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Wednesday 5 August 2026
PSMC open to US, Singapore, Malaysia joint ventures as Intel packaging partnership enters mass production

Market interest in whether Taiwan's Powerchip Semiconductor Manufacturing (PSMC) would deepen cooperation with Intel or potentially...

Wednesday 5 August 2026
Manz opens Tainan R&D center for advanced packaging equipment

Manz has applied to establish a branch in the Tainan Science Park and plans to set up an R&D center there for advanced packaging...

Wednesday 5 August 2026
Everlight files third US patent suit over LED flip chip technology
Everlight Electronics filed a new US patent infringement lawsuit against Nichia on July 30 in the Southern Division of the US District Court for the Eastern District of Michigan. The...
Wednesday 5 August 2026
Hanwha Semitech expands packaging tools as TCB turns profitable

South Korean semiconductor equipment maker Hanwha Semitech is expected to begin recognizing revenue from fan-out panel-level packaging...

Wednesday 5 August 2026
Aurona lifts ABF and CCL shipments, eyes capacity expansion in 3Q26

Aurona said shipments of ABF substrate pads and CCL-related packaging materials both rose, extending its growth momentum in the second...

Wednesday 5 August 2026
From chip to grid: OCP CEO George Tchaparian on redefining data center architecture for the AI era
Ahead of the OCP APAC Summit in Taipei, George Tchaparian says co-packaged optics (CPO) gives Taiwan an opportunity to turn its manufacturing and packaging expertise into global...
Tuesday 4 August 2026
China claims 8 in 10 robots worldwide are made at home

China's National Development and Reform Commission (NDRC) said humanoid robots have become a key symbol of the country's emerging manufacturing...

Tuesday 4 August 2026
Taiwan classifies semiconductors, AI as high-energy industries, launches decarbonization project

Taiwan's government has recently begun classifying the semiconductor and AI industries as high-energy consumption industries in recent...

Monday 3 August 2026
Intel offers bonuses to speed up Ohio fab construction and reaches EMIB-T yields of 90%
Intel is awarding bonuses for overtime work as it seeks to complete the construction of its Ohio fab complex by 2031. Meanwhile, the company has made progress on the development of...
Monday 3 August 2026
India advances semiconductor ambitions as Visakhapatnam OSAT plant anchors South India packaging push

India is moving deeper into semiconductor manufacturing with construction beginning on an INR23.87 billion (US$250 million) OSAT facility...

Monday 3 August 2026
Intel EMIB yields hit target, MediaTek eyes 2028 ASIC ramp

MediaTek said at its latest earnings call that its second-generation data-center ASIC product remains on schedule for mass production...

Monday 3 August 2026
India expands chip talent pipeline amid surging global chip demand
India has stepped up efforts to build a larger semiconductor workforce through training, curriculum reform, and industry partnerships. The plan matters beyond India because chip supply...
Monday 3 August 2026
India roundup: R&D hubs, domestic tooling, OSAT investments, and AI hubs are powering India’s chip push

India is expanding its semiconductor ambitions through new R&D centers, indigenous design...

Saturday 1 August 2026
AUO commits US$721M to TGV, glass core and CPO expansion
AUO sold three factories within two days, with disposal gains expected to reach NT$17.7 billion (approx. US$548 million). Chairman Paul Peng said the proceeds would be reinvested in...