Nvidia CEO Jensen Huang's visit to Siliconware Precision Industries (SPIL) on his current trip to Taiwan has garnered market attention to the company's emphasis on advanced packagi...
Advanced packaging demands are driving consistent growth in semiconductor material demand, with distributors reporting strong contributions from the sector. Demand for high-end materials...
Samsung Electro-Mechanics is leveraging its multilayer ceramic capacitor (MLCC) expertise to venture into the energy sector, specifically targeting the development of small all-solid-state...
Nvidia CEO Jensen Huang's first stop in Taiwan is confirmed to be Taichung. According to an announcement from ASE Holdings' subsidiary SPIL, on the afternoon of January 16, Huang...
TSMC has maintained its equipment orders, despite market rumors regarding a decrease in demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging from Nvidia. According to sources at...
Malaysian Prime Minister Anwar Ibrahim has announced plans to leverage the country's geographical advantages and recent foreign investments to position Malaysia as a hub for energy...
Driven by rising demand in artificial intelligence (AI), advanced packaging, advanced processes, and automotive electronics, inspection labs specializing in IC materials, including...
TSMC is set to achieve new revenue and profit records in 2024, driven by strong AI orders, according to industry sources. The pure-play foundry continues to accelerate its advanced...
Rayleigh Vision Intelligence (RVI), a Taiwanese technology startup company, will showcase several groundbreaking MicroLED technologies at the Consumer Electronics Show (CES) 2025...
The launch of Nvidia's GeForce RTX 50 is expected to drive growth at Taiwan's packaging and testing houses in the supply chain of the latest GPU series in 2025, according to industry...
Micron Technology initiated construction on Wednesday (January 8, 2025) of a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to its existing facilities in Sing...
South Korea's semiconductor industry is rapidly diversifying its export destinations away from China, with Taiwan and the US emerging as increasingly important markets amid ongoing...
Samsung Electronics' packaging R&D chief J. C. Lin has recently resigned after a two-year tenure. Following the development, reports have emerged that Chinese semiconductor firms...
Following the widely reported departure of Lin Jing-cheng "Vic" (J. C. Lin) from Samsung Electronics in December 2024, industry analysts are now assessing the impact of his brief...
South Korea's Ministry of Trade, Industry, and Energy (MOTIE) has announced a KRW36.4 billion (US$24.79 million) investment to fund 48 next-generation semiconductor R&D projects...
