substrate (CoWoS) packaging capacity utilization to nearly 100%, according to industry sources.