With TSMC commanding the lion's share of foundry orders for data center AI accelerators, second-tier players like UMC, GlobalFoundries (GF), and SMIC are urgently repositioning to...
Broadcom has reportedly scrapped its plan to invest US$1 billion in an assembly, test, and packaging (ATP) facility in Spain. Reuters and Europa Press cited insiders...
Strong demand for artificial intelligence (AI) applications has driven a significant rise in GB200 and ASIC shipments, propelling revenue growth across both upstream and downstream...
Keysight Technologies expects AI and 6G networks to fuel structural growth in the semiconductor verification market that will outpace industry capital expenditure increases, according...
BOE Technology chairman Chen Yanshun revealed at the 2025 BOE Investor Day that the company will pivot toward glass substrate packaging and perovskite solar cell (PSC) technology...
Malaysia's Penang state, home to about 13% of global semiconductor assembly and testing capacity, is positioning itself to capture more advanced chip manufacturing as artificial intelligence...
Materials supplier Niching is aiming to hit record-high revenue this year after strong performance in the first half of 2025, boosted by continued growing demand in the AI, high performance...
Kurt Sievers, the CEO of Dutch semiconductor giant NXP Semiconductors, who is set to officially step down at the end of October 2025, recently visited Shanghai and met with the mayor...
Risks continue emerging one after another as the supply shortage of essential advanced packaging materials from Japan's chemical giant Asahi Kasei continues to escalate.
The global supply of CoWoS, or Chip-on-Wafer-on-Substrate, is tightening as demand for high-performance computing chips in AI applications continues to surge. These chips are simultaneously...
Dr. Chen-Hua Douglas Yu, Vice President of Pathfinding for System Integration and the sole TSMC Distinguished Fellow, officially retired on July 8, 2025, closing a chapter in one...
Hana Technology, a South Korean equipment maker formerly focused on battery solutions, has developed core Through Glass Via (TGV) technology for semiconductor glass substrates, signaling...
Since the end of 2024, a critical shortage of T-Glass has been disrupting the global supply chain for advanced chip packaging. This specialized glass fabric, prized for its low thermal...
Glass substrates are considered one of the key directions for advanced packaging development, especially showing significant potential in high-performance computing (HPC) and data...
