Taiwan-based UVAT Technology with its sputtering and etching equipment has obtained new orders for fan-out panel-level packaging, as well as orders for the manufacture of high-end...

Manufacturing equipment supplier C Sun expects equipment used in advanced IC packaging, mainly SiP (system in package), FO-WLP (fan-out wafer-level package) and CoWoS (chip-on-wafer-on-substrate),...

IC packagers including ASE Technology and Greatek Electronics have been running QFN (quad flat no-lead) wire bonding lines at full capacity utilization, mainly driven by strong demand...

Taiwan-based leadframe makers including Jih Lin Technology and SDI have reportedly cut into the supply chain for Tesla's charging piles, and are poised to embrace significant increases...

Global Unichip Corp. (GUC), the advanced ASIC leader, disclosed today that it has successfully demonstrated the silicon-proven GLink (GUC multi-die interLink) interface using TSMC...

ASE Technology's development of its CMOS image sensor backend business has been in a low profile, unlike the development of its other offerings such as wirebonding and system-level...

ASE Technology reportedly has become Sony's second backend partner for processing automotive CMOS imaging sensors (CIS), marking its return to the CIS packaging segment following...

TSMC has allocated a US$3.5 billion budget for setting up a subsidiary in Arizona, where the pure-play foundry plans to build a wafe fab using 5nm process technology.

Leading foundry houses are mostly partners rather than competitors for OSAT firms despite their aggressive deployment in advanced 3D IC packaging solutions, according to Amkor Technology...

OSAT provider ASE Technology has expressed optimism about its operations in the fourth quarter of 2020 and next year, as its packaging capacity remains tight and ASPs will rise.

Automotive diode maker Actron Technology will for the first time begin to package SiC MOSFETs used in electric vehicles (EVs) on an OEM basis in the second half of 2021, according...

Unimicron Technology's IC substrate plant in Taoyuan, northern Taiwan caught fire on the afternoon of October 28. The site is where the company produces flip-chip chip-scale packaging...

C Sun aims to increase the proportion of consolidated revenues for advanced IC packaging equipment to 30% in 2021, according to company chairman Morris Liang.

TSMC is fast advancing its IC packaging technology in line with its efforts to extend the relevance of Moore's Law. The foundry's 6th-generation CoWoS...

TSMC continues to advance in CoWoS-S packaging adopting silicon interposer, with the prospect of entering volume production in 2023 for the sixth-generation of the technology that...

The supply of display driver ICs has fallen short of demand, while capacities at 8-inch foundries stay tight. Backend houses are mulling raising their quotes to reflect the tight...

Backend house Powertech Technology (PTI) will step up efforts to expand its logic IC business, aiming to boost the revenue ratio for the segment from nearly 30% to over 40%, according...

IC packaging and testing service provider Greatek Electronics has plans to expand capacity to meet strong demand from the smaertphone sector.

Display driver IC backend specialist Chipbond Technology and memory modules backend and EMS service provider Orient Semiconductor Electronics (OSE) have formed a long-term strategic...

Taiwan's IC packaging materials suppliers, including Niching Technology and Chang Wah Technology (CWTC), have seen their order visibility improve significantly, according to industry...

Apple's custom-designed ultra wideband (UWB) chip featured in the just-unveiled HomePod mini smart speaker is built using ASE Technology's SiP packaging technology, according to industry...

Taiwan's IC materials distributors including Niching Industrial have seen a significant surge in shipments of COF and COG packaging materials and thermal solutions since the third...

Japan-based leadframe vendors have reportedly raised quotes for part of their products by about 15% to reflect rising material costs, but their peers in Taiwan have no intentions...

GaAs foundry Win Semiconductors and other Taiwan-based III-V semiconductor players are ramping up their output for new smartphones, with order visibility for the fourth quarter strengthened,...

Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has been stepping up its deployment in the...