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    NEWS TAGGED PACKAGING
    Thursday 2 April 2026
    TSMC says COUPE platform set for production as Samsung outlines SiPh push

    TSMC said its COUPE silicon photonics platform is set to enter volume production this year, as rising demand for high-speed interconnects...

    Wednesday 1 April 2026
    SiPh and advanced packaging shine at Touch Taiwan
    The annual Touch Taiwan exhibition will take place April 8-10, 2026, featuring over 300 companies from 12 countries across 820 booths. Jim Hung, chairman of the TDUA, highlighted that...
    Wednesday 1 April 2026
    Taiwan panel leaders pivot: AUO targets CPO, Innolux advances FOPLP
    Taiwan's panel industry is undergoing a collective transformation, with its two major players adopting distinct technology paths.
    Wednesday 1 April 2026
    TSMC eyes SiPh breakthrough as industry consensus forms
    TSMC is advancing its silicon photonics (SiPh) advanced packaging platform, Compact Universal Photonic Engine (COUPE), shifting from development to commercial mass production. TSMC...
    Wednesday 1 April 2026
    Top 10 Chart: Taiwan's chip toolmakers re-rated as AI bottlenecks trump scale
    The first quarter of 2026 has marked a decisive shift in how Taiwan's semiconductor equipment sector is valued. While February's accumulated revenue rankings continue to reflect the...
    Tuesday 31 March 2026
    Global Foundry 2.0 market climbs to record US$320 billion in 2025 revenue
    The semiconductor industry has formally entered the Foundry 2.0 era, a phase defined by the deep integration of manufacturing, assembly, and testing, profitably driven by the global...
    Monday 30 March 2026
    Samsung reportedly aims to begin silicon photonics mass production in 2028
    Samsung Electronics plans to mass-produce silicon photonics starting from 2028, a move that could reshape global data-center networking, AI hardware integration, and foundry competition...
    Monday 30 March 2026
    SEMICON China 2026: JCET CEO makes the case for atomic-level packaging to carry Moore's Law forward
    Advanced wafer manufacturing is approaching physical limits near the 1nm node, according to Zheng Li, director and CEO of JCET Group.
    Sunday 29 March 2026
    AMD, Meta reportedly audit Samsung HBM4 lines as supply shifts from pledges to validation

    Samsung Electronics' next-generation high-bandwidth memory (HBM4) program is entering a customer validation phase, according to...

    Saturday 28 March 2026
    Samsung bets on turnkey strategy as non-memory strength becomes critical
    Samsung Electronics is aggressively pushing its semiconductor "super-gap" core strategy centered on a turnkey solution model. However, the success of this approach hinges on restoring...
    Friday 27 March 2026
    C SUN invests in Contrel, cementing role in G2C+ semiconductor alliance
    C SUN and Contrel have announced a significant equity partnership, as C SUN agreed to invest approximately NT$1.02 billion (approx. US$32 million) as a strategic investor to acquire...
    Friday 27 March 2026
    Innolux sells Fab 2 to SPIL
    Innolux is selling multiple factories to strengthen its financial position and operations. Following an announcement of a standard factory sale to ChipMOS, Innolux disclosed on March...
    Friday 27 March 2026
    Semicon China 2026: AI drives semiconductor market to US$1.8 trillion by 2030, China leads capacity and equipment
    AI computing is pushing the semiconductor industry into a structural growth phase, reshaping global capacity and technology pathways, according to Lily Feng, President of SEMI China,...
    Thursday 26 March 2026
    Innos set for late April listing on TPEx, riding advanced packaging boom
    Probe card automation equipment maker Innostar Service (Innos) is expected to list on the Taipei Exchange (TPEx) main board in late April 2026. With artificial intelligence (AI) applications...
    Thursday 26 March 2026
    SEMICON China opens with focus on AI chips and advanced packaging
    SEMICON China 2026 opened on March 25 in Shanghai, as the global semiconductor industry enters a new expansion cycle fueled by the rapid rise of artificial intelligence.
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook