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    Faraday Technology posts profit decline in the first quarter as gross margin hits 13-quarter high
    1min ago
    NetApp inks four-year deal with Google Cloud to bring sovereign private clouds to air-gapped environments
    4min ago
    Hotai warns hybrid vehicle shortages could persist through 2027 amid high oil prices
    6min ago
    Europe turns into battleground as Chinese automakers surge and Kia trims price gap
    9min ago
    Samsung exits China's TV and appliance market to double down on US growth
    14min ago
    Toyota leans on hybrids and affordable sedans to hit record global sales
    14min ago
    Lexus launches eighth-generation ES in Taiwan with hybrid share nearing 60 percent
    19min ago
    OpenAI revises five core principles, signaling tougher competitive posture and oversight
    21min ago
    Commentary: DeepSeek V4 and Huawei’s Ascend challenge Nvidia’s inference in China
    Apr 28, 19:32
    Universal Microwave Technology unveils mystery customer with ties to SpaceX
    Apr 28, 19:32
    FCC expands non-US network gear ban to mobile hotspots and home CPE
    Apr 28, 19:32
    Memory supplier locks in capacity through 2027
    Apr 28, 19:32
    Vera Rubin rack may consume LPDDR equal to 4,500 smartphones, sparking panic buying
    Apr 28, 19:32
    China's GPU quartet clear IPO hurdles, but cluster stability remains a challenge
    Apr 28, 19:32
    NEWS TAGGED PACKAGING
    Monday 13 April 2026
    TPK and ASE to launch advanced semiconductor TGV packaging with 3Q26 pilot line
    Touch panel maker TPK is partnering with semiconductor packaging giant ASE to enter the advanced through-glass via (TGV) packaging technology sector, focusing on developing glass substrates...
    Monday 13 April 2026
    FormFactor and MPI vie to break SiPh test bottleneck as ficonTEC reportedly exits
    As AI data centers officially enter the silicon photonics (SiPh) era, the industry faces severe challenges in testing accuracy and throughput on the path toward mass production of...
    Sunday 12 April 2026
    China's Hwatsing ships 1,000th CMP system, targets advanced chip manufacturing growth

    Hwatsing Technology has emerged as one of China's most prominent domestic suppliers of chemical mechanical planarization (CMP) equipment,...

    Saturday 11 April 2026
    ASE leads US$3.4B advanced testing push in Renwu
    Global OSAT leader ASE continued its expansion into advanced processes as its subsidiary ASE Test held a groundbreaking ceremony on April 10, 2026, at the Renwu Industrial Park. ASE...
    Friday 10 April 2026
    Merck's material and equipment push could speed CPO and advanced packaging adoption
    Merck presented integrated materials and inspection tools at Touch Taiwan 2026 as the panel industry pivots toward chip-on-panel (CPO) and advanced packaging. The company emphasized...
    Friday 10 April 2026
    China OSATs step up investment drive as AI demand lifts advanced packaging race

    China's outsourced semiconductor assembly and test (OSAT) sector is accelerating capacity expansion and technology upgrades, with leading...

    Friday 10 April 2026
    Exclusive: SpaceX delays FOPLP, PCB yield as execs plan April Taiwan visit
    Elon Musk's SpaceX is facing production challenges at its newly built fan-out panel-level packaging (FOPLP) and printed circuit board (PCB) factories in Texas, delaying full-scale...
    Friday 10 April 2026
    CoWoS capacity emerges as AI bottleneck as TSMC’s advanced packaging grows at 80% CAGR
    Global advanced packaging capacity is currently in severe shortage. Nvidia has already reserved most of TSMC's leading-edge capacity, particularly its CoWoS packaging technology. According...
    Friday 10 April 2026
    Exclusive: Samsung weighs Vietnam semiconductor testing facility

    According to sources familiar with the matter, Samsung is in discussions with the Vietnamese government...

    Friday 10 April 2026
    AUO eyes CPO and LEO satellites as Innolux pushes FOPLP growth
    AUO and Innolux are accelerating their expansion beyond traditional display panels, with Innolux's non-display revenue surpassing 51% in 2025, mainly driven by automotive applications...
    Thursday 9 April 2026
    Corning's shift into AI server components could reshape data-center energy and supply-chain dynamics
    Corning marks its 175th anniversary in 2026, celebrating a long history of materials innovation that began with contributions to Thomas Edison's light bulb and later the optical fiber...
    Thursday 9 April 2026
    Geopolitics and AI is redrawing the global chip packaging landscape
    The AI computing boom is reshaping where semiconductors get packaged. Geopolitical pressure and supply chain diversification are pushing capacity well beyond its traditional strongholds...
    Wednesday 8 April 2026
    Corning to showcase breakthrough tech at Touch Taiwan 2026
    Corning will present materials and connectivity innovations at Touch Taiwan 2026 in support of global AI infrastructure, semiconductor packaging, and consumer electronics supply chains,...
    Wednesday 8 April 2026
    Intel and Musk's Terafab revive IDM collaboration as chipmaker pushes turnaround
    Intel's industrial ecosystem is converging on a vertically integrated chip model, as Intel joins the Terafab project led by SpaceX, xAI, and Tesla—marking both a revival of the...
    Tuesday 7 April 2026
    FOPLP and WMCM emerge as key to fan-out packaging competitive field
    The advanced packaging market is entering a structural turning point. Among emerging technologies, fan-out packaging has hit a sweet spot between cost and performance, making it a...
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook