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NEWS TAGGED PACKAGING
Friday 1 May 2026
KLA 3Q26: AI chip demand drives process control, guidance fails to clear bar
KLA Corporation's fiscal 3Q26 results underscore a familiar pattern in the current semiconductor cycle: strong execution tied to AI infrastructure demand, but investor expectations...
Thursday 30 April 2026
Taiwan OSAT Powertech lifts capex to US$1.6bn, targets AI packaging growth
Memory packaging and testing provider Powertech Technology posted net profit of NT$1.84 billion (US$57 million) for the first quarter of 2026, its second-highest for the same period,...
Thursday 30 April 2026
ASE Technology sees seasonality fade as AI demand drives steady 2026 growth
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held an earnings call on April 29, reporting a robust first quarter of 2026 that broke...
Thursday 30 April 2026
UMC stresses disciplined price hike, Intel deal, and memory foundry rumors draw attention
United Microelectronics (UMC) held its earnings call, where market focus centered on its recent price increases, progress in silicon photonics (SiPh) and advanced packaging, and speculation...
Thursday 30 April 2026
ASE raises 2026 capex to record US$8.5 billion on strong advanced packaging demand
ASE Technology Holding Co. raised its 2026 capex plan to as much as US$8.5 billion as demand for advanced packaging and testing services exceeded expectations, the company said.
Thursday 30 April 2026
China photonics chipmaker Lightelligence lists in HK, CPO commercialization in focus
As generative AI drives a sharp rise in computing demand, traditional electrical interconnect architectures are increasingly constrained by power consumption and density limits. On...
Thursday 30 April 2026
Amkor advances data center CPU mass production amid manageable supply and cost risks
Amkor, the world's second-largest OSAT provider, recently held its earnings call where CEO Kevin Engel highlighted strong demand for AI and high-performance computing (HPC) chips driving...
Wednesday 29 April 2026
China OSAT leader JCET expands in advanced packaging, profit climbs
China's leading OSAT player, JCET, reported solid first-quarter 2026 results, supported by demand in high-performance computing and automotive electronics, even as the broader semiconductor...
Wednesday 29 April 2026
CPUs reclaim the core of AI architecture as multicore trend tightens substrate supply
Workloads are shifting from training to inference. In this transition, CPUs are regaining a central role in coordinating diverse computing tasks, significantly boosting their importance...
Wednesday 29 April 2026
Analysis: Taiwan's two major panel makers enter semiconductor packaging; CPO and FOPLP become key
Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level...
Tuesday 28 April 2026
Nanya breaks into Nvidia's AI memory ecosystem with LPDDR
Nvidia's next-generation AI platform Vera Rubin is approaching mass production, with a key architectural shift favoring low-power DRAM. Sources familiar with the matter say Nanya Technology...
Tuesday 28 April 2026
Amkor records strong 1Q26, advanced packaging expected to triple YoY
Amkor Technology is off to a record start in 2026. First-quarter revenue hit US$1.68 billion, up 27% from the prior year, driven by record performance in AI data center applications...
Tuesday 28 April 2026
Nvidia says GPU allocation follows first-come, first-served principle, not highest bidder
Nvidia CEO Jensen Huang clarified in an April 2026 interview with Silicon Valley podcast host Dwarkesh Patel that the company allocates GPUs based on a first-come, first-served principle...
Tuesday 28 April 2026
US chip packaging capacity to hit 10% by 2032
The Trump administration continues to push for reshoring the semiconductor industry to the US. As global foundry giants TSMC, Intel, and Samsung Electronics expand advanced manufacturing...
Tuesday 28 April 2026
Wuhan unveils US$38 billion plan; YMTC and XMC lead memory expansion
China's central tech hub Wuhan has unveiled its 2026 major project plan, targeting 355 city-level projects with total investment exceeding CNY260 billion (approx. US$38.1 billion).