MediaTek denied a foreign report about a timeline for adopting Intel Corp.'s embedded multi-die interconnect bridge packaging at a recent investor event and said its supply-chain strategy...
Computex 2026 showcased the industry's latest innovations with its usual fanfare. Yet beneath the spectacle, the event revealed something far more consequential: artificial intelligence...
Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level...
Samsung Electronics has used Computex 2026 to outline a broader AI memory strategy, highlighting HBM5, thermal management, and advanced packaging as it prepares for next-generation...
Nvidia GTC Taipei opened on June 1 with a packed keynote by CEO Jensen Huang, who kicked off the event by unveiling the widely watched Taiwan supply chain board.
Semiconductor testing company King Yuan Electronics (KYEC) recently convened its 2026 shareholders' meeting, during which it completed the election of nine board directors. Longtime...
Intel's foundry revival may depend less on beating TSMC at the most advanced process nodes than on whether it can turn AI-driven demand into a profitable advanced packaging busines...
Nvidia CEO Jensen Huang has repeatedly backed TSMC's price hikes, saying its advanced process and supply-chain services are difficult and highly valuable. As AI chip demand surges,...
The global semiconductor industry is at an inflection point, split between those who can still shrink transistors and those who can no longer do so. US export controls and the denial...
MediaTek held a pre-Computex 2026 media event in Taipei, Taiwan, on May 29, after which president and COO Joe Chen and CFO and co-COO David Ku spoke with reporters. Ku shared his views...
AuthenX is preparing to showcase a detachable 2D fiber-array unit at COMPUTEX 2026, as the Taiwanese optical-communications company seeks to address packaging and alignment challenges...
United Integrated Services, a key fab-building partner for TSMC and Micron, said the global artificial intelligence (AI) boom is continuing to drive semiconductor capital spending...
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state...
