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    China chipmakers NAURA, ACMR push self-reliance with acquisitions, HBM tools
    3h 25min ago
    Memory price surge leads to smartphone spec downgrade,Samsung stand to benefit
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    Samsung stabilizes 12-layer HBM3E performance, eye Google TPU supply share increase
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    NEWS TAGGED PACKAGING
    Monday 15 December 2025
    TSMC to expand CoW Orders in 2H26 as OSAT CoWoS-like tech rises
    As major US CSPs are ramping up ASIC development, the capacity gap in TSMC's CoWoS advanced packaging continues to widen. Thus, the rise of "CoWoS-like" capacity by OSAT providers...
    Monday 15 December 2025
    Micron's DDR5 outsourcing ramp redraws memory packaging trajectories through 2026
    Memory demand remains overheated and supply tight, driving upstream manufacturers to lift utilization while majors such as Micron pivot toward customized, higher value-added output...
    Monday 15 December 2025
    Samsung pushes new thermal packaging to win back Qualcomm and Apple

    Samsung Electronics is positioning a proprietary thermal management technology for external clients as it seeks to reclaim foundry market...

    Friday 12 December 2025
    Exclusive: Ex-TSMC R&D VP on advanced packaging and Morris Chang's vision
    Douglas Yu, former TSMC R&D vice president, highlighted the development of TSMC's 3D Fabric platform, including challenges in early adoption and the impact of founder Morris Chang's...
    Friday 12 December 2025
    CPO tech and Taiwan player deployment

    Introduction

    Thursday 11 December 2025
    Ta Liang PCB and advanced packaging orders surge, equipment lead times hit 6 months
    PCB and semiconductor equipment manufacturer Ta Liang Technology reported a surge in orders as AI chip and AI server demand solidifies. Customers have been investing to expand capacity,...
    Wednesday 10 December 2025
    Scientech posts over NT$10B revenue in 11 months, order visibility extends to 2H26
    Advanced packaging equipment and wafer reclaim solutions provider Scientech reported consolidated revenue of NT$958 million (US$30.77 million) in November 2025, up 9% sequentially...
    Wednesday 10 December 2025
    TSMC expands CoWoS capacity with Nvidia booking over half for 2026-27
    Semiconductor equipment suppliers reveal that TSMC and non-TSMC players, including ASE, Amkor, and UMC, are accelerating the expansion of advanced packaging Chip on Wafer on Substrate...
    Tuesday 9 December 2025
    Topco Scientific to showcase key semiconductor materials and equipment at SEMICON Japan
    The SEMICON Japan 2025 exhibition is set to take place in Tokyo from December 17 to 19, 2025, with Topco Scientific (TSC) and its Japanese subsidiary Shunkawa participating alongside...
    Tuesday 9 December 2025
    Google TPU demand remains strong, but CoWoS and memory cap 2026 production
    Google's TPU demand is expected to stay high through 2027, driven by AI applications like Gemini. However, production growth in 2026 may be limited by advanced packaging (CoWoS) and...
    Tuesday 9 December 2025
    Tata Group and Intel form strategic alliance to assemble chips in India
    Tata Group and Intel announced on December 8 that they have signed a memorandum of understanding to explore cooperation across semiconductor manufacturing, packaging and AI-focused...
    Monday 8 December 2025
    Research Insight: Strong momentum expected for data center AI chip packaging in 2025-2030
    According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in...
    Monday 8 December 2025
    Exclusive: Ex-TSMC R&D VP talks advanced packaging and CoWoS
    Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending...
    Monday 8 December 2025
    Geopolitics push AI chip packaging into Taiwan-US duopoly
    Geopolitical realignments are accelerating a reshaping of the global outsourced assembly and test (OSAT) landscape. Industry analysts say that over the next five years, advanced AI-chip...
    Monday 8 December 2025
    TSMC expansion to drive record earnings for Taiwan engineering contractors through 2026

    Taiwan's leading construction engineering contractors are on track to post record results in 2026 as TSMC accelerates advanced fab expansion...

    1/39 pages
    凱絡
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    Dec 12, 08:00
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    Friday 12 December 2025
    DigiKey India Celebrates Official Launch in Bengaluru
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    MiTwell Unleashes Edge AI Computing Power: Building an OSM + AMC Modular Ecosystem
    Thursday 11 December 2025
    AGI Technology Gears Up for CES 2026, Debuting Ultra-Fast Gen5 SSD and DDR5 Innovations
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