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Monday 4 May 2026
MediaTek targets US$2B ASIC sales as cloud rivals chase custom-chip capacity
MediaTek has doubled its 2026 revenue target for its application-specific integrated circuit (ASIC) business to US$2 billion, up from US$1 billion, as demand for custom chips continues...
Monday 4 May 2026
L&T Semiconductor Technologies joins imec automotive chiplet program, aiming to shape global vehicle electronics
Larsen & Toubro's semiconductor unit, L&T Semiconductor Technologies, has joined imec's Automotive chiplet Program. The participation is expected to drive collaboration on...
Monday 4 May 2026
Realtek posts surge in revenue as Wi-Fi 7 adoption accelerates
Realtek reported first-quarter results on April 30, saying revenue rose to NT$36.42 billion (US$1.15 billion), driven by early customer pull-in orders that boosted demand into the...
Monday 4 May 2026
SEMICON SEA 2026 highlights Malaysia's push to scale semiconductor assembly, testing and packaging
SEMICON SEA 2026 convened from May 5 to 7 at the Malaysia International Trade and Exhibition Center in Kuala Lumpur to showcase Malaysia's expanding role in the global semiconductor...
Monday 4 May 2026
SPIL buys multiple Nanke plants to boost advanced packaging capacity for AI demand
Siliconware Precision Industries Co., Ltd. (SPIL), a subsidiary of ASE Technology Holding, acquired two Nanke-area plants in 2026 from HannStar Display and its affiliate HannsTouch...
Monday 4 May 2026
GUC and Wiwynn partner for next-generation AI system infrastructure

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced a strategic technical collaboration with Wiwynn, an innovative cloud IT infrastructure provider...

Monday 4 May 2026
Holtek raises low-margin MCU prices, expands AI server cooling and optical comms
Microcontroller (MCU) maker Holtek announced it has raised prices on low-margin MCUs following wafer foundry and packaging cost hikes in China at the end of 2025. This price adjustment...
Monday 4 May 2026
AI chip demand ignites embedded substrate race among Samsung, Ibiden, Unimicron
Samsung Electro-Mechanics (Semco) has moved early to commercialize embedded semiconductor substrates, but the window is rapidly closing as Japan's Ibiden and Taiwan's Unimicron prepare...
Saturday 2 May 2026
MediaTek taps retiring TSMC packaging veteran to strengthen foundry ties, not to bridge to Intel
Chen-Hua Douglas Yu, one of the six R&D leaders known inside TSMC as the "six knights," and a central figure in the foundry's advanced packaging development, has joined MediaTek...
Friday 1 May 2026
KLA 3Q26: AI chip demand drives process control, guidance fails to clear bar
KLA Corporation's fiscal 3Q26 results underscore a familiar pattern in the current semiconductor cycle: strong execution tied to AI infrastructure demand, but investor expectations...
Thursday 30 April 2026
Taiwan OSAT Powertech lifts capex to US$1.6bn, targets AI packaging growth
Memory packaging and testing provider Powertech Technology posted net profit of NT$1.84 billion (US$57 million) for the first quarter of 2026, its second-highest for the same period,...
Thursday 30 April 2026
ASE Technology sees seasonality fade as AI demand drives steady 2026 growth
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held an earnings call on April 29, reporting a robust first quarter of 2026 that broke...
Thursday 30 April 2026
UMC stresses disciplined price hike, Intel deal, and memory foundry rumors draw attention
United Microelectronics (UMC) held its earnings call, where market focus centered on its recent price increases, progress in silicon photonics (SiPh) and advanced packaging, and speculation...
Thursday 30 April 2026
ASE raises 2026 capex to record US$8.5 billion on strong advanced packaging demand
ASE Technology Holding Co. raised its 2026 capex plan to as much as US$8.5 billion as demand for advanced packaging and testing services exceeded expectations, the company said.
Thursday 30 April 2026
China photonics chipmaker Lightelligence lists in HK, CPO commercialization in focus
As generative AI drives a sharp rise in computing demand, traditional electrical interconnect architectures are increasingly constrained by power consumption and density limits. On...