News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Tuesday 5 August 2025

Taiwan OSAT gains from BIS whitelist fall short as US grants Chinese firms exemptions

Taiwan's IC OSAT supply chain was previously expected to benefit from US Bureau of Industry and Security (BIS) restrictions on Chinese semiconductor firms. The BIS's semiconductor...

Tuesday 5 August 2025

CoWoS capacity utilization reportedly only 60% amid AI boom, supply chain on alert

Reports have emerged that TSMC's advanced packaging technology, CoWoS, is operating at only 60% capacity utilization. Such a supply-demand mismatch has confused the supply chain.

Tuesday 5 August 2025

Canon builds first fab in 20 years to chase back-end boom

Japanese optical giant Canon, which had not built a new semiconductor lithography equipment production plant since 2004 due to a declining market, announced on July 30, 2025, the...

Monday 4 August 2025

ASE raises 2025 capex to US$5.5B as AI strains advanced packaging lines

ASE Holdings, the world's second-largest IC packaging and testing company after Amkor Technology, struck a cautious note in its second-quarter earnings call despite booming AI-driven...

Monday 4 August 2025

Innolux starts mass production of FOPLP, eyes monthly shipments surge by 2H25

Taiwanese display maker Innolux has officially entered volume production of its fan-out panel-level packaging (FOPLP) technology, a cornerstone of its broader transformation strategy...

Monday 4 August 2025

ASMPT emerges as advanced packaging's next kingmaker amid AI chip boom

Singapore-based ASMPT, founded in Hong Kong in 1975, has grown from a regional distributor into one of the world's most influential semiconductor equipment makers. With AI and hyperscale...

Sunday 3 August 2025

Tong Hsing bets on 800G and GaN to offset currency-driven profit slide

Tong Hsing Electronics, a key player in the backend packaging and testing of CMOS image sensors (CIS), held its quarterly investor conference on July 29, 2025. The company warned...

Sunday 3 August 2025

Greatek sees 2Q25 growth but faces currency erosion; flip-chip capacity expansion to complete by 1H26

Benefiting from a tariff buffer period, customers actively stocked up in advance. Powertech Technology Inc. (PTI)'s invested testing and packaging subsidiary, Greatek Electronics,...

Friday 1 August 2025

AI talent's potential to revive Taiwan's traditional industries

As Taiwan's AI server production and shipments continue to expand, high-performance computing chips are driving strong demand in manufacturing, packaging, and testing, making Taiwan's...

Friday 1 August 2025

Horng Terng fully booked with orders amid AI chip cooling demand surge

Horng Terng Automation, a leading manufacturer of advanced semiconductor packaging equipment, has leveraged its joint development efforts with packaging clients and mastery of critical...

Friday 1 August 2025

ASE maxes out Taiwan backend capacity on AI, automotive demand

ASE Holdings posted solid growth in advanced packaging and testing in the first half of 2025, fueled by robust demand for AI-related high-performance computing (HPC) chips. However,...

Thursday 31 July 2025

China's third central automaker revs up EV-chip cluster in Chongqing

As China moves to curb domestic EV overcompetition and prioritize industrial upgrading, China Changan Automobile Group (CCAG) officially...

Thursday 31 July 2025

Samsung's Lee Jae-yong visits DC with US tariff negotiations ongoing, eyes further Texas investment

Samsung Electronics Chairman Lee Jae-yong recently made a spontaneous trip to Washington, DC, to assist South Korea in ongoing reciprocal tariff negotiations with the US. As AI semiconductors...

Wednesday 30 July 2025

From substrate to system: A deep dive into Nvidia's CoWoP packaging shift

As artificial intelligence and high-performance computing enter a phase of explosive growth, the limitations of traditional chip manufacturing and the slowing of Moore's Law have...

Wednesday 30 July 2025

China unveils first optical-interconnect GPU supernode in AI infrastructure push

As demand for computing power accelerates alongside the rise of large-scale and multimodal AI models, China is ramping up efforts to expand...

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