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    AI optical communication and automotive demand boost TXC, Taitien quartz component sales in 1Q26
    23min ago
    SpaceX reportedly files confidential IPO plans in potential record-breaking offering
    36min ago
    Commentary: Apple eyes iPhone camera, Vision Pro, and CarPlay advances with new CEO in charge
    43min ago
    NEWS TAGGED PACKAGING
    Wednesday 22 April 2026
    SJSemi's blockbuster IPO reorders China's chip packaging landscape
    Shares of SJSemi surged on their trading debut on Shanghai's SSE STAR Market on Monday, underscoring investor enthusiasm for advanced chip packaging technologies as demand for artificial...
    Wednesday 22 April 2026
    Micron's Sanand ramp shifts India chip debate from milestone to manufacturing system
    Micron Technology's Sanand assembly, test, marking, and packaging plant has given India something it lacked until recently: a live semiconductor manufacturing operation with global...
    Monday 20 April 2026
    Odisha to break ground on India's first advanced 3D chip packaging unit
    Odisha broke ground on India's first advanced 3D chip packaging unit on April 19, 2026, a move that could reshape global semiconductor supply chains by adding high-end heterogeneous...
    Sunday 19 April 2026
    Corning leads glass substrate race as South Korea's KCC and LX Glass face steep challenges
    Glass core substrates, valued for their low dielectric loss and warpage reduction, are key to next-generation advanced semiconductor packaging. In South Korea, traditional glass makers...
    Sunday 19 April 2026
    ASE's CoPos advanced packaging accelerates as Skytech and CMIt boost equipment deliveries
    AI and high-performance computing (HPC) are driving increasingly stringent chip performance demands, marking a pivotal shift in advanced packaging technology from traditional wafers...
    Friday 17 April 2026
    TSMC revises advanced process and packaging strategy
    TSMC chairman C.C. Wei emphasized persistent capacity shortages during the company's earnings call, noting that 3nm technology accounted for about 25% of first-quarter 2026 revenue...
    Friday 17 April 2026
    Taiwan's OSAT expansion could tighten global test capacity and raise costs
    Taiwan's outsourced semiconductor assembly and test industry is expanding rapidly, driven by AI, high-performance computing, and memory demand. Global supply chains may face tighter...
    Friday 17 April 2026
    Apple highlights record progress in recycled materials across products
    Apple has announced what it describes as its highest-ever use of recycled materials across its product lineup, underscoring continued efforts to reduce environmental impact and move...
    Friday 17 April 2026
    Tongfu Microelectronics profit jumps on AI chip packaging, AMD demand

    Tongfu Microelectronics posted strong 2025 results, supported by AI and automotive chip demand, while reinforcing its position in the...

    Friday 17 April 2026
    TSMC chairman C.C. Wei denies customer favoritism regarding tight 1Q26 capacity
    TSMC delivered an above-expectations financial performance in the first quarter of 2026 and remains optimistic about continued strong demand for advanced process technologies entering...
    Friday 17 April 2026
    With chip limits near, focus shifts to packaging and integration

    As the rise of artificial intelligence (AI) pushes semiconductor performance toward new limits, the industry is confronting a fundamental...

    Thursday 16 April 2026
    Global Expansion of 2.5D/3D Packaging: Strategic Moves in the US, Asia, and Beyond

    Introduction

    Thursday 16 April 2026
    US–Iran tensions add another reason to rethink plastic-heavy, disposable supply chains
    The ongoing US–Iran conflict is raising global costs for raw materials and energy, leading to higher prices and shortages across sectors such as plastic packaging and consumer...
    Wednesday 15 April 2026
    Tong Hsing Electronic expects revenue acceleration as fiber optics drives expansion
    Tong Hsing Electronic, a Taiwanese semiconductor packaging and substrate manufacturer specializing in CMOS image sensors, said on Monday that optical communication modules have become...
    Wednesday 15 April 2026
    Taiwan equipment makers ride advanced packaging and SiPh wave
    Nvidia is accelerating the commercial rollout of silicon photonics (SiPh) technology, marked by the launch of its Rubin Ultra platform and the gradual establishment of co-packaged...
    1/48 pages
    TechForum0520
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook