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NEWS TAGGED PACKAGING
Thursday 21 November 2024
SSD sales to outperform DRAM module sales in 2024
SSD sales have been buoyed by specifications upgrades, according to industry sources, while DRAM module sales have exhibited signs of weakness. In 2024, they predict that SSD sales...
Thursday 21 November 2024
TSMC quietly forms advanced packaging supply chain cluster in Southern Taiwan
TSMC is strategically developing a dedicated supply chain cluster on 30 hectares (300,000 square meters) of land in Southern Taiwan Science Park (STSP) to strengthen its advanced...
Thursday 21 November 2024
Samsung expands Suzhou packaging investments to bolster HBM competitiveness
Samsung Electronics is bolstering its HBM competitiveness through significant investments in advanced packaging. Upgrades are underway at its Cheonan facility in South Korea, and...
Wednesday 20 November 2024
Taiwan chip gear makers cash in on TSMC 2Q24, 3Q24 orders
Taiwanese semiconductor equipment manufacturers working with TSMC are benefiting significantly from its orders, with eight of them reporting gross margins of 40-60% in the second...
Wednesday 20 November 2024
SK Hynix accelerates US expansion with new packaging facility, strengthens ties with TSMC, Nvidia
SK Hynix has revealed plans to establish a new company in Indiana through its third quarter 2024 business report, marking a significant step toward building a semiconductor packaging...
Tuesday 19 November 2024
Multinationals moving to Vietnam to establish IC backend operations
Amid escalating US-China tensions, multinational companies are increasingly shifting their semiconductor testing and packaging operations to Vietnam, supported by local companies...
Tuesday 19 November 2024
Mitsui Mining & Smelting raises copper foil prices, impacting South Korean semiconductor supply chain
Mitsui Mining & Smelting (Mitsui) recently announced an increase in copper foil prices, raising concern within the South Korean industry. Given that copper foil is a core material...
Tuesday 19 November 2024
GPTC sees wet process equipment orders soar on advanced packaging boom in 2025
Driven by rising demand for chip-on-wafer-on-substrate (CoWoS) and other advanced packaging equipment, Taiwan-based semiconductor automation and wet process equipment maker Grand...
Monday 18 November 2024
MKS' Atotech and ESI at TPCA show and IMPACT 2024
The TPCA Show and IMPACT Conference 2024 was held in Taiwan at the Taipei Nangang Exhibition Center Hall 1 from October 23rd to 25th. Two strategic brand presences of MKS, Atotech,...
Friday 15 November 2024
Samsung's Pyeongtaek P4 expands to NAND + DRAM; to host premier packaging facility in Cheonan
Samsung Electronics is reportedly finalizing investment plans for the first production line at its Pyeongtaek Plant 4 (P4) facility in South Korea, rebranding it to focus on mass-producing...
Thursday 14 November 2024
Chairman of top Chinese OSAT 'JCET' resigns after state-owned company becomes largest shareholder
JCET Group, China's top semiconductor packaging and testing firm, announced on November 13, 2024, that chairman Yonggang Gao, along with directors Peng Jin and Chunsheng Zhang, have...
Thursday 14 November 2024
Chip resistor supplier Ta-I maintains 70-80% utilization rate amid stable pricing
Taiwan-based chip resistor maker Ta-I Technology currently maintains a capacity utilization rate of 70-80%, with prices remaining stable thanks to a more balanced supply and demand...
Wednesday 13 November 2024
With CoWoS demand booming, fab equipment maker GPTC seeks to keep up with TSMC
Grand Process Technology Company (GPTC), a Taiwan-based semiconductor equipment company involved in the supply chain for TSMC's CoWoS packaging, aims to leverage the rising demand.
Wednesday 13 November 2024
Machvision invests in Hye Technology, eyes growth in advanced packaging
Machvision's board has approved a NT$274 million (US$8.6 million) strategic investment to acquire 13% of Hye Technology's common shares. The investment will represent 11.5% of Hye's...
Tuesday 12 November 2024
Taiwan fab toolmakers benefit from TSMC's CoWoS demand spike
A recent annual forum for the chipmaking equipment and materials sectors was hosted in Tainan, southern Taiwan, bringing together executives from TSMC and its ecosystem partners including...