The global semiconductor industry is at an inflection point, split between those who can still shrink transistors and those who can no longer do so. US export controls and the denial...
MediaTek held a pre-Computex 2026 media event in Taipei, Taiwan, on May 29, after which president and COO Joe Chen and CFO and co-COO David Ku spoke with reporters. Ku shared his views...
AuthenX is preparing to showcase a detachable 2D fiber-array unit at COMPUTEX 2026, as the Taiwanese optical-communications company seeks to address packaging and alignment challenges...
United Integrated Services, a key fab-building partner for TSMC and Micron, said the global artificial intelligence (AI) boom is continuing to drive semiconductor capital spending...
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state...
Innolux plans to accelerate its transformation in 2026, with chairman and CEO Jim Hung pointing to three priorities: advanced semiconductor packaging, smart cockpits, and higher-margin...
Xintec, TSMC's packaging and testing unit, is preparing for a broader testing-led expansion that could affect global chip supply chains. The company said capacity gains, new equipment...
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more...
Foxconn chairman Young Liu said the company is preparing to break ground on its advanced packaging plant in France while continuing to explore sovereign-AI opportunities in Africa,...
Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect...
Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply...
South Korean AI chip startup FuriosaAI has announced a partnership with Broadcom to develop a next-generation AI inference platform aimed at large-scale agentic AI deployments, as...
Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence...
Huawei's "Tau (τ) Scaling Law," unveiled at ISCAS 2026 on May 25, has become a global semiconductor flashpoint, drawing scrutiny from financial institutions, media outlets, chip...
