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    Global smartphone shipments fall to the lowest 2Q level since 2013 amid memory shortage
    7min ago
    Huatian Technology guides first-half 2026 net profit up 231-275%, lifted by IC demand and investment gains
    11min ago
    Bosch starts sample production at its first US chip plant after securing up to US$225 million
    30min ago
    6-inch SiC substrate prices recover as supply tightens and demand picks up
    Jul 13, 18:32
    South Korean equipment and materials makers accelerate hybrid bonding R&D for HBM5 and beyond
    Jul 13, 18:32
    NEWS TAGGED PACKAGING
    Tuesday 14 July 2026
    Innolux 1H26 revenue hits 5-year high on auto, advanced packaging
    Taiwanese panel manufacturer Innolux reported unaudited consolidated revenue of NT$21.7 billion (approx. US$675.4 million) for June 2026, up 5.1% from the previous month and 17.25%...
    Tuesday 14 July 2026
    Aurotek posts record first-half revenue on semiconductor automation demand
    Aurotek Corp. said revenue in the second quarter and first half of 2026 reached record highs as demand from semiconductors and smart automation accelerated. The Taiwanese automation...
    Tuesday 14 July 2026
    C Sun sees advanced packaging and PCB demand driving 2026 revenue
    C Sun said its 2026 revenue growth will be led by advanced packaging and advanced printed circuit board equipment as AI infrastructure spending continues to support industrial investment...
    Tuesday 14 July 2026
    iST June revenue rose as AI chip validation demand strengthened
    Integrated Service Technology Inc. (iST) reported June 2026 consolidated revenue of about NT$426 million (US$13.24 million), up 10.47% from May and down 1.56% year on year. The Taiwan-based...
    Tuesday 14 July 2026
    Samsung brings HBM, logic, and optics together in packaging push
    Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising...
    Monday 13 July 2026
    Samsung develops glass interposer as TSMC expands packaging capacity

    Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer that could lower the cost of packaging...

    Monday 13 July 2026
    China Life commits US$700M to semiconductor fund under Beijing's patient capital strategy

    China Life Insurance Company Limited plans to invest CNY4.999 billion (US$697 million) in a new CNY5 billion semiconductor private...

    Monday 13 July 2026
    Chiayi Science Park Phase 2 breaks ground for advanced packaging hub
    The second phase of Chiayi Science Park has officially broken ground on a site of about 90 hectares, with TSMC leading the development of an industrial cluster centered on advanced...
    Monday 13 July 2026
    CPO mass production accelerates new four-stage test equipment market
    AI-driven demand is accelerating the shift of co-packaged optics (CPO) from technology validation to mass production, triggering a new wave of equipment demand. Companies including...
    Monday 13 July 2026
    Weekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chains

    AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at...

    Monday 13 July 2026
    KYEC approves US$1.4 billion US plant to expand chip testing capacity
    King Yuan Electronics (KYEC) approved a US plant investment of up to US$1.4 billion, or about NT$44.9 billion, on July 10 as the US continued pushing to expand domestic chip manufacturing...
    Monday 13 July 2026
    SK Hynix hybrid bonding push signals next phase of HBM packaging race
    SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging...
    Saturday 11 July 2026
    Interview: Why Geckos bets materials, not chips, will decide the next AI performance leap

    As generative AI fuels rapid growth in demand for high-performance computing (HPC), the semiconductor industry is shifting from a process...

    Friday 10 July 2026
    SK Hynix breaks Alibaba's US listing record — but HBM customers will wait until 2028 for the capacity it funds
    SK Hynix has priced a US$26.5 billion Nasdaq offering, giving the world's leading supplier of high-bandwidth memory fresh capital to expand DRAM wafer production, advanced packaging...
    Friday 10 July 2026
    ASE Holdings posts record 2Q26 revenue, bets US$40M on South Korea as AI packaging demand surges

    ASE Holdings posted record second-quarter and first-half 2026 revenue, driven by strong demand for advanced semiconductor packaging and...

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    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
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