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    Taiwan's cement giant eyes postwar rebuilding demand
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    MediaTek’s TPU orders held steady as supply chain capacity became the key bottleneck
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    Four glass makers converge on 510x515mm substrate, hinting at TSMC’s next move
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    China's humanoid robot shipments topped 19,000 in 1H26
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    NEWS TAGGED PACKAGING
    Wednesday 30 September 2026
    Apple A20 Pro ditches PoP memory packaging for WMCM
    Apple's A20 Pro chip has dropped traditional package-on-package (PoP) packaging in favor of Wafer-Level Multi-Chip Module (WMCM), with memory and processor dies laid out side by side...
    Wednesday 30 September 2026
    ASE Technology buys Singapore factory for AI chip testing expansion
    ASE Technology Holding's Singapore unit has approved the purchase of a factory in Yishun Industrial Park from Dutch LED maker Lumileds Singapore for about US$68.44 million, or about...
    Wednesday 30 September 2026
    SK Hynix resumes DDR4, DDR5 packaging orders with Winpac
    SK Hynix has resumed outsourcing DRAM packaging to South Korean outsourced semiconductor assembly and test (OSAT) provider Winpac, reviving a supplier relationship that ended in 2023...
    Wednesday 30 September 2026
    AI boom draws display makers into semiconductors with glass core substrates and Micro LED
    AI is driving the semiconductor industry into a new growth cycle while creating opportunities for display companies traditionally centered on panels to move into semiconductors. These...
    Wednesday 30 September 2026
    CXMT's US$5.2 billion buildout deepens China's push for domestic DRAM equipment
    China's largest dynamic random-access memory (DRAM) maker ChangXin Memory Technologies (CXMT) is accelerating a CNY34.9 billion (US$5.2 billion) expansion aimed at chipmaking equipment,...
    Wednesday 30 September 2026
    Foundry 2.0 revenue hits record as growth spreads beyond TSMC
    Global Foundry 2.0 market revenue reached a record US$96.6 billion in the second quarter of 2026, up 25% year-over-year and 11% sequentially, as semiconductor demand tied to data-center...
    Wednesday 30 September 2026
    Linde secures Sanand land as global materials suppliers race to localize for India's first fabs
    India's chip push is drawing the materials layer of the supply chain onshore. With Tata Electronics' Dholera fab and a cluster of packaging plants in Sanand under way, suppliers of...
    Wednesday 30 September 2026
    AMD's Lisa Su reportedly revisiting South Korea in October to deepen HBM4, NPU ties
    Advanced Micro Devices (AMD) CEO Lisa Su is reportedly set to visit South Korea again in October 2026, after her March 2026 trip, which formally launched next-generation AI memory...
    Wednesday 30 September 2026
    GlobalFoundries Singapore capacity utilization tops 90% as silicon photonics expansion hits equipment lead-time bottleneck
    GlobalFoundries (GF) is expanding its Singapore footprint following its acquisition of local silicon photonics foundry Advanced Micro Foundry (AMF), integrating 200mm and 300mm silicon...
    Wednesday 30 September 2026
    Powering Next-Gen AI: Materials Enabling Advanced Packaging's Future

    As artificial intelligence (AI) and high-performance computing (HPC) drive unprecedented demands on semiconductor performance, materials are playing an increasingly critical...

    Tuesday 29 September 2026
    SoftBank subsidiary Saimemory taps Shinko to bring ZAM closer to commercialization
    Saimemory, a SoftBank subsidiary, has brought Shinko Electric Industries into its effort to commercialize Z-Angle Memory (ZAM), adding packaging-substrate, high-density integration...
    Tuesday 29 September 2026
    In global semiconductor race, Singapore bets on critical, mature technologies
    Amid the ongoing restructuring of the global semiconductor supply chain, Singapore is focusing on advanced packaging, heterogeneous integration, silicon photonics, and optical interconnects,...
    Tuesday 29 September 2026
    Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

    At Singapore's Innovate Together 2026 conference on September 25, executives and researchers from A*STAR's Institute of Microelectronics...

    Tuesday 29 September 2026
    Beyond 16 layers: HBM stacks test advanced packaging equipment makers
    At Singapore's Innovate Together 2026 conference on September 25, equipment makers including ASM, ASMPT, and KLA said the challenges facing next-generation advanced packaging are expanding...
    Tuesday 29 September 2026
    SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform

    SK Hynix has validated its HBM5 memory with TSMC's CoWoS packaging, the company said in a September 28 post on its corporate newsroom...

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    AI Memory & Storage: The 5th GMIF2026 Innovation Summit Concludes
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    Powering Next-Gen AI: Materials Enabling Advanced Packaging's Future
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