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    Is the AI boom really a bubble? Jensen Huang isn’t convinced
    1h 46min ago
    Taiwan's foundry industry remains irreplaceable with strong export growth in October 2025
    1h 46min ago
    Huawei drives Shenzhen to become China's second largest IC design hub in 2025
    1h 46min ago
    What does Wei-ren Luo wants to achieve in his return to Intel?
    1h 46min ago
    Apple increased A19 chip orders by 5 million units, prompting TSMC to adjust capacity
    1h 46min ago
    Supply chain disruption from Nexperia issue boosts chip orders for Taiwanese suppliers
    1h 46min ago
    NEWS TAGGED PACKAGING
    Friday 31 October 2025
    TSMC's profit engines: Nvidia and Apple orders exceed 40% of revenue
    TSMC has secured a record-breaking performance for 2025, with profits reaching NT$1.21 trillion (approx. US$39.4 billion) in the first three quarters, already surpassing full-year...
    Friday 31 October 2025
    UMC and Samsung present advanced packaging trends at APDC 2025
    STATS ChipPAC held the Advanced Packaging Developer Conference 2025 (APDC 2025) at Resorts World Sentosa Convention Center in Singapore to explore the future of semiconductor packaging...
    Friday 31 October 2025
    Samsung Foundry rebounds on Tesla, Qualcomm orders
    Samsung Electronics' foundry unit has recently secured major customer orders, signaling a recovery in progress. With clients like Tesla and Qualcomm joining, the company appears poised...
    Friday 31 October 2025
    What India's latest PCB drive means for its semiconductor supply chain growth
    India's newly approved multilayer and high-density interconnect (HDI) printed circuit board (PCB) projects mark a crucial upstream shift in the country's electronics manufacturing...
    Thursday 30 October 2025
    Singapore leverages advanced packaging to capture share of US$1 trillion chip market
    Terence Gan, Executive Director of Singapore's Institute of Microelectronics (IME), delivered a confident address at the 2025 Advanced Packaging Developers Conference (APDC), unveiling...
    Thursday 30 October 2025
    STATS ChipPAC targets 600mm panel-level packaging in roadmap for next-generation AI chips

    Dr. Nokibul Islam, Senior Director at STATS ChipPAC, presented the company's advanced packaging technology roadmap at the 2025 Advanced...

    Thursday 30 October 2025
    STATS ChipPAC CTO: Scaling innovation defines AI and HPC's next era
    IK Shim, Chief Technology Officer of STATS ChipPAC, opened the 2025 Advanced Packaging Developers Conference (APDC) with a clear message: the semiconductor industry's greatest challenge...
    Thursday 30 October 2025
    Commentary: China's JCET bets on AI to challenge global packaging giants
    Artificial intelligence (AI) is reshaping the global semiconductor supply chain and accelerating transformation in IC packaging and testing. As Qualcomm moves into the AI data center...
    Thursday 30 October 2025
    JCET unveils Singapore blueprint for next-gen semiconductor packaging
    Rising demand for AI, 5G, and high-performance computing (HPC) chips is turning advanced packaging into a key front in the semiconductor race. China's largest OSAT provider and the...
    Thursday 30 October 2025
    Glass substrates edge toward prime time in PCB and chip packaging sector

    As Moore's Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of...

    Wednesday 29 October 2025
    Unified packaging standards seen as key to meeting AI and automotive demands
    Taiwan's printed circuit board (PCB) manufacturers and outsourcing semiconductor assembly and test (OSAT) providers are positioned for significant growth driven by artificial intelligence...
    Wednesday 29 October 2025
    Intel shifts assembly and testing to Vietnam, plans tech talent recruitment
    Intel is planning to relocate part of its assembly, packaging, and testing capacity to Vietnam as part of a global strategic adjustment aimed at optimizing its manufacturing layout...
    Wednesday 29 October 2025
    Commentary: Lessons from Arm China and Nexperia’s unraveling

    Over the past decade, China's tech sector has surged across chip design, foundry, and packaging. Yet beneath the slogan of "technological...

    Wednesday 29 October 2025
    Powertech secures full FOPLP bookings ahead of US$1B expansion
    Powertech Technology Inc. (PTI), a leading memory packaging and testing provider, is fast-tracking its move into fan-out panel-level packaging (FOPLP). Chairman DK Tsai said the company's...
    Wednesday 29 October 2025
    Hanmi eyes AI chip packaging amid HBM market challenges
    Hanmi is expanding beyond its leading position in high-bandwidth memory (HBM) bonding equipment to enter the system semiconductor equipment sector, driven by growing demand and technological...
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    BIZ FOCUS
    Oct 2, 10:32
    SK Group partners with OpenAI to advance global AI infrastructure
    Thursday 30 October 2025
    Asian Power Devices Officially Launches New Vietnam Factory, Setting a New Global Production Milestone
    Thursday 30 October 2025
    BIWIN Mini SSD Named to TIME's 'Best Inventions of 2025'
    Thursday 23 October 2025
    Femtometrix Honored by the World's Leading Memory Manufacturer, for Pioneering Optical Process Control Technologies
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