Generative AI has stimulated demand for High Bandwidth Memory (HBM), driving Taiwanese memory chipmakers to seize a share of the AI business opportunity.
According to industry sources in Taiwan, IC back-end houses are divided as to whether they will establish facilities in Japan similar to Taiwan Semiconductor Manufacturing Company...
Taiwanese OSAT leader Advanced Semiconductor Engineering (ASE) has recently announced its plan to bolster overseas production by acquiring Infineon's backend assembly and testing...
Hon Hai Technology (Foxconn) is transitioning to a "solutions" provider rather than an electronics and semiconductor manufacturer. The firm said it is moving toward a "system foundry"...
At the first conference for its burgeoning foundry business, Intel restated its aim to provide five advanced process nodes in four years. The company also disclosed plans for more...
The AI surge is anticipated to substantially boost demand for advanced packaging, which is already in short supply, according to sources at backend houses.
Applied Materials reported an 18% growth in its profit and expected the semiconductor industry to recover faster than the macroeconomy. The company said it will likely benefit from...
Samsung Electronics is actively enhancing its semiconductor foundry capabilities by embracing hybrid bonding technology. The company has recently integrated equipment from BE Semiconductor...
Taiwan-based Aptos Technology, a subsidiary of Taiwan Mask, announced a collaboration with India-based Kaynes Semicon Private Limited on training and technology licensing in semiconductor...
The Japanese government's efforts to attract foreign semiconductor investment have been very effective, with almost every major international semiconductor manufacturer responding...
Raytheon, an RTX company, has received a $20 million contract from the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) consortium to develop a next-generation...
ASE Technology Holding (ASEH) will be stepping up its advanced packaging and testing capabilities in the second half of 2024, when a new cycle begins after the completion of inventory...
OSAT providers are optimistic about business opportunities accompanying the AI boom, with many gearing up to develop new packaging technologies to support silicon photonics.
