Poland's aspirations to become a European AI leader have hit a significant roadblock following new US export controls on advanced technology. According to the Polish Press Agency...
GlobalFoundries has unveiled plans to invest US$575 million in a cutting-edge advanced packaging and photonics center at its Malta, New York, facility. This ambitious project is designed...
The US Department of Commerce announced on January 16, 2025, that the CHIPS Program's National Advanced Packaging Manufacturing Program (NAPMP) has finalized US$1.4 billion in awards...
TSMC CEO C.C. Wei has dismissed recent market speculation indicating Nvidia is cutting back its demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging capacity.
The accelerating global digital transformation has positioned storage devices as no longer merely tools for data storage but as critical cornerstones for facilitating information...
TSMC is intensifying its localization efforts, with a growing emphasis on sourcing raw materials from local suppliers—a proportion set to increase steadily year over year. This...
NVIDIA founder and CEO Jensen Huang visited Taichung on January 16, with his first stop being the new Tan-Ke factory of Siliconware Precision Industries (SPIL), a leader in global...
Nvidia CEO Jensen Huang's visit to Siliconware Precision Industries (SPIL) on his current trip to Taiwan has garnered market attention to the company's emphasis on advanced packagi...
Advanced packaging demands are driving consistent growth in semiconductor material demand, with distributors reporting strong contributions from the sector. Demand for high-end materials...
Samsung Electro-Mechanics is leveraging its multilayer ceramic capacitor (MLCC) expertise to venture into the energy sector, specifically targeting the development of small all-solid-state...
Nvidia CEO Jensen Huang's first stop in Taiwan is confirmed to be Taichung. According to an announcement from ASE Holdings' subsidiary SPIL, on the afternoon of January 16, Huang...
TSMC has maintained its equipment orders, despite market rumors regarding a decrease in demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging from Nvidia. According to sources at...
Malaysian Prime Minister Anwar Ibrahim has announced plans to leverage the country's geographical advantages and recent foreign investments to position Malaysia as a hub for energy...
Driven by rising demand in artificial intelligence (AI), advanced packaging, advanced processes, and automotive electronics, inspection labs specializing in IC materials, including...
TSMC is set to achieve new revenue and profit records in 2024, driven by strong AI orders, according to industry sources. The pure-play foundry continues to accelerate its advanced...
