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NEWS TAGGED PACKAGING
Thursday 13 August 2026
Taiwan's packaging and integration ecosystem positions it as the backbone of CPO scaling, Ayar Labs says

The technical feasibility of co-packaged optics (CPO) has been demonstrated repeatedly at major industry conferences in recent years...

Thursday 13 August 2026
ChipMOS lifts capex for 2026-2027 on memory and AI ASIC growth

ChipMOS said strong demand for automotive panels and memory products drove revenue and profit to record highs in the second quarter...

Thursday 13 August 2026
Intel signals memory push after hiring former SK Hynix CEO

Intel is signaling a broader push into next-generation memory technologies, with CEO Lip-Bu Tan revealing that the company is exploring...

Thursday 13 August 2026
Siemens EDA unveils AI-Native Design strategy in South Korea
Siemens EDA has introduced an AI-Native Design strategy in Seoul, aiming to help chipmakers and system designers manage rising complexity while reducing the risk of AI errors. The...
Wednesday 12 August 2026
OCP APAC 2026: Ecosystem not yet ready for co-packaged optics, ASE's Nicole Tien warns

Co-packaged optics has become the inflection point for AI infrastructure, but the industry has not yet built the shared testing standards...

Wednesday 12 August 2026
OCP APAC 2026: Nvidia SVP Shainer on taking CPO to mass production —'can't release something just because it's cool'

Nvidia's Spectrum-6 co-packaged optics (CPO) switches are in production and shipping, Gilad Shainer, senior vice president of networking...

Wednesday 12 August 2026
OCP APAC 2026: TSMC says AI advanced packaging enters system-level battle

AI computing demand is rapidly driving up chip integration complexity, pushing advanced packaging competition beyond single-device...

Wednesday 12 August 2026
SPIL breaks ground on NT$100B Douliu plant, targeting operations in 2028

Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding (ASEH), broke ground on a new plant in Douliu, Yunlin...

Wednesday 12 August 2026
OCP APAC 2026: ASE unveils AI packaging trilogy

Demand for AI infrastructure is forcing chipmakers and data-center operators to rethink how systems are built, with implications for...

Wednesday 12 August 2026
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
AI computing demand is rapidly increasing the complexity of chip integration, shifting advanced packaging competition beyond individual component performance to reliability and validation...
Wednesday 12 August 2026
Panel makers turn to AI packaging as old fabs gain value
Taiwanese panel makers broadly reported weaker July revenue as some customers pulled in shipments in advance in the first half of the year and memory price increases weighed on consumer...
Tuesday 11 August 2026
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
AI computing demand is rapidly increasing the complexity of chip integration, shifting advanced packaging competition beyond individual component performance to reliability and validation...
Tuesday 11 August 2026
Amkor reportedly weighs China stake sale as multinationals reassess footprint
Amkor Technology is exploring options, including the sale of a stake in its China business, according to people familiar with the matter, adding the US chip packaging and testing giant...
Tuesday 11 August 2026
Gudeng posts record seven-month revenue on EUV Pod orders and global demand
Gudeng Precision Industrial reported record revenue for the first seven months of 2026, supported by stronger EUV pod orders and rising purchases from overseas customers for advanced...
Tuesday 11 August 2026
Yesiang posts record revenue for third straight month on advanced process demand
Yesiang Enterprise, a major maker of advanced-process microcontamination control filters, reported strong first-half 2026 results and said July consolidated revenue reached NT$305...