中文網
Taipei
Wed, Oct 20, 2021
12:18
mostly cloudy
27°C
CONNECT WITH US
CHT
Sponsored
NEWS TAGGED PACKAGING
Friday 15 October 2021
Will foundry expansions lead to capacity glut?
Many IDMs and pure-play foundries, including second-tier ones, are all poised to expand their fab capacities sparking concerns that the arrival of the additional capacities could...
Wednesday 13 October 2021
Taiwan backend houses gain shifted orders for MOSFETs from Southeast Asia
Taiwan-based backend houses continue to land shifted orders for MOSFET and other power ICs from Southeast Asia, where operations at fabs run by international IDMs are being disrupted...
Friday 8 October 2021
PTI to post flat or slight revenue growth in 4Q21
Powertech Technology (PTI) is expected to post flat or slight sequential revenue growth in the fourth quarter of 2021, when the backend house will see demand for logic chips outperform...
Thursday 7 October 2021
Packaging leadframe supply stays tight with order visibility clear till 2023
The supply of leadframes for chip packaging has been tight, with the visibility of orders from international IDMs for automotive and industrial applications extended to 2023, according...
Tuesday 5 October 2021
Wire-bonding demand for consumer chips may slow down in 2022
Demand for wire-bonding packaging is likely to slow down in 2022 as backend houses have decided to defer installation of new wire-bonders that have reached them following long delivery...
Friday 1 October 2021
DDI packaging and testing to continue to grow in 2022: Q&A with Chipbond CEO Wu Fei-Jain
Since the outbreak of the COVID-19 epidemic, the global electronics supply chain has been bogged down by the effects of the "broken chain," uneven component supply, and frequent price...
Friday 1 October 2021
ASE Technology launches MicroSiP solution dedicated for wearables
OSAT ASE Technology has launched MicroSiP packaging solutions designed specifically for TWS earbuds and other wearable devices, according to industry sources.
Wednesday 29 September 2021
Notebook supply chain braces for impact of China power restrictions
The notebook supply chain is prepared for the potential impact of China's power cut policy, which has hit local factories in many Chinese provinces, according to industry sources.
Tuesday 28 September 2021
TSMC soon to start equipment move-in at new advanced packaging fab in Taiwan, says report
TSMC is expected to kick off equipment move-in at its new advanced packaging fab in Chunan, northern Taiwan later in the second half of this year, according to a report by Taiwan's...
Tuesday 28 September 2021
Leadframe supply to stay tight through end-2022
Supply of leadframes for wirebonding packaging has been tight and will remain so through the end of 2022, which may be compounded if China's ongoing power curbs extend into fourth-quarter...
Friday 17 September 2021
AiP packaging demand set to be stimulated by new iPhone
With the new-generation iPhones equipped with more antenna-in-package (AiP) modules, AiP packaging demand will be rising along with the iPhone sales, according to industry sources.
Wednesday 15 September 2021
OSATs busy with high-end backend services for new iPhones
Taiwan's OSATs including ASE Technology and Powertech Technology (PTI) are gearing up to extend high-end backend services for new iPhones and other Apple devices, and their momentum...
Tuesday 14 September 2021
DDI backend houses to strengthen high-end testing capacity expansions in 2022
Display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies will remain focused on expanding high-end testing capacity in 2022 to satisfy growing...
Tuesday 14 September 2021
IC packaging materials distributors enjoy strong wire-bonding demand
IC packaging materials distributors continue to see strong demand for wire-bonding operations despite uncertainties facing sales of notebooks, handsets and other end-market devices...
Monday 13 September 2021
China Big Fund stepping up investment in homegrown memory sector
More China-based memory makers will receive cash injections from the government, as China's National IC Industry Investment Fund (Big Fund) steps up its investment in the country's...