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NEWS TAGGED PACKAGING
Wednesday 27 December 2023
ASE to acquire facilities from subsidiary for packaging capacity expansion
OSAT Advanced Semiconductor Engineering (ASE) will acquire facilities from its fully-owned subsidiary ASE Test to boost packaging capacity, according to the former's parent company,...
Tuesday 26 December 2023
Innolux to launch semiconductor advanced packaging mass-production 2H24
Industry sources indicate that Taiwan-based panel maker Innolux has received orders occupying the entire capacity of its first-phase chip-first advanced fan-out panel level packaging...
Monday 25 December 2023
Taiwanese FCCL, communication antenna suppliers optimistic about 2024 shipment prospects
Taiwan's flexible copper clad laminate (FCCL) supplier Taiflex Scientific, and microwave RF communication substrate and PCB maker New Era Electronics, are both optimistic about the...
Thursday 21 December 2023
Chinese packaging and testing providers venture into SEA amidst geopolitical tensions
Over the past two years, due to the pandemic's impact on supply chains and instability factors like the Russia-Ukraine war and US-China tensions, chipmakers have taken actions to...
Wednesday 20 December 2023
Winbond, PTI team up for 2.5/3D packaging
Winbond Electronics, a Taiwan-based memory chipmaker, has signed a letter of intent to collaborate with OSAT Powertech Technology (PTI) to jointly develop 2.5D and 3D advanced packaging,...
Wednesday 20 December 2023
Taiwan's NSTC offers grants for local heterogeneous integration and advanced packaging EDA tools
The US Defense Advanced Research Projects Agency's (DARPA) 2023 Electronic Resurgence Initiative 2.0 has inspired Taiwan to develop its electronic design automation tools for heterogeneous...
Tuesday 19 December 2023
Why would China send GPUs to Malaysia for advanced packaging?
A Reuters report quoted three people familiar with the fact that more and more Chinese IC design houses are having their chips packaged in Malaysia, worrying that the US...
Tuesday 19 December 2023
Strong high-end packaging demand to buoy Winstek in 2024
Taiwan-based IC backend firms, including Winstek Semiconductor (formerly STATS ChipPAC Taiwan), are positioning themselves to take advantage of robust demand for high-end packaging...
Wednesday 13 December 2023
GenAI drives HBM packaging innovation: SK Hynix and Micron forge ahead, Samsung seeks new path
In the race for dominance in high-bandwidth memory (HBM), SK Hynix and Micron have already established the direction for the next generation of HBM packaging technology. However,...
Tuesday 12 December 2023
Memory market rebound continues, but challenges linger despite upward price trend
Memory prices have shown a robust upward trend since bottoming out in the second quarter of 2023. While November saw NAND flash prices rebound to early 2023 levels, DRAM and NAND...
Friday 1 December 2023
Amkor announces US advanced packaging and test facility, Apple to be its first customer
Amkor Technology has announced plans to construct an advanced packaging and test facility in Peoria, Arizona. Amkor expects to invest around US$2 billion and employ approximately...
Friday 1 December 2023
Samsung ramps up 2.5D packaging capacity, eyeing Nvidia AI GPU orders
Samsung Electronics is not only investing actively in the R&D and capacity expansion of high-bandwidth memory (HBM) technology, but also looking to broaden its market reach through...
Friday 1 December 2023
BIWIN packaging and testing center achieves IATF 16949 recognition
BIWIN Storage Technology Co., Ltd. (referred to as BIWIN) focuses on the research and development, packaging and testing, and manufacturing of memory chips. It is recognized as a...
Tuesday 28 November 2023
Samsung unveils ambitious 'GDP' semiconductor strategy targeting AI market growth
Samsung Electronics executives have recently disclosed their 2024 semiconductor strategy, named "GDP" (Gate-All-Around, DRAM, and Packaging), at an investors forum, aiming to tap...
Monday 27 November 2023
India's Kaynes SemiCon plans first OSAT line in April, eyes advanced packaging tech partnerships
India's efforts to build a semiconductor manufacturing ecosystem have seen numerous companies enter the semiconductor packaging segment. One of them, Kaynes SemiCon, has revealed...
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Summary of Tech Supply Chain News!
Taiwan foundry industry revenues to slip in 1Q24 before rising in 2Q24, says DIGITIMES Research
Research Insight: Intel obtains subsidies but faces challenges
South Korea-based makers lead transparent display as China-based competitors ramp up Inkjet investments, according to DIGITIMES Research