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Wednesday 25 October 2023
Faraday expects 4-6% revenue drop in 4Q23
Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, expects to post a revenue decrease of 4-6% sequentially in the fourth quarter of 2023.
Wednesday 25 October 2023
WinWay Technology takes the lead in CPO, silicon photonics advanced packaging
High-speed data transmission has come into the spotlight along with cloud-based AI accelerator chips as one of the most vital capabilities in the electronics industry, and silicon...
Wednesday 25 October 2023
AI to boost terminal device replacement
AI will drive demand for PC, handset, and other terminal device replacements, according to sources at chipmakers.
Wednesday 25 October 2023
Chinese OSATs expanding production capacity in Jiangyin
Chinese OSATs such as JCET are expanding their capacity in the city of Jiangyin on China's east coast, according to industry sources. Their expansion focuses on advanced packaging.
Tuesday 24 October 2023
Ansys semiconductor simulation tools certified for UMC WoW advanced packaging
United Microelectronics (UMC) has certified Ansys' multiphysics solutions to simulate the foundry's latest 3D-IC WoW stacked technology, which will improve the power, efficiency,...
Tuesday 24 October 2023
Equipment supplier C Sun upbeat about advanced packaging demand
Robust demand for CoWoS and other advanced packaging will positively contribute to C Sun Manufacturing's sales operations in the second half of this year, according to the semiconductor...
Thursday 19 October 2023
TSMC expects 11% sequential revenue growth in 4Q23
TSMC expects to post revenues of between US$18.8 billion and US$19.6 billion in the fourth quarter of 2023, which is an 11.1% sequential increase at the midpoint. Gross margin and...
Friday 13 October 2023
Samsung set to roll out HBM4 in 2025 incorporating advanced packaging solution
Samsung Electronics has unveiled a strategic memory roadmap, aiming to release a new generation of high-bandwidth memory (HBM) product, HBM4, by the year 2025. In this ambitious endeavor,...
Friday 13 October 2023
Packaging materials demand decelerates
Packaging materials suppliers have seen customers slow down their pace of orders in the fourth quarter, and may encounter a decline in revenue compared to the previous quarter, according...
Friday 13 October 2023
Chinese packaging companies launch 4th round of price hikes amidst decline in LED profits
With market demand weak, LED manufacturers in both Taiwan and China are facing declines in revenue and profits in 2023. Although Chinese LED makers started to initiate price hikes...
Friday 13 October 2023
Amkor opens new factory in Vietnam
Amkor Technology recently inaugurated its newest manufacturing facility in Bac Ninh, Vietnam.
Wednesday 11 October 2023
TSMC to maintain 2023 outlook despite stronger 3Q
Despite better-than-anticipated third-quarter revenues, TSMC is expected to reiterate its previously stated revenue and capex projections for 2023 at its upcoming investors conference,...
Wednesday 4 October 2023
ASE intros integrated design ecosystem for advanced packaging
Advanced Semiconductor Engineering (ASE), a member of ASE Technology Holding, has announced the launch of its integrated design ecosystem (IDE), a collaborative design toolset optimized...
Tuesday 3 October 2023
Samsung, SK Hynix enhance memory packaging investments, eyeing explosive HBM demand to start in 2024
The demand for high bandwidth memory (HBM) is poised to experience explosive growth starting in 2024, fueled by its incorporation into servers hosting large language models like ChatGPT...
Monday 2 October 2023
Applied Materials cuts into supply chain for Intel glass substrate technology
Applied Materials and its equipment and materials partners have entered the supply chain for Intel's recently announced glass substrates for advanced packaging, according to industry...