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NEWS TAGGED PACKAGING
Tuesday 20 January 2026
PowerTech and ChipMOS report robust November profits amid strong memory demand
Memory packaging and testing firms PowerTech Technology and ChipMOS Technologies recorded significant profit increases in November 2025, reflecting robust demand in the memory sector...
Tuesday 20 January 2026
Advantest faces three standardization challenges in shift-left testing
The silicon photonics (SiPh) and common packaged optics (CPO) solutions supply chains are emerging this year. Japanese testing equipment maker Advantest says that although optical...
Tuesday 20 January 2026
Samsung reportedly to test EUV tools at Taylor fab in March
Samsung Electronics will reportedly begin test operations of extreme ultraviolet lithography equipment at its Taylor, Texas, fabrication plant in March, ahead of full operations planned...
Tuesday 20 January 2026
Eternal Precision secures position in AI with glass substrate, panel-level packaging equipment
Eternal Precision Mechanics (EPM), a subsidiary of Eternal Materials, made its official market debut on January 16, listing shares at an underwriting price of NT$125 (approx. US$3....
Monday 19 January 2026
Weekly news roundup: memory shortages, packaging power, TSMC's global pivot
Below are the most-read DIGITIMES Asia stories of the week of January 12-18, 2026.
Monday 19 January 2026
Taiwan polarizer firms pivot to medical, semiconductor, and niche markets amid China oversupply
Large-scale capacity expansions in China have led to severe oversupply and price erosion issues in the global polarizer industry, causing Taiwanese firms to struggle as losses mount...
Sunday 18 January 2026
SK Hynix accelerates advanced packaging from Korea to Indiana
SK Hynix plans to invest KRW19 trillion, about US$12.9 billion, to build an advanced semiconductor packaging plant in Cheongju, South Korea, as it moves to secure capacity for AI-driven...
Saturday 17 January 2026
NIAR launches chip-level advanced packaging platform to boost Taiwan's semiconductor edge
As the global semiconductor industry enters the post-Moore's Law era amid surging demand for artificial intelligence (AI) and high-performance computing (HPC), advanced packaging has...
Saturday 17 January 2026
Amkor to close longstanding Japan chip plant as EV demand slows

Amkor Technology, the US-based semiconductor packaging and testing company, said it will close its Hakodate plant in northern Japan by...

Saturday 17 January 2026
Packaging and testing cluster expected to emerge as TSMC Arizona GigaFab expands
During TSMC's first earnings call of 2026, CEO C.C. Wei said that key metrics at its Arizona fabs are approaching the level of advanced manufacturing in Taiwan. Rising demand from...
Friday 16 January 2026
Biwin Storage profit jumps 427% as memory cycle turns
China's domestic memory module maker Biwin Storage Technology has released the A-share market's first major 2025 profit outlook, signalling a sharp earnings rebound as memory prices...
Friday 16 January 2026
Vietnam to set up national semiconductor chip prototyping center
Vietnam's Ministry of Science and Technology has decided to establish a national center for semiconductor chip prototyping, a move aimed at developing high-quality human resources...
Friday 16 January 2026
Top 10 chart: Regenerated wafers and AI-linked packaging lift Taiwan chip materials sector
Taiwan's semiconductor materials sector delivered a mixed performance in December 2025, highlighting a widening gap between advanced and mature segments of the supply chain. Upstream...
Thursday 15 January 2026
TSMC retains pricing power using Apple and AI dual structure
Generative AI is reshaping TSMC's customer structure. While Apple remains TSMC's largest single customer by revenue share, the rapid growth of high-performance computing (HPC) businesses...
Thursday 15 January 2026
Foxconn-HCL semiconductor joint venture to be named India Chip Private Limited
Electronics manufacturing services major Foxconn and India's HCL Group have formally named their semiconductor joint venture India Chip Private Limited, according to a regulatory filing...