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    Memory price hikes squeeze Samsung smartphone HDI supply
    5h 28min ago
    Samsung foundry S5 shift to DRAM faces major hurdles
    5h 28min ago
    Chinese smartphone price hikes hit Southeast Asia shipments
    5h 28min ago
    China semiconductor equipment makers expand localization into advanced packaging
    5h 28min ago
    Analysis: can Taiwan’s research institutes follow imec’s EUV model?
    5h 28min ago
    South Korea confirms US request for expanded semiconductor investment
    5h 28min ago
    NEWS TAGGED PACKAGING
    Wednesday 2 September 2026
    Manz Asia Broadens ECD Platform for Mass Panel-Level Packaging

    Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands. As...

    Wednesday 2 September 2026
    Nvidia pushes into HBM base dies as NVHBM battle heats up
    The competition in high-bandwidth memory (HBM) is moving beyond DRAM stack height, bandwidth, and packaging to the base die at the very bottom of the package. As Nvidia pushes its...
    Tuesday 1 September 2026
    Samsung Electro-Mechanics takes glass substrates to Semicon Taiwan
    As AI packages grow larger, the next substrate battleground is rapidly extending from traditional organic materials to glass. Samsung Electro-Mechanics (SEMCO) will make its first...
    Tuesday 1 September 2026
    TSMC delays CoWoS orders as CoPoS plans take shape
    TSMC's reported delay in placing 2027 advanced packaging equipment orders has sparked market speculation that the company sees excess CoWoS capacity ahead. But equipment suppliers...
    Tuesday 1 September 2026
    JCET lifts 2026 capex to CNY10 billion as AI packaging demand outruns forecasts
    JCET Group is sharply increasing spending as demand for artificial intelligence strains advanced packaging capacity worldwide. The Chinese chip tester and assembler said the shift...
    Tuesday 1 September 2026
    Taiwan's G2C+ Alliance members target global markets
    Artificial intelligence (AI) chips are driving a new wave of integration competition among Taiwan semiconductor equipment makers. Taiwan's G2C+ strategic alliance, comprised of C Sun,...
    Tuesday 1 September 2026
    Semicon Taiwan 2026 to spotlight AI-driven semiconductor supply chain shifts
    Semicon Taiwan 2026 is set to open soon as Semiconductor Equipment and Materials International said AI is pushing a new wave of technology upgrades across the global chip industry...
    Tuesday 1 September 2026
    Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing

    As transistor scaling becomes more difficult and costly, advanced packaging has become one of the most important paths for extending Moore's Law. Technologies such as...

    Tuesday 1 September 2026
    Chinese OSAT earnings surge on AI packaging demand, but recurring profit tells a narrower story
    Five listed Chinese outsourced semiconductor assembly and test providers reported first-half 2026 results in the last two weeks of August, showing net profit growth of up to 317%,...
    Monday 31 August 2026
    Gudeng sees double-digit advanced packaging growth from 2027
    Demand for AI and high-performance computing (HPC) continues to drive semiconductor process development, with advanced nodes and advanced packaging entering a new cycle of capacity...
    Monday 31 August 2026
    TSMC tackles the AI I/O wall with two COUPE bandwidth paths and deeper heterogeneous integration
    TSMC is sharpening its silicon photonics (SiPh) roadmap to address the widening gap between AI compute growth and chip-to-chip data movement, unveiling two bandwidth-scaling paths...
    Monday 31 August 2026
    ASE: CPO scale-out demands deeper supply-chain coordination for mass production
    SEMICON Taiwan 2026 kicked off its pre-show program with the Silicon Photonics Global Summit.
    Monday 31 August 2026
    Shanghai's 15th Five-Year Plan bets on chips, AI, advanced packaging
    On August 26, the Shanghai municipal government released its 15th Five-Year Plan for the Development of Strategic Emerging Industries, setting a target for added value in strategic...
    Monday 31 August 2026
    South Korea risks 'HBM 2.0' trap in emerging CPO market
    Co-packaged optics (CPO) is emerging as a critical next-generation technology for AI infrastructure, but unless South Korea strengthens its integration and validation capabilities,...
    Monday 31 August 2026
    Weekly news roundup: US pressures Korea chip investment, MediaTek wins Google TPU, Apple debuts 2nm M6
    Semiconductor investment, AI chips, advanced packaging and data center infrastructure dominated the week, with South Korea facing US pressure, India scaling chip manufacturing, and...
    4/71 pages
    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
    Wednesday 2 September 2026
    DAS Introduces ALCEA for Integrated NOx Treatment in Semiconductor Fabs
    Semicon_TW