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NEWS TAGGED PACKAGING
Friday 30 October 2026
ACM Shanghai ships first 310×310mm panel-level plating tool as order backlog surges 88%
As AI chip packages continue to grow in size, panel-level packaging equipment is gradually advancing toward customer validation and volume production.
Friday 30 October 2026
Beyond nanometers: AI forces Taiwan's semiconductor ecosystem to compete at system level
Taiwan's semiconductor rise was built on a powerful division of labor: world-class IC design feeding increasingly advanced foundries, supported by packaging, testing, and an unusually...
Friday 30 October 2026
Intel increases equipment orders as server demand exceeds supply
Intel's server expansion is drawing equipment and materials suppliers into a capacity push, but the benefits will arrive in stages. Management's October 29 earnings-call comments identified...
Friday 30 October 2026
Eternal Materials posts record revenue in advanced packaging, precision equipment
Eternal Materials posted earnings before taxes (EBT) of NT$388 million (approx. US$11.92 million) in September 2026, surging 158.28% year-over-year and up 44.47% from August, as revenue...
Friday 30 October 2026
Intel slashes 18A costs by 40% as foundry posts US$1.9 billion loss
Intel is cutting manufacturing costs for its newest processors, but the gains are reaching individual products and its foundry business at different speeds. Its October 29 earnings...
Friday 30 October 2026
ASE Holdings raises 2026 capex to US$11.5 billion after profit surge
ASE Technology Holding reported net profit of NT$26.996 billion (US$831 million) for the third quarter of 2026, a 28% increase from the previous quarter and a 148% gain from a year...
Thursday 29 October 2026
LB Semicon to expand PMIC capacity under 10-year Qualcomm deal
South Korean semiconductor packaging and testing company LB Semicon reportedly plans to invest KRW30 billion (approx. US$22.4 million) to expand its power management IC (PMIC) back-end...
Thursday 29 October 2026
KLA: wafer fab equipment market exceeding US$200B in 2027
KLA expects global wafer fabrication equipment (WFE) spending to exceed US$200 billion in 2027, as semiconductor manufacturers accelerate investments in advanced logic, DRAM and high-bandwidth...
Thursday 29 October 2026
Powertech shifts to advanced packaging as AI demand drives growth
Rising demand for high-end AI chips is accelerating Powertech's transformation into an advanced packaging strategic partner. Powertech said its utilization rate exceeded 90% in the...
Thursday 29 October 2026
DIGITIMES Insight: Kinsus Tech identifies three challenges for larger AI chip packages
Surging demand for AI computing is driving advanced packaging toward larger form factors, according to Ting-Hao Lin, R&D vice president at Kinsus Interconnect Technology, speaking...
Thursday 29 October 2026
Kinsus explores AlN ceramics beyond glass for AI advanced packaging
Kinsus Interconnect Technology is exploring aluminum nitride (AlN) ceramics as a core material for substrates used in large-scale advanced packaging, seeking an alternative to glass...
Wednesday 28 October 2026
Goke Microelectronics raises KGD packaging prices again
China-based IC design firm Goke Microelectronics will raise prices for its Known Good Die (KGD) packaged products by US$0.5 to US$1.5 per unit from November 2026, depending on capacity...
Wednesday 28 October 2026
From superconductors to optics: The six Silicon Valley startups bringing AI bottleneck solutions to Taiwan
Silicon Valley venture capital firm Playground Global returned to Taiwan with six portfolio companies spanning memory, power management, optical communications and advanced packaging,...
Tuesday 27 October 2026
Pat Gelsinger warns AI compute efficiency must jump 10,000x amid power, memory, and fab constraints
Silicon Valley venture capital firm Playground Global has returned to Taiwan alongside a cohort of portfolio companies specializing in memory, power management, optical communications,...
Tuesday 27 October 2026
AMD, Nvidia target substrate capacity amid 4x expansion constraints
AMD and Nvidia have separately invested in supply-chain capacity expansion, making substrates, packaging, and testing key priorities as AI demand diversifies. The moves show that chipmakers...