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Friday 24 July 2026
India's chip plants face harder test: finding repeat customers
India's first major semiconductor customers are likely to come through existing global supply chains rather than domestic electronics brands immediately replacing imported components,...
Friday 24 July 2026
TSMC's Arizona expansion moves past initial hurdles as fabs and packaging ramp up
Since TSMC announced in 2020 that it would build factories in the US, the market has closely watched how overseas fab costs would affect operations. TSMC's long-running Arizona buildout...
Friday 24 July 2026
Rapidus expands Hokkaido chip hub with packaging and analysis

Rapidus is expanding the semiconductor development and production network around its Chitose, Hokkaido foundry, adding chip analysis...

Friday 24 July 2026
Amkor, Nvidia widen AI packaging partnership as US capacity expands
Amkor Technology has deepened its partnership with Nvidia to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms...
Friday 24 July 2026
Samsung to break ground on Onyang HBM expansion in October, targets 2029 production
Samsung Electronics plans to break ground in October 2026 on a KRW 1.3 trillion (approx. US$884 million) expansion of its Onyang semiconductor packaging site in South Korea, targeting...
Thursday 23 July 2026
SK Hynix speeds P&T7 cleanroom rollout, keeps overall budget at KRW19 trillion
SK Hynix's board approved approximately KRW 7.09 trillion (approx. US$4.83 billion) in facility investment on July 22 to accelerate construction of its P&T7 advanced packaging...
Thursday 23 July 2026
Commentary: Intel must show real AI orders to prove its turnaround
Agentic AI is rapidly gaining traction worldwide, while cloud giants and Anthropic are accelerating spending on AI infrastructure. That surge is pulling CPU demand back to the center...
Wednesday 22 July 2026
CPO commercialization opens new SiPh packaging race for Taiwan OSATs

Exploding demand for AI server computing power is pushing data-center architectures to upgrade at a faster pace, and the traditional...

Wednesday 22 July 2026
HKC invests US$590M in advanced chip packaging to escape the LCD cycle

HKC, the world's third-largest LCD panel supplier, plans to invest CNY4 billion (approx. US$590 million) in a 12-inch chip packaging and...

Wednesday 22 July 2026
SK Hynix denies report it is pursuing deal for Intel's Ohio fab

SK Hynix said in a July 22 disclosure that it had neither pursued nor decided on an acquisition of Intel's under-construction semiconductor...

Wednesday 22 July 2026
Chinese equipment makers win early production orders as TGV packaging moves beyond the lab

Chinese semiconductor equipment suppliers are beginning to secure production orders for through-glass via (TGV) manufacturing tools,...

Wednesday 22 July 2026
Intel and Fortinet deepen collaboration on new security processor

Intel and Fortinet have expanded their long-standing partnership to develop the Fortinet Security Processor 6 (SP6), a move expected...

Wednesday 22 July 2026
WAIC 2026: Enflame debuts China's first glass-based CoPoS AI chip sample

Chinese AI chip developer Enflame said at the World Artificial Intelligence Conference (WAIC) 2026 that it had jointly showcased an AI chip...

Wednesday 22 July 2026
AI infrastructure spending is reshaping Southeast Asia's PCB supply chain

Rising investment in AI servers, high-speed networking, and satellite communications is accelerating a shift in Southeast Asia's electronics...