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    Micron exits Crucial consumer market amid shift to AI-driven memory demand
    Dec 4, 18:51
    Infineon builds GaN patent barriers, forcing clear IP boundaries for major players
    Dec 4, 18:51
    GaN supply chain reshaped: AI demand drives Western firms to rely on China
    Dec 4, 18:51
    Exclusive: Ex-TSMC R&D VP talks advanced packaging and CoWoS
    Dec 4, 18:51
    China's rare metal export restrictions create global supply gap benefiting Taiwan metal firm
    Dec 4, 18:50
    China faces AI data center overcapacity and low utilization amid rising compute demand
    Dec 4, 18:50
    NEWS TAGGED PACKAGING
    Thursday 13 November 2025
    Boschman - providing packaging solutions for auto & industrial power modules

    Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial...

    Thursday 13 November 2025
    HQ Pack - global full-service provider of high-tech packaging from design to reuse

    HQ Pack is a global leader in high-tech packaging solutions. The company is expert at designing, producing, (precision) cleaning, and making packaging solutions reusable...

    Thursday 13 November 2025
    India's Kaynes Semicon outlines OSAT roadmap from power to advanced packaging
    Kaynes Semicon, the semiconductor division of India's Kaynes Technology, is expanding beyond its success in power module packaging toward advanced chiplet and co-packaged optics as...
    Wednesday 12 November 2025
    SK Hynix reportedly developing high-bandwidth storage to boost smartphone AI performance
    SK Hynix is reportedly developing a new hybrid memory platform that combines mobile DRAM and NAND flash to accelerate on-device artificial intelligence in smartphones and tablets,...
    Tuesday 11 November 2025
    ASML tackles AI's 'scissor gap' with dual-track chip strategy
    ASML EVP and China head Shen Bo said artificial intelligence is redefining the global semiconductor landscape, pushing chipmakers and equipment suppliers to balance growing computing...
    Monday 10 November 2025
    TSMC breaks one record after another: AI demand powers October revenue height, CEO confident streak will continue
    TSMC posted record consolidated revenue of NT$367.47 billion (US$11.87 billion) in October 2025, up 11.0% from September and 16.9% from a year earlier. The result highlights the company's...
    Monday 10 November 2025
    Ableprint reports record third quarter revenue despite regulatory search
    Ableprint, a supplier of advanced semiconductor packaging bubble-removal equipment, reported record-high revenue in the third quarter of 2025, underscoring its strong position in...
    Sunday 9 November 2025
    AI bubble concerns mount amid 2026 shipment uncertainty
    AI-related products have become a key growth engine for Taiwan's economy, being a major driver of Taiwan's exports in 2024 and boosting investment in 2025. However, as companies continue...
    Friday 7 November 2025
    Advanced packaging emerges as AI's next performance frontier, insights from DIGITIMES analyst Tony Huang
    As Moore's Law slows, advanced packaging has become the critical lever driving breakthroughs in AI chip performance, according to DIGITIMES chief semiconductor analyst Tony Huang...
    Friday 7 November 2025
    Foxconn board member urges Taiwan to speed system design amid Moore's law slowdown
    The global semiconductor industry is undergoing a structural shift as the AI era fully unfolds. Foxconn board member and former TSMC co-COO Shang-Yi Chiang stated that with Moore's...
    Friday 7 November 2025
    AP Memory revenue doubles as S-SiCap enters growth phase, eyes higher 4Q25
    Memory design IC firm AP Memory reported consolidated revenue of NT$1.495 billion (US$48.3 million) in the third quarter of 2025, up 17.3% year-over-year, driven by multiple interposers...
    Friday 7 November 2025
    CXMT adopts SK Hynix's MR-MUF tech to close China's HBM gap by 2026
    China's DRAM maker CXMT plans to start mass production of fourth-generation high-bandwidth memory (HBM3) in 2026 using mass reflow molded underfill (MR-MUF) packaging, the same technology...
    Friday 7 November 2025
    ASE unveils AI-enhanced IDE 2.0 to accelerate chip design and packaging
    ASE has announced a significant upgrade to its in-house integrated design ecosystem (IDE) platform, introducing IDE 2.0, which features AI integration to speed up design iterations...
    Thursday 6 November 2025
    ASML reframes its China strategy with advanced packaging debut of TWINSCAN XT:260
    ASML has introduced the TWINSCAN XT:260, its first lithography system purpose-built for 3D integration and advanced packaging. The launch marks a major step beyond front-end wafer...
    Tuesday 4 November 2025
    Chinese PCB firms quietly advance next-gen CoWoP packaging
    A significant divergence emerged as Taiwan and China concluded their major PCB industry exhibitions in late October 2025. While Taiwanese manufacturers focused on supply bottlenecks...
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    Research Report Database
    BIZ FOCUS
    Nov 26, 08:00
    Facing the rise of AI, how does Global Instrument Technology leverage Chunghwa Telecom's IDC for the manufacturing industry's AI-driven transformation
    Wednesday 26 November 2025
    GaNrich Delivers Portfolio from 40V to 1200V For the Data Center HVDC Architecture
    Wednesday 26 November 2025
    Smart dining transformation accelerates: ASUS IoT IoRT solutions enhance operational efficiency in chain restaurants
    Tuesday 25 November 2025
    ASUS IoT AISEHS raises intelligent security standards, helping semiconductor industry move from passive to active protection
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