India's semiconductor ambitions are beginning to extend beyond fabrication and conventional packaging into secure chip personalization and cryptographic control, as Kaynes Semicon...

TSMC is rapidly expanding its advanced packaging operations and is reportedly poised to appoint its first-ever "general plant manager" to oversee all facilities. The role is expected...

Taiwan's semiconductor manufacturing side turned in a distinctly split performance in December 2025. The month can be summed up as: AI keeping advanced logic and advanced packaging...

India's backend semiconductor makers see temporary relief from material constraints linked to legacy packaging, as KLA opens a US$36 million R&D hub in Chennai to boost AI, software,...

Semiconductor test solution supplier WinWay recorded its highest-ever revenue in December 2025, fueled by strong demand from artificial intelligence (AI), high-performance computing...

China's domestic lithography sector is entering another phase of internal restructuring, with AMIES Technology consolidating industrial assets originally spun out from Shanghai Micro...

Taiwan-based semiconductor testing firm MA-tek announced December 2025 revenue of NT$501 million (approx. US$15.91 million), marking a 2.7% increase from November and a 10.65% rise...

Niching Industrial, a supplier of semiconductor packaging materials, reported consolidated revenue of NT$128.37 million (approx. US$4.07 million) in December 2025, representing a...

India's backend semiconductor manufacturers are benefiting from a narrow window of materials comfort that is closely tied to the use of legacy packaging technologies.

PentaPro Materials Inc., a Taiwanese supplier of semiconductor process chemicals, has joined the supply chain of TSMC and plans to invest NT$3 billion (US$95 million) in a second...

Recent market reports highlight ongoing challenges for TSMC's wafer fabs in Arizona, including high costs and low profits. Industry sources cite supply chain issues, talent shortages,...

Japanese chipmaker Rapidus is advancing its 2nm process technology while developing advanced packaging solutions tailored for AI chips. The company aims to officially start trial...

As major corporations expand investments in artificial intelligence (AI), memory suppliers have seen a flood of orders. According to the latest reports from South Korean media, Samsung...

As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT)...

Singapore is drawing a new wave of semiconductor investment as global chipmakers expand advanced manufacturing tied to artificial intelligence infrastructure, reinforcing the city-state's...