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    LG Electronics's three strategies to counter competition from Chinese brands
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    China's SeeYA wins Meta’s MR panel order as BOE misses certification
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    Qualcomm says HBC memory architecture offers better value than HBM as hyperscalers show interest
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    InP enters a capacity race as TCL moves into indium phosphide laser chips
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    Taiwan’s semiconductor materials sector sees opportunity in advanced packaging and CPO
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    Huawei lifted R&D spending to push AI chips and semiconductor self-reliance
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    NEWS TAGGED PACKAGING
    Monday 24 August 2026
    ASE's Huang urges AI profits to fund R&D for CPO, PLP

    As chip processes move to 2nm and advanced packaging accelerates heterogeneous integration, semiconductor materials are shifting from...

    Monday 24 August 2026
    AI packaging demand exposes supply-chain gaps for Taiwan materials makers
    AI demand is pushing semiconductor manufacturing deeper into advanced packaging, and ASE vice president Hiro Huang said suppliers are meeting less than half of overall demand. He warned...
    Monday 24 August 2026
    AI accelerator shipments are set to turn advanced packaging into the next battleground: Counterpoint
    AI accelerator shipments are expected to reshape semiconductor demand worldwide, with implications for cloud operators, memory suppliers, and device makers in every major market. Counterpoint...
    Monday 24 August 2026
    CPO hurdles linger as 800G and 1.6T SiPh surge, says analyst
    Challenges around co-packaged optics (CPO) remain unresolved, but they have not slowed the rapid rise of 800G and 1.6T silicon photonics, DIGITIMES analyst Kiwi Hsu said on August...
    Saturday 22 August 2026
    Manz Asia says yield is key to glass core mass production
    As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies...
    Friday 21 August 2026
    Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge
    The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES,...
    Friday 21 August 2026
    JCET profit surges 79% on AI demand, with advanced packaging and CPO gaining scale

    JCET Group reported record first-half revenue for 2026, with demand from artificial intelligence infrastructure and high-performance...

    Friday 21 August 2026
    FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production

    Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus...

    Friday 21 August 2026
    Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains
    The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...
    Friday 21 August 2026
    SK hynix outlines CPO roadmap as AI computing shifts from chips to systems
    SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory...
    Friday 21 August 2026
    Micron launches long-horizon research hub to push memory and AI development
    Micron's new US research hub could influence how future AI systems are built, stored, and scaled, with implications that extend well beyond America. The planned US$10 billion effort...
    Friday 21 August 2026
    JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging
    JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities...
    Friday 21 August 2026
    Kenmec surges on AI, advanced packaging to record orders, revenue

    Fueled by robust global demand for artificial intelligence and the rapid expansion of semiconductor advanced packaging capacity, Kenmec...

    Thursday 20 August 2026
    Samsung to break ground on KRW6 trillion Onyang HBM packaging plant in September
    Samsung Electronics will break ground in September on a KRW6 trillion (approx. US$4.31 billion) HBM production and advanced-packaging facility at its Onyang campus in Asan, South Korea,...
    Thursday 20 August 2026
    PGC Helps Startups Accelerate ASIC Development with Turnkey Services

    With more than 35 years of experience in ASIC design services, Progate Group Corporation (PGC, TPEx: 8227), a member of the TSMC Design Center Alliance (DCA) and a Synopsys...

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    GlobalExhibition
    BIZ FOCUS
    Sep 1, 08:00
    Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing
    Monday 31 August 2026
    NewPower Worldwide expands credit facility to $750M for growth
    Monday 31 August 2026
    Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON
    Thursday 27 August 2026
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
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