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    Samsung reportedly shifts GaN strategy toward foundry as device business stalls
    May 21, 18:53
    NEWS TAGGED PACKAGING
    Friday 22 May 2026
    AMD deepens China packaging alliance with TF-AMD expansion in Suzhou
    AMD CEO Lisa Su appeared in Suzhou on May 20 to attend the launch ceremony for the second-phase expansion of Suzhou TF-AMD Semiconductor Co. (also known as Suzhou Tongfu Advanced Microelectronics),...
    Friday 22 May 2026
    Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys back US$125M UCLA Semiconductor Hub
    Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys are partnering with UCLA Samueli to create a US$125 million Semiconductor Hub to accelerate research and workforce...
    Friday 22 May 2026
    AP Memory IPD enters Intel's EMIB supply chain, shipments set for 2Q26
    Specialty memory design company AP Memory is positioning itself to capture growth momentum from stack silicon capacitors (S-SiCap). The company said its discrete S-SiCap products,...
    Friday 22 May 2026
    Samsung's quiet Taiwan play: Pairing memory with foundry to chip away at TSMC
    Samsung Electronics chairman Lee Jae-yong quietly visited Taiwan on May 21 and met with MediaTek CEO Rick Tsai, according to semiconductor supply chain sources, in a move aimed at...
    Friday 22 May 2026
    AMD backs Taiwan EFB packaging chain to cut CoWoS reliance

    AMD said it plans to invest more than US$10 billion in Taiwan's technology ecosystem to accelerate AI infrastructure development, while...

    Friday 22 May 2026
    Lam Research's Salzburg PLP center signals push toward panel production, but hurdles remain for large-scale adoption
    Lam Research has opened a Panel-Level Packaging (PLP) Innovation Excellence Center in Salzburg, Austria, underscoring the company's move deeper into advanced packaging as customers...
    Friday 22 May 2026
    TSMC supply chain material maker AMC rides AI packaging yield boom

    Alliance Material Co. (AMC), a Taiwan-based advanced semiconductor materials supplier, said its balance film anti-warpage material has...

    Friday 22 May 2026
    BOE, Corning target glass substrates for AI chip packaging

    BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the...

    Friday 22 May 2026
    AMD deepens Taiwan supply chain ties with US$10B-plus push
    AMD CEO Lisa Su arrived in Taiwan on May 20, 2026, on a private jet and largely followed the same itinerary as her April 2025 visit, including a meeting with TSMC, a technology forum...
    Friday 22 May 2026
    Lam Research launches PLP Center of Excellence, replacing wafers with panels
    Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology...
    Thursday 21 May 2026
    AMD commits over US$10 billion to Taiwan ecosystem to expand AI packaging and infrastructure capacity
    AMD said on May 21 that it plans to invest more than US$10 billion across Taiwan's semiconductor ecosystem to deepen strategic partnerships and expand advanced packaging capacity for...
    Thursday 21 May 2026
    Five weak links India Semiconductor Mission 2.0 must fix
    India's first semiconductor mission brought fabs, OSAT units, and chip projects into the policy pipeline. Its second phase is being shaped around a harder question: whether India can...
    Thursday 21 May 2026
    AI chip boom strains ABF substrate supply chain
    AI is shifting the semiconductor supply chain's next bottleneck from wafer fabrication and HBM memory to ABF substrates — a lower-profile but critical packaging material used...
    Thursday 21 May 2026
    SK Hynix reportedly shifts Cheongju mask fab toward HBM yield push
    SK Hynix is reportedly moving to reshape part of its Cheongju campus around wafer testing, a shift that underscores how high-bandwidth memory, or HBM, is putting new pressure on the...
    Thursday 21 May 2026
    OSE targets AI server SMT growth as memory demand lifts outlook
    Orient Semiconductor Electronics (OSE) said that strong memory market demand is lifting its outlook and expanding its role in the memory supply chain, while also strengthening its...
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    BIZ FOCUS
    Apr 28, 08:00
    AI anti-fraud solution wins virtual asset security hackathon
    Monday 27 April 2026
    SK hynix receives 2026 IEEE Corporate Innovation Award
    Monday 27 April 2026
    Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
    Friday 24 April 2026
    NewPower Named HPE 2026 Partner of the Year
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook