Growing demand for AI servers, advanced packaging, and data centers is reviving interest in idle LCD plants, with companies acquiring and converting existing sites into semiconductor...
Samsung Electro-Mechanics (SEMCO) has signed a long-term supply agreement worth KRW360.487 billion (approximately US$260 million) with a major global company for memory packaging substrates,...
Contrel Technology and FSE jointly showcased dual-core laser micromachining and plasma process technologies at TPCA Show 2026, targeting advanced packaging and high-end substrate manufacturing...
Packaging, substrate, printed circuit board (PCB), and assembly makers need closer coordination to meet the demands of AI and high-performance computing (HPC), as package-to-board...
AUO is tailoring its glass core substrate specifications specifically to semiconductor process requirements rather than competing on panel dimensions with Innolux, according to Chairman...
South Korean substrate maker Daeduck Electronics is accelerating development of ceramic core substrates (CCS) to address warpage and thermal-management challenges as AI semiconductor...
AI computing is pushing packaging density to its limits, with accelerator substrates expected to exceed 100x100mm and expand beyond 120x120mm within the next three to five years. As...
Amkor Technology is tripling its planned investment in Gwangju to expand advanced packaging capacity for artificial intelligence and high-performance computing, bringing a semiconductor...
TPK Holding has completed a pilot production line for glass-substrate through-glass via (TGV) technology at its Zhongli plant and started joint development and validation of early-stage...
Hanmi Semiconductor has established a US subsidiary in Silicon Valley as it seeks to capitalize on growing demand for advanced semiconductor packaging...
Market reports have recently suggested that MediaTek's tensor processing unit (TPU) v9 project with Google could face delays in volume production as Google reportedly revises the chip's...
Generative AI is pushing chip power consumption and heat flux to unprecedented levels, driving AI packaging thermal management requirements from several hundred watts to the kilowatt...
Microsoft's early adoption of TSMC's 2nm process, a US$2 billion manufacturing partnership between TSMC and GlobalFoundries, and delays to Google's next-gen TPU highlight diverging...
ACM Research is expanding beyond China as its panel-level packaging equipment advances through customer evaluations in Taiwan, while the US semiconductor equipment maker invests in...
Once a global LCD manufacturing powerhouse, Taiwan's display industry has weathered financial crises, antitrust penalties and fierce competition from state-backed Chinese rivals. Now,...
