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    Exemption that shields US$143 billion of US server imports is now on the table
    19min ago
    Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production
    32min ago
    MCE expands auto electronics capacity to defend Malaysia's domestic market
    Aug 27, 18:24
    China took more than 70% of global battery market in 1H26
    Aug 27, 18:24
    NEWS TAGGED PACKAGING
    Friday 28 August 2026
    Exclusive: IC design faces wire bonding bottleneck in 2027
    Surging AI chip demand continues to outstrip TSMC's advanced packaging capacity. At the same time, massive AI server shipments are driving up demand for CPUs, networking equipment,...
    Friday 28 August 2026
    SK Hynix breaks ground on US$4 billion Indiana plant that will package, not make, HBM
    SK hynix broke ground on August 27 on a US$4 billion advanced packaging plant in Purdue Research Park, its first US high-bandwidth memory (HBM) site.
    Thursday 27 August 2026
    HBM hybrid bonding delayed by 300°C heat and CMP dishing
    As high-bandwidth memory (HBM) stack counts continue to rise, the industry originally anticipated that hybrid bonding (HB), a next-generation packaging solution, would be officially...
    Thursday 27 August 2026
    SK Hynix questions PIM as thermal, packaging limits constrain HBM
    South Korean memory rivals Samsung Electronics and SK Hynix are taking fundamentally different routes to solve HBM performance bottlenecks. While Samsung frames processing-in-memory...
    Thursday 27 August 2026
    AMD, Broadcom book most of Powertech's FOPLP capacity ahead of 2027 ramp
    Powertech Technology (PTI) is preparing to move its fan-out panel-level packaging (FOPLP) technology into mass production by mid-2027. AMD and Broadcom are backing demand, and most...
    Thursday 27 August 2026
    Google, MediaTek embrace advanced packaging diversification
    Google and MediaTek are moving toward advanced packaging diversification, as Intel's embedded multi-die interconnect bridge (EMIB) gains traction after Google's TPU was confirmed to...
    Thursday 27 August 2026
    India's CG Power targets 70% utilization at larger semiconductor packaging plant
    CG Power and Industrial Solutions is targeting 70% utilization at its larger semiconductor packaging facility within about four years, with the unit potentially generating around US$500...
    Thursday 27 August 2026
    HTSI targets AI chip demand with SiPh, CPO, packaging push
    Hermes Testing Solutions (HTSI) said revenue for the first seven months of 2026 reached NT$2.7 billion (US$83.8 million), up 128.2% year-over-year and already exceeding its full-year...
    Thursday 27 August 2026
    Nvidia reportedly shifts HBM4 mix toward 8-high as memory supply stays tight

    Nvidia has reportedly asked Samsung Electronics and SK Hynix to increase the share of 8-high products...

    Thursday 27 August 2026
    Samsung Galaxy A1 DDI packaging shifts to Chipbond
    Rising gold prices are squeezing Samsung Electronics' entry-level smartphone supply chain, with South Korean media reporting that back-end packaging and testing orders for display...
    Thursday 27 August 2026
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026

    Global technology and innovation leader ASMPT will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, taking place from September 2 to 4 in Taipei. At...

    Thursday 27 August 2026
    Beijing's AI4Chip plan puts AI to work on EDA, fabs, advanced packaging
    Beijing is extending artificial intelligence deeper into semiconductor production, targeting chip design, wafer fabrication, packaging, testing, equipment, and materials under what...
    Thursday 27 August 2026
    AI glass substrate race shifts toward reliability and mass production
    The competition to develop glass substrates for artificial intelligence (AI) semiconductor packaging is intensifying, with Japanese and South Korean manufacturers pursuing different...
    Wednesday 26 August 2026
    TSMC packaging shift could boost AMD CoWoS share and trim Nvidia's allocation
    Morgan Stanley said TSMC's advanced packaging allocation is expected to shift in 2027, as processor demand tied to agentic AI lifts AMD's CoWoS usage and reduces Nvidia's share. The...
    Wednesday 26 August 2026
    Google's TPU v10 turns multi-vendor, deepening MediaTek's ASIC role
    Google's expanding list of TPU partners has sparked widespread industry discussion, centering on whether current IC design suppliers Broadcom and MediaTek will see their orders imp...
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    BIZ FOCUS
    Aug 27, 08:00
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
    Tuesday 25 August 2026
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Monday 24 August 2026
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
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