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Friday 22 May 2026
AMD's Lisa Su says memory is becoming another pressure point for AI chips

AMD CEO Lisa Su said the company is satisfied with its current CoWoS supply from TSMC, while noting that memory has become another pressure...

Friday 22 May 2026
AMD's Lisa Su says AI demand is 'absolutely real' as CPUs return to focus

AMD CEO Lisa Su pushed back against concerns of an AI bubble on May 22, saying demand is "absolutely real" and that the industry remains...

Friday 22 May 2026
Amkor expands Arizona semiconductor packaging campus with additional 67 acres

Amkor Technology today reaffirmed its commitment to strengthening advanced semiconductor packaging and test capabilities in the US through...

Friday 22 May 2026
AMD deepens China packaging alliance with TF-AMD expansion in Suzhou
AMD CEO Lisa Su appeared in Suzhou on May 20 to attend the launch ceremony for the second-phase expansion of Suzhou TF-AMD Semiconductor Co. (also known as Suzhou Tongfu Advanced Microelectronics),...
Friday 22 May 2026
Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys back US$125M UCLA Semiconductor Hub
Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys are partnering with UCLA Samueli to create a US$125 million Semiconductor Hub to accelerate research and workforce...
Friday 22 May 2026
AP Memory IPD enters Intel's EMIB supply chain, shipments set for 2Q26
Specialty memory design company AP Memory is positioning itself to capture growth momentum from stack silicon capacitors (S-SiCap). The company said its discrete S-SiCap products,...
Friday 22 May 2026
Samsung's quiet Taiwan play: Pairing memory with foundry to chip away at TSMC
Samsung Electronics chairman Lee Jae-yong quietly visited Taiwan on May 21 and met with MediaTek CEO Rick Tsai, according to semiconductor supply chain sources, in a move aimed at...
Friday 22 May 2026
AMD backs Taiwan EFB packaging chain to cut CoWoS reliance

AMD said it plans to invest more than US$10 billion in Taiwan's technology ecosystem to accelerate AI infrastructure development, while...

Friday 22 May 2026
Lam Research's Salzburg PLP center signals push toward panel production, but hurdles remain for large-scale adoption
Lam Research has opened a Panel-Level Packaging (PLP) Innovation Excellence Center in Salzburg, Austria, underscoring the company's move deeper into advanced packaging as customers...
Friday 22 May 2026
TSMC supply chain material maker AMC rides AI packaging yield boom

Alliance Material Co. (AMC), a Taiwan-based advanced semiconductor materials supplier, said its balance film anti-warpage material has...

Friday 22 May 2026
BOE, Corning target glass substrates for AI chip packaging

BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the...

Friday 22 May 2026
AMD deepens Taiwan supply chain ties with US$10B-plus push
AMD CEO Lisa Su arrived in Taiwan on May 20, 2026, on a private jet and largely followed the same itinerary as her April 2025 visit, including a meeting with TSMC, a technology forum...
Friday 22 May 2026
Lam Research launches PLP Center of Excellence, replacing wafers with panels
Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology...
Thursday 21 May 2026
AMD commits over US$10 billion to Taiwan ecosystem to expand AI packaging and infrastructure capacity
AMD said on May 21 that it plans to invest more than US$10 billion across Taiwan's semiconductor ecosystem to deepen strategic partnerships and expand advanced packaging capacity for...
Thursday 21 May 2026
Five weak links India Semiconductor Mission 2.0 must fix
India's first semiconductor mission brought fabs, OSAT units, and chip projects into the policy pipeline. Its second phase is being shaped around a harder question: whether India can...