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NEWS TAGGED PACKAGING
Wednesday 15 April 2026
Tong Hsing Electronic expects revenue acceleration as fiber optics drives expansion
Tong Hsing Electronic, a Taiwanese semiconductor packaging and substrate manufacturer specializing in CMOS image sensors, said on Monday that optical communication modules have become...
Wednesday 15 April 2026
Taiwan equipment makers ride advanced packaging and SiPh wave
Nvidia is accelerating the commercial rollout of silicon photonics (SiPh) technology, marked by the launch of its Rubin Ultra platform and the gradual establishment of co-packaged...
Wednesday 15 April 2026
Global semiconductor equipment sales hit record US$135B in 2025 as AI-driven investment surges

Global semiconductor manufacturing equipment sales reached a record US$135.1 billion in 2025, rising 15% from US$117.1 billion in 2024,...

Tuesday 14 April 2026
Samsung Electro-Mechanics reportedly to expand AI packaging with MLCC embedded substrate line in Vietnam
As AI chips demand higher performance and denser integration, advanced packaging and substrate technologies have become critical in the semiconductor race. Samsung Electro-Mechanics...
Tuesday 14 April 2026
Glass substrates move toward mass production as Intel, Samsung Electro-Mechanics step up efforts
Glass substrates are entering a critical pre-mass production phase as demand for high-performance AI chips accelerates. As AI workloads require larger chip sizes and higher bandwidth,...
Tuesday 14 April 2026
JCET advances CPO, glass substrates to capture AI packaging demand
JCET, China's leading outsourced semiconductor assembly and test (OSAT) provider, is accelerating its push into advanced packaging, sharpening its position in AI servers, data centres,...
Monday 13 April 2026
Global chip equipment sales reach record US$135 billion as AI drives investment surge

Worldwide semiconductor manufacturing equipment sales rose 15% to a record US$135.1 billion in 2025 from US$117.1 billion a year earlier,...

Monday 13 April 2026
Japan funds AI chip ecosystem around Rapidus

Japan is accelerating efforts to rebuild a domestic advanced semiconductor ecosystem, with Rapidus at the center of a state-backed push...

Monday 13 April 2026
Global chip sales expect to top US$1 trillion in 2026 on AI demand

Taiwan's semiconductor supply chain posted stronger-than-expected results in the first quarter of 2026, as artificial intelligence (AI)...

Monday 13 April 2026
Silicon photonics scaling hits wafer testing bottleneck
AI demand is pushing data transmission to its limits, making 2026 a critical year for silicon photonics (SiPh) and co-packaged optics (CPO) to move into large-scale deployment. The...
Monday 13 April 2026
Weekly news roundup: Shortages spread to MLCCs; SK Hynix reportedly in talks with Microsoft and Google
Below are the most-read DIGITIMES Asia stories from the week of April 6-April 13, 2026:
Monday 13 April 2026
TPK and ASE to launch advanced semiconductor TGV packaging with 3Q26 pilot line
Touch panel maker TPK is partnering with semiconductor packaging giant ASE to enter the advanced through-glass via (TGV) packaging technology sector, focusing on developing glass substrates...
Monday 13 April 2026
FormFactor and MPI vie to break SiPh test bottleneck as ficonTEC reportedly exits
As AI data centers officially enter the silicon photonics (SiPh) era, the industry faces severe challenges in testing accuracy and throughput on the path toward mass production of...
Sunday 12 April 2026
China's Hwatsing ships 1,000th CMP system, targets advanced chip manufacturing growth

Hwatsing Technology has emerged as one of China's most prominent domestic suppliers of chemical mechanical planarization (CMP) equipment,...

Saturday 11 April 2026
ASE leads US$3.4B advanced testing push in Renwu
Global OSAT leader ASE continued its expansion into advanced processes as its subsidiary ASE Test held a groundbreaking ceremony on April 10, 2026, at the Renwu Industrial Park. ASE...