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NEWS TAGGED PACKAGING
Thursday 6 March 2025
GlobalWafers anticipates return to growth in 2025, no adjustment notice received for US chip subsidies
GlobalWafers, a silicon wafer company that experienced revenue and profit declines in 2024, anticipates a return to growth in 2025. The Taiwan-based company also stated that it has...
Wednesday 5 March 2025
Ardentec to kick off production at new plant in 2Q25
Wafer-probing specialist Ardentec anticipates commencing operations at its new plant in Longtan, northern Taiwan, in the second quarter of 2025.
Tuesday 4 March 2025
Tong Hsing upbeat about optical communications segment, but automotive market outlook remains uncertain
Tong Hsing Electronic, a semiconductor packaging service and substrate provider, has forecast a mid single-digit quarter-over-quarter decline in revenue for the first quarter of 2025...
Tuesday 4 March 2025
Enosemi and Jabil form alliance to advance photonic chip packaging
In a landmark announcement on March 3, Enosemi and Jabil unveiled a sophisticated collaboration to pioneer advanced packaging process technology for Enosemi's cutting-edge photonic...
Monday 3 March 2025
India-based OSAT secures wafer-level packaging technology
RRP Electronics, supported by cricket legend Sachin Tendulkar, has partnered with Deca Technologies to enhance India's semiconductor industry. This collaboration integrates advanced...
Friday 28 February 2025
CCP Contact Probes targets AI chip supply chain with advanced packaging solutions
Benefiting from the booming demand for testing related to artificial intelligence (AI), CCP Contact Probes, a probe development and manufacturing company, has optimized its product...
Thursday 27 February 2025
Daxin Materials boosts semiconductor focus with product expansion
Daxin Materials is making strides in the semiconductor industry by launching five new products in 2024, increasing its production lineup to nine. This expansion is significant as...
Wednesday 26 February 2025
ChipMOS forecasts modest 1Q25 revenue decline; aims to raise utilization
Shih-Jye Cheng, chairman of ChipMOS, a leading memory packaging and testing company, announced that the company's first-quarter revenue is expected to experience modest declines,...
Tuesday 25 February 2025
Panjit eyes 35% automotive growth, plans Vietnam factory
Despite facing headwinds in the overall automotive market, Panjit continues to report impressive growth. Chief Operating Officer Edgar Chen stated that the company aims for an annual...
Tuesday 25 February 2025
AI GPU orders max out TSMC’s CoWoS capacity; IC testing firms booked through 2026
More than 70% of TSMC’s CoWoS-L advanced packaging capacity has already been booked, fueled by strong demand for Nvidia’s Blackwell GPUs. This surge is also driving orders...
Monday 24 February 2025
Faraday's 1Q25 revenue is expected to increase by 150% quarterly, but gross margin may drop to 20%
On February 21, leading ASIC design service and silicon intellectual property (IP) provider Faraday held its earnings call. The company's fourth quarter of 2024 gross margin declined...
Friday 21 February 2025
Reversal of trends in the semiconductor industry (2): A return to vertical integration amid limits of miniaturization
If two competitive strategies within an industry can both become dominant at different times, it is natural for these strategies to shift as industry conditions change.
Thursday 20 February 2025
CWTC targets automotive and consumer electronics markets with new Mini LED tech
CWTC, a leading player in packaging lead frames, has intensified its focus on Mini LED applications in recent years. By the end of 2024, the company is set to enter the South Korean...
Thursday 20 February 2025
Reversal of trends in the semiconductor industry (1): From vertical integration to value chain deconstruction
Over the past 70 years of semiconductor industry development, there has been a significant shift towards deconstructing the industrial value chain into individual value chain nodes...
Thursday 20 February 2025
Xintec expands investment to boost testing capacity, reshapes strategy for growth
Surging demand for artificial intelligence (AI) is pushing TSMC to expand its advanced packaging capacity. As a key testing partner, Xintec—a TSMC-affiliated outsourced semiconductor...