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Tuesday 9 June 2026
MAtek posts record May revenue as AI chip power and 2-nanometer nodes drive testing demand
MAtek reported May 2026 revenue of NT$544 million (US$17.23 million), a 26.87% increase year-over-year and a 0.69% increase month-over-month, marking its third consecutive month of...
Tuesday 9 June 2026
AI supply chain shortages shift from chips to equipment
As four major North American CSPs step up AI infrastructure spending, global semiconductor output forecasts keep rising. But the AI demand surge is also exposing hidden supply-chain...
Tuesday 9 June 2026
AI chip race lifts semiconductor equipment sales to record US$36.55bn
Global semiconductor equipment sales hit a record first-quarter 2026 high, as the AI buildout lifted investment in leading-edge logic, DRAM and advanced packaging.
Monday 8 June 2026
Apple M5 Pro teardown points to chiplet strategy shift
Apple's M5 Pro signals a broader shift in laptop processors, with implications for global device makers, developers, and AI users. A teardown suggests Apple is combining chiplet-style...
Monday 8 June 2026
Weekly news roundup: Taiwan ecosystem strengthens AI chip supply chain as MediaTek, Nvidia deepen cooperation
Below are the most-read DIGITIMES Asia stories from the week of June 1-7, 2026:
Monday 8 June 2026
LG Innotek expands Vietnam operations for AI packaging boom
LG Innotek is accelerating its push into advanced semiconductor packaging, announcing plans to expand its substrate manufacturing operations in Vietnam as it seeks to transform the...
Monday 8 June 2026
India roundup: India state targets chip packaging hub as India courts Taiwanese electronics investment

Andhra Pradesh is positioning itself as a semiconductor packaging hub, focusing on an entry...

Monday 8 June 2026
Largan posts 43% year-on-year May revenue rise
argan Technology reported consolidated May revenue of NT$4.593 billion on June 5, a 14% decline from April and a 43% increase from May 2025. First five-month revenue reached NT$25.495...
Sunday 7 June 2026
JCET opens 3D packaging plant to target AI power modules, CPO demand
JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing,...
Sunday 7 June 2026
BOE says glass-based packaging substrate pilot line has yet to reach mass-production yield

BOE Technology Group's push into glass-based packaging substrates remains short of mass production, even as the Chinese display maker...

Friday 5 June 2026
AI demand strains PCB supply chains, lead times stretch past 20 weeks
Explosive demand for artificial intelligence is widening supply chain bottlenecks for global electronics makers, with shortages now reaching from advanced chips and packaging into...
Friday 5 June 2026
US targets China's PCB grip as AI and defense supply risks mount
As demand for artificial intelligence (AI) computing expands rapidly, market attention has long centered on GPUs, high-bandwidth memory (HBM), and advanced packaging. However, printed...
Friday 5 June 2026
Marvell says SerDes and packaging are key hurdles in switch chip development
Marvell says the next gains in switch chip performance will depend on faster SerDes and better packaging — issues that affect network capacity, signal quality, and cost across...
Friday 5 June 2026
Commentary: Memory boom driven by DRAM now, but HBM will decide future
AI demand is fueling a broad semiconductor upswing and pushing the memory industry into what many see as a long-awaited super-cycle. Samsung Electronics and SK Hynix have both reported...
Thursday 4 June 2026
TSMC shareholders clear record 2025 results, putting AI capacity roadmap in focus
TSMC shareholders approved the company's 2025 business report and financial statements at its 2026 annual shareholders' meeting on June 4, giving investors a formal look at a year...