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NEWS TAGGED PACKAGING
Tuesday 9 June 2026
PCL Technologies targets CPO as Penang plant nears completion
Optical communications maker PCL Technologies is expanding into high-power laser packaging, with its new Malaysia plant on track to pass customer certification by the end of 2026....
Tuesday 9 June 2026
Commentary: COMPUTEX 2026 shows AI race moving from GPUs to ecosystems
One of the clearest shifts at COMPUTEX 2026 was that suppliers across the AI supply chain were no longer talking only about GPUs. The conversation has moved toward how CPUs, GPUs,...
Tuesday 9 June 2026
TSMC capacity crunch pushes Google, Nvidia closer to Intel
TSMC's AI capacity crunch is giving Intel its clearest opening in years to re-enter the most advanced chipmaking race, with Google and Nvidia exploring Intel as a potential backup...
Tuesday 9 June 2026
SK Hynix orders Hanmi equipment for HBM4 capacity buildout
SK Hynix has ordered new HBM4 production equipment from Hanmi Semiconductor, a clear signal that the South Korean memory maker is moving deeper into capacity expansion as Nvidia demand...
Tuesday 9 June 2026
MAtek posts record May revenue as AI chip power and 2-nanometer nodes drive testing demand
MAtek reported May 2026 revenue of NT$544 million (US$17.23 million), a 26.87% increase year-over-year and a 0.69% increase month-over-month, marking its third consecutive month of...
Tuesday 9 June 2026
AI supply chain shortages shift from chips to equipment
As four major North American CSPs step up AI infrastructure spending, global semiconductor output forecasts keep rising. But the AI demand surge is also exposing hidden supply-chain...
Tuesday 9 June 2026
AI chip race lifts semiconductor equipment sales to record US$36.55bn
Global semiconductor equipment sales hit a record first-quarter 2026 high, as the AI buildout lifted investment in leading-edge logic, DRAM and advanced packaging.
Monday 8 June 2026
Apple M5 Pro teardown points to chiplet strategy shift
Apple's M5 Pro signals a broader shift in laptop processors, with implications for global device makers, developers, and AI users. A teardown suggests Apple is combining chiplet-style...
Monday 8 June 2026
Weekly news roundup: Taiwan ecosystem strengthens AI chip supply chain as MediaTek, Nvidia deepen cooperation
Below are the most-read DIGITIMES Asia stories from the week of June 1-7, 2026:
Monday 8 June 2026
LG Innotek expands Vietnam operations for AI packaging boom
LG Innotek is accelerating its push into advanced semiconductor packaging, announcing plans to expand its substrate manufacturing operations in Vietnam as it seeks to transform the...
Monday 8 June 2026
India roundup: India state targets chip packaging hub as India courts Taiwanese electronics investment

Andhra Pradesh is positioning itself as a semiconductor packaging hub, focusing on an entry...

Monday 8 June 2026
Largan posts 43% year-on-year May revenue rise
argan Technology reported consolidated May revenue of NT$4.593 billion on June 5, a 14% decline from April and a 43% increase from May 2025. First five-month revenue reached NT$25.495...
Sunday 7 June 2026
JCET opens 3D packaging plant to target AI power modules, CPO demand
JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing,...
Sunday 7 June 2026
BOE says glass-based packaging substrate pilot line has yet to reach mass-production yield

BOE Technology Group's push into glass-based packaging substrates remains short of mass production, even as the Chinese display maker...

Friday 5 June 2026
AI demand strains PCB supply chains, lead times stretch past 20 weeks
Explosive demand for artificial intelligence is widening supply chain bottlenecks for global electronics makers, with shortages now reaching from advanced chips and packaging into...