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    OpenAI's HBM push signals a new AI memory arms race
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    Lens Technology swings to loss on weak smartphone demand, FX pressure
    32min ago
    Commentary: Robots are selling, but profits are not; data is the real prize
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    NEWS TAGGED PACKAGING
    Friday 17 April 2026
    TSMC revises advanced process and packaging strategy
    TSMC chairman C.C. Wei emphasized persistent capacity shortages during the company's earnings call, noting that 3nm technology accounted for about 25% of first-quarter 2026 revenue...
    Friday 17 April 2026
    Taiwan's OSAT expansion could tighten global test capacity and raise costs
    Taiwan's outsourced semiconductor assembly and test industry is expanding rapidly, driven by AI, high-performance computing, and memory demand. Global supply chains may face tighter...
    Friday 17 April 2026
    Apple highlights record progress in recycled materials across products
    Apple has announced what it describes as its highest-ever use of recycled materials across its product lineup, underscoring continued efforts to reduce environmental impact and move...
    Friday 17 April 2026
    Tongfu Microelectronics profit jumps on AI chip packaging, AMD demand

    Tongfu Microelectronics posted strong 2025 results, supported by AI and automotive chip demand, while reinforcing its position in the...

    Friday 17 April 2026
    TSMC chairman C.C. Wei denies customer favoritism regarding tight 1Q26 capacity
    TSMC delivered an above-expectations financial performance in the first quarter of 2026 and remains optimistic about continued strong demand for advanced process technologies entering...
    Friday 17 April 2026
    With chip limits near, focus shifts to packaging and integration

    As the rise of artificial intelligence (AI) pushes semiconductor performance toward new limits, the industry is confronting a fundamental...

    Thursday 16 April 2026
    Global Expansion of 2.5D/3D Packaging: Strategic Moves in the US, Asia, and Beyond

    Introduction

    Thursday 16 April 2026
    US–Iran tensions add another reason to rethink plastic-heavy, disposable supply chains
    The ongoing US–Iran conflict is raising global costs for raw materials and energy, leading to higher prices and shortages across sectors such as plastic packaging and consumer...
    Wednesday 15 April 2026
    Tong Hsing Electronic expects revenue acceleration as fiber optics drives expansion
    Tong Hsing Electronic, a Taiwanese semiconductor packaging and substrate manufacturer specializing in CMOS image sensors, said on Monday that optical communication modules have become...
    Wednesday 15 April 2026
    Taiwan equipment makers ride advanced packaging and SiPh wave
    Nvidia is accelerating the commercial rollout of silicon photonics (SiPh) technology, marked by the launch of its Rubin Ultra platform and the gradual establishment of co-packaged...
    Wednesday 15 April 2026
    Global semiconductor equipment sales hit record US$135B in 2025 as AI-driven investment surges

    Global semiconductor manufacturing equipment sales reached a record US$135.1 billion in 2025, rising 15% from US$117.1 billion in 2024,...

    Tuesday 14 April 2026
    Samsung Electro-Mechanics reportedly to expand AI packaging with MLCC embedded substrate line in Vietnam
    As AI chips demand higher performance and denser integration, advanced packaging and substrate technologies have become critical in the semiconductor race. Samsung Electro-Mechanics...
    Tuesday 14 April 2026
    Glass substrates move toward mass production as Intel, Samsung Electro-Mechanics step up efforts
    Glass substrates are entering a critical pre-mass production phase as demand for high-performance AI chips accelerates. As AI workloads require larger chip sizes and higher bandwidth,...
    Tuesday 14 April 2026
    JCET advances CPO, glass substrates to capture AI packaging demand
    JCET, China's leading outsourced semiconductor assembly and test (OSAT) provider, is accelerating its push into advanced packaging, sharpening its position in AI servers, data centres,...
    Monday 13 April 2026
    Global chip equipment sales reach record US$135 billion as AI drives investment surge

    Worldwide semiconductor manufacturing equipment sales rose 15% to a record US$135.1 billion in 2025 from US$117.1 billion a year earlier,...

    1/47 pages
    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook