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    Samsung deepens Euclyd ties as startup reportedly reaches test-chip stage
    6min ago
    King Charles tests AI's safety consensus as Nvidia keeps its foot on the accelerator
    11min ago
    CPO raises PCB downgrade concerns but switches stick with M8 CCL
    44min ago
    iPhone 18 Pro sellouts across Taiwan as foldable Duo looms
    47min ago
    Resonac develops 12-inch SiC substrate to target AI and EV demand
    Sep 17, 18:14
    High-end GPUs may be slowing China’s AI compute expansion
    Sep 17, 18:14
    LGES and Samsung SDI ESS orders reportedly fill two years of North America capacity
    Sep 17, 18:14
    Analysis: China's 15th five-year plan spotlights diamond materials for AI cooling
    Sep 17, 18:14
    NEWS TAGGED PACKAGING
    Friday 18 September 2026
    Tata Electronics put 16 MoUs on the record at Semicon India, join hands with Nexperia
    Tata Electronics has attached a headline number to its supplier-recruitment drive at Semicon India 2026 — 16 memoranda of understanding — but only five have been documented...
    Friday 18 September 2026
    Samsung taps Japan for 3.xD chiplet push as packaging race heats up
    Samsung Electronics is deepening its semiconductor ties with Japan as it develops large-area chiplet packaging technologies for high-performance computing and AI processors, tapping...
    Thursday 17 September 2026
    Trumpf eyes glass as AI demand drives packaging innovation
    At the China International Optoelectronic Expo (CIOE), representatives from German laser and plasma generator maker Trumpf offered a glimpse into the company's push to extend its laser...
    Thursday 17 September 2026
    TSMC reconsiders 12-inch equipment donation as Taiwan overhauls scope of research partnership
    TSMC's planned donation of 12-inch equipment is facing changes as the government adjusts the scope of a semiconductor collaboration project, while Taiwan's National Science and Technology...
    Thursday 17 September 2026
    Ardentec, Sigurd race into silicon photonics TIA testing as US client books capacity
    The global optical communications module market continues to grow, and Taiwan's test and packaging companies are moving to capture demand in silicon photonics (SiPh) transimpedance...
    Thursday 17 September 2026
    20 of China's OSATs push into advanced packaging amid EUV curbs
    China is broadening its advanced packaging base as restrictions on leading-edge semiconductor equipment complicate further process-node scaling. The effort now extends beyond the country's...
    Thursday 17 September 2026
    Google reportedly weighs CoWoS backup for 2027 TPU as EMIB-T substrate yields lag
    Google's Humufish TPU project, scheduled to enter mass production by the end of 2027, is set to adopt Intel's EMIB-T advanced packaging technology with support from ASIC partner MediaTek...
    Thursday 17 September 2026
    Intel CEO warns of 2027 memory crunch and tighter CPU supply
    AI infrastructure expansion is turning memory supply into a major bottleneck for the semiconductor industry. Intel CEO Lip-Bu Tan warned that the memory shortage in 2027 could be worse...
    Thursday 17 September 2026
    Charts: Taiwan's chip packaging growth runs deeper than ASE

    Taiwan's back-end semiconductor sector is growing well beyond its largest player. The 24 listed packaging and testing firms tracked...

    Thursday 17 September 2026
    Samsung looks to outside suppliers as HBM boom shifts priorities
    Samsung Electronics has long benefited from a level of vertical integration few technology companies can match, spanning smartphones, memory, chip design, foundry manufacturing and...
    Wednesday 16 September 2026
    India's Eastern state clears SiCSem's SiC unit in SEZ
    The Falta Special Economic Zone unit approval committee has cleared a proposal from SiCSem Private Limited to build an integrated silicon carbide (SiC) device plant near Bhubaneswar,...
    Wednesday 16 September 2026
    Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging
    Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser,...
    Wednesday 16 September 2026
    Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges

    AI, high-performance computing, and advanced packaging are accelerating demand for glass substrates, but smaller through-glass vias...

    Wednesday 16 September 2026
    Samsung reportedly pushes conventional memory modules to partners in Vietnam and India as HBM crowds its back end
    Samsung Electronics is reportedly handing the growth in its commodity memory module business to outside assemblers in Vietnam, India, and the Philippines, a sign of how completely...
    Wednesday 16 September 2026
    Glass substrates, TGV set to reshape 2027 advanced packaging race
    As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...
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    GlobalExhibition
    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Semicon_TW