Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.
Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains...
Taiwan's National Science and Technology Council (NSTC) briefed Premier Jung-tai Cho on September 10, 2026, at an Executive Yuan meeting on the Chip-Driven, Taiwan-wide semiconductor...
Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical...
Apple has unveiled its latest iPhone 18 Pro and the A20 Pro, its first 2nm chip. According to Apple's official specifications, the A20 Pro features a six-core CPU, seven-core GPU,...
Chinese electronics manufacturer Shenzhen Kaifa Technology, also known as Shenzhen Kaifa or Kaifa, plans to invest CNY1.85 billion (about US$260 million) to expand high-end memory-chip...
Synopsys has reported a 22% reduction in die area for a neural processing unit (NPU) implemented with its Fusion Compiler design tool on Samsung Foundry's SF2P process, providing a...
Rising demand for generative AI, high-performance computing (HPC), and data center buildouts is pushing the global IC substrate industry into a new phase marked by upgrades in high-end...
ASE Technology Holding's revenue surpassed NT$80 billion (US$2.5 billion) for the first time in August 2026, as AI continued to drive demand for both advanced and conventional semiconductor...
AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.
As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...
AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the...
SK Hynix is signaling a shift in memory design that could matter far beyond South Korea. By adopting logic foundry techniques for 3D DRAM, the company is moving toward a future where...
