CONNECT WITH US
NEWS TAGGED PACKAGING
Wednesday 6 May 2026
Intel Capital leads QuantWare's US$178 million bet on hyperscale quantum computing ambitions
QuantWare's US$178 million Series B round aims to accelerate the global rollout of larger, industrial-scale quantum processors, promising hyperscale quantum compute through its VIO-40K...
Wednesday 6 May 2026
India approves new semiconductor and Mini/Micro LED projects
India's latest approvals could expand global display and chip sourcing as the country adds Mini/Micro LED GaN fabrication and large-scale packaging capacity. Global manufacturers and...
Wednesday 6 May 2026
GlobalWafers prepares inventory buffer as geopolitical factors push up gallium prices
Semiconductor silicon wafer supplier GlobalWafers said during its May 5 earnings call that it is advancing its next-generation compound semiconductor strategy. In response to advanced...
Wednesday 6 May 2026
Tata Electronics targets US$30B semiconductor buildout to anchor India’s manufacturing push
Tata Electronics is rapidly emerging as one of India's most ambitious bets in the global semiconductor and electronics industry, with a long-term goal of building a US$30 billion business...
Tuesday 5 May 2026
SEMICON SEA 2026: Delta showcases AI-enabled smart manufacturing
Delta Electronics presented its latest AI-enabled smart manufacturing solutions at SEMICON Southeast Asia 2026, underscoring its efforts to advance efficiency, precision, and scalability...
Tuesday 5 May 2026
MediaTek ASIC surge puts 60% revenue share within reach
MediaTek raised its outlook for its application-specific integrated circuit (ASIC) business during its first-quarter 2026 earnings call, signaling stronger growth prospects and sending...
Tuesday 5 May 2026
Univacco eyes 2027 Vietnam plant ramp-up for CPO and advanced packaging materials
Univacco said its Vietnam plant will begin mass production in the second quarter of 2027 as the company moves to position itself in the co-packaged optics and advanced packaging materials...
Tuesday 5 May 2026
Analysis: CoWoS crunch and MediaTek's hire raise a bigger question — can Intel deliver?
The AI chip race is increasingly running into a different kind of limit — not compute, but packaging, as supply constraints around advanced technologies such as CoWoS begin to...
Monday 4 May 2026
ADT lands US AI chip deal using Samsung 4nm
ADTechnology said it has signed a KRW40 billion (US$27.1 million) turnkey contract with a US-based AI fabless company to develop and supply HPC SoC chiplets for AI data-center applications...
Monday 4 May 2026
MediaTek targets US$2B ASIC sales as cloud rivals chase custom-chip capacity
MediaTek has doubled its 2026 revenue target for its application-specific integrated circuit (ASIC) business to US$2 billion, up from US$1 billion, as demand for custom chips continues...
Monday 4 May 2026
L&T Semiconductor Technologies joins imec automotive chiplet program, aiming to shape global vehicle electronics
Larsen & Toubro's semiconductor unit, L&T Semiconductor Technologies, has joined imec's Automotive chiplet Program. The participation is expected to drive collaboration on...
Monday 4 May 2026
Realtek posts surge in revenue as Wi-Fi 7 adoption accelerates
Realtek reported first-quarter results on April 30, saying revenue rose to NT$36.42 billion (US$1.15 billion), driven by early customer pull-in orders that boosted demand into the...
Monday 4 May 2026
SEMICON SEA 2026 highlights Malaysia's push to scale semiconductor assembly, testing and packaging
SEMICON SEA 2026 convened from May 5 to 7 at the Malaysia International Trade and Exhibition Center in Kuala Lumpur to showcase Malaysia's expanding role in the global semiconductor...
Monday 4 May 2026
SPIL buys multiple Nanke plants to boost advanced packaging capacity for AI demand
Siliconware Precision Industries Co., Ltd. (SPIL), a subsidiary of ASE Technology Holding, acquired two Nanke-area plants in 2026 from HannStar Display and its affiliate HannsTouch...
Monday 4 May 2026
GUC and Wiwynn partner for next-generation AI system infrastructure

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced a strategic technical collaboration with Wiwynn, an innovative cloud IT infrastructure provider...