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    Samsung may cut foldable phone storage upgrade perk amid memory price surge
    43min ago
    Zhonghao Xinying pushes TPU chips to cut AI inference costs in China
    43min ago
    Advanced packaging materials poised to outgrow front-end process, with CPO moving toward commercial use
    43min ago
    Analysis: CXMT IPO draws strategic investors across China’s semiconductor supply chain
    44min ago
    Memory makers regain pricing power as AI demand squeezes other markets
    44min ago
    NEWS TAGGED PACKAGING
    Wednesday 15 July 2026
    AI drives memory shortage through 2027, PSMC lifts 2Q26 margin to 28%
    AI-driven demand for memory, power management chips, and advanced packaging has continued to tighten supply and demand in the foundry market. Powerchip Semiconductor Manufacturing...
    Wednesday 15 July 2026
    Global semiconductor equipment sales set to hit record US$165.9B in 2026
    Global sales of semiconductor manufacturing equipment are on pace to reach an unprecedented US$165.9 billion in 2026, a 23.2% jump from the previous year, according to industry association...
    Wednesday 15 July 2026
    Charts: Taiwan's OSAT sector grows a steady 23.7% YoY in June, but a small player is stealing the spotlight
    Taiwan's back-end packaging and testing (OSAT) industry posted US$3,105.4 million in June 2026 revenue, up 2.9% month-over-month and 23.7% year-over-year — a solid, steady pace,...
    Tuesday 14 July 2026
    Huatian Technology guides first-half 2026 net profit up 231-275%, lifted by IC demand and investment gains
    China's semiconductor packaging and testing firm Tianshui Huatian Technology said on July 14 it expects first-half 2026 net profit attributable to shareholders of CNY750 million (approx...
    Tuesday 14 July 2026
    Innolux 1H26 revenue hits 5-year high on auto, advanced packaging
    Taiwanese panel manufacturer Innolux reported unaudited consolidated revenue of NT$21.7 billion (approx. US$675.4 million) for June 2026, up 5.1% from the previous month and 17.25%...
    Tuesday 14 July 2026
    Aurotek posts record first-half revenue on semiconductor automation demand
    Aurotek Corp. said revenue in the second quarter and first half of 2026 reached record highs as demand from semiconductors and smart automation accelerated. The Taiwanese automation...
    Tuesday 14 July 2026
    C Sun sees advanced packaging and PCB demand driving 2026 revenue
    C Sun said its 2026 revenue growth will be led by advanced packaging and advanced printed circuit board equipment as AI infrastructure spending continues to support industrial investment...
    Tuesday 14 July 2026
    iST June revenue rose as AI chip validation demand strengthened
    Integrated Service Technology Inc. (iST) reported June 2026 consolidated revenue of about NT$426 million (US$13.24 million), up 10.47% from May and down 1.56% year on year. The Taiwan-based...
    Tuesday 14 July 2026
    Samsung brings HBM, logic, and optics together in packaging push
    Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising...
    Monday 13 July 2026
    Samsung develops glass interposer as TSMC expands packaging capacity

    Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer that could lower the cost of packaging...

    Monday 13 July 2026
    China Life commits US$700M to semiconductor fund under Beijing's patient capital strategy

    China Life Insurance Company Limited plans to invest CNY4.999 billion (US$697 million) in a new CNY5 billion semiconductor private...

    Monday 13 July 2026
    Chiayi Science Park Phase 2 breaks ground for advanced packaging hub
    The second phase of Chiayi Science Park has officially broken ground on a site of about 90 hectares, with TSMC leading the development of an industrial cluster centered on advanced...
    Monday 13 July 2026
    CPO mass production accelerates new four-stage test equipment market
    AI-driven demand is accelerating the shift of co-packaged optics (CPO) from technology validation to mass production, triggering a new wave of equipment demand. Companies including...
    Monday 13 July 2026
    Weekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chains

    AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at...

    Monday 13 July 2026
    KYEC approves US$1.4 billion US plant to expand chip testing capacity
    King Yuan Electronics (KYEC) approved a US plant investment of up to US$1.4 billion, or about NT$44.9 billion, on July 10 as the US continued pushing to expand domestic chip manufacturing...
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    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    VIA Labs Announces MST Hub Controllers for Multi-Display USB-C Docking
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