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NEWS TAGGED PACKAGING
Tuesday 27 October 2026
AMD, Nvidia target substrate capacity amid 4x expansion constraints
AMD and Nvidia have separately invested in supply-chain capacity expansion, making substrates, packaging, and testing key priorities as AI demand diversifies. The moves show that chipmakers...
Tuesday 27 October 2026
Vietnam's first fab reportedly faces doubts over 2027 target
Vietnam's first wafer fab may miss its 2027 trial-production target, Reuters reported on October 26, citing concerns about project execution and equipment procurement. Developer...
Tuesday 27 October 2026
Tamil Nadu adds independent chip subsidy route as Indian states vie for investment
India's semiconductor drive has largely been led by New Delhi, which selects projects for large central incentives while state governments add their own packages of land, infrastructure...
Tuesday 27 October 2026
Amkor turns to customer prepayments as global packaging investment accelerates
Amkor Technology is using customer prepayments and longer-term commitments to support an expanding manufacturing network across the US, South Korea, and Vietnam, as demand for advanced...
Tuesday 27 October 2026
Amkor gross margin climbs to 18.3% as computing mix offsets consumer weakness
Amkor Technology's latest quarter shows how a shift toward advanced packaging can strengthen profitability even when overall sales barely grow. Computing and automotive demand lifted...
Tuesday 27 October 2026
Cheng Mei develops materials for advanced packaging glass substrates
As advanced packaging shifts toward large-size glass substrates, Cheng Mei Materials Technology is developing materials to address warpage, heat resistance, and drilling challenges...
Monday 26 October 2026
Interview: From afterthought to bottleneck, circuit boards move to the heart of AI hardware
In the era of AI and high-performance computing (HPC), the once-separate worlds of chip design, packaging, and circuit boards are converging. According to the Global Electronics Association,...
Friday 23 October 2026
Semco's 61-week MLCC lead times give suppliers upper hand in AI supply chain
Samsung Electro-Mechanics (Semco) is gaining pricing power as AI server demand extends multilayer ceramic capacitor (MLCC) lead times beyond a year. Shortages now span consumer, automotive...
Friday 23 October 2026
TSMC advances CoPoS packaging at Taoyuan Longtan site
TSMC's Longtan Science Park Phase 3 in Taoyuan is restarting after nearly three years of delays, with Taiwan's National Development Council approving its development plan on September...
Friday 23 October 2026
JCET's AI profit surge sets up US$2.73 billion advanced packaging expansion
JCET Group lifted third-quarter revenue 13.53% year-over-year to CNY11.43 billion (approx. US$1.71 billion) and net profit attributable to shareholders 59.99% to CNY773 million. For...
Friday 23 October 2026
UMC, AP Memory advance AI chip power delivery with validated DTC silicon capacitors for advanced packaging
UMC and AP Memory announced a technology and manufacturing partnership on October 22 to develop next-generation power delivery solutions for AI data centers, combining UMC's deep trench...
Friday 23 October 2026
SK Hynix reportedly engages suppliers to bring 30% more efficient iHBM cooling to HBM5 production

SK Hynix is reportedly working with materials and equipment suppliers to commercialise its next-generation iHBM cooling technology, targeting a...

Thursday 22 October 2026
ADEPT Taiwan holds inaugural in-person meeting as PLP and substrate standardization efforts gain momentum
The Advanced Electronic Packaging Technology (ADEPT) committee under the Global Electronics Association continues to expand its presence in Taiwan.
Thursday 22 October 2026
Why Terafab approached South Korean suppliers first
Elon Musk is moving ahead with Terafab, as Tesla and SpaceX reportedly negotiate with about 10 South Korean semiconductor materials, components, and equipment suppliers. The discussions...
Thursday 22 October 2026
BOS, LG, and HANA Micron team up on Korean automotive chiplets
BOS Semiconductors is partnering with LG Electronics and HANA Micron to develop and commercialize chiplet-based automotive semiconductors in South Korea, connecting domestic AI chip...