Samsung Electronics is preparing to build a 2nm- and 4nm-class foundry fab at its Giheung campus in Yongin, South Korea, to expand production of logic base dies used in high-bandwidth...
FPT has begun trial operations at a semiconductor testing and packaging plant in Vietnam's Bac Ninh province, initially focusing on chip testing as it prepares to expand into packaging...
Taiwan and the Netherlands announced four joint research and development collaborations on November 4 under their bilateral Technology Bridge Program, targeting photonic packaging,...
HCLTech said AI chips will need about 1.5 years to move into mass adoption beyond cloud infrastructure, as the industry develops integrated semiconductor platforms to support large-scale...
MediaTek announced that Navid Shahriari will join the company on November 9 as Senior Vice President, reporting to the General Manager and Chief Operating Officer.
Panasonic Industrial Devices Materials Taiwan's Hukou plant experienced an explosion and fire early on November 4, injuring five employees and leaving two others unaccounted for. The...
South Korea should tie government support for new semiconductor fabs to commitments that benefit domestic chip designers, equipment makers, and packaging suppliers, a state-funded...
China's outsourced semiconductor assembly and test (OSAT) companies entered the fourth quarter with rising sales, high utilization, and an industry-wide price upturn. Their third-quarter...
Competition in the AI application-specific integrated circuit (ASIC) market will extend beyond 2028, industry sources said, with MediaTek, Broadcom, and Marvell competing not only...
Tong Hsing Electronic Industries (THEIL) outlined the latest developments and market trends across its four major product lines of optical communications, ceramic substrates, new semiconductor...
Samsung Electronics chairman Lee Jae-yong visited the company's Advanced Package Lab (APL) in Yokohama, Japan, on November 1, as the chipmaker looks to Japan's semiconductor materials...
Dixon Technologies is pursuing separate partnerships for servers, optical communications, and advanced semiconductor packaging as it seeks a role in AI infrastructure manufacturing,...
As AI and large-scale data center buildouts drive up data transmission speeds, heat is becoming increasingly concentrated in key components. This has drawn attention to ceramic substrates...
Taiwan's semiconductor strength is often described today through leading-edge process nodes, advanced packaging capacity, or its pivotal role in the global AI supply chain. At the...
Taiwan already manufactures much of the physical infrastructure on which the AI boom depends. Advanced logic, packaging, substrates, testing, power delivery, cooling, and server assembly...
