Intel has invested a total of US$8 billion in Malaysia, and is committing an additional US$6 billion for the construction of new semiconductor facilities there, including a 3D advanced...
With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...
Taiwan-based Alchip Technologies, dedicated to supplying ASICs, has raised its revenue forecast for 2023 from US$800 million to between US$900 million and US$950 million.
The future car market is promising. Automotive suppliers said while the car component supply will keep fluctuating slightly in 2023, the situation will become stable in 2024.
LED chipmakers and packaging houses, including Ennostar and Everlight Electronics, are conservative about demand during the traditional peak season in the third quarter of 2023.
The AI trend is now a worldwide phenomenon, with Nvidia CEO Jensen Huang even declaring that "Nvidia is betting everything on AI." In 2023, the AI server supply chain became one of...
As the demand for AI chips surges, and TSMC's capacity of CoWos is expected to remain tight until its Tongluo facility begins operation in 2027, other "CoWos-like suppliers" are expected...
LED leadframe specialist I-Chiun Precision Industry has stepped up efforts to improve its product mixes, with plans to enhance its heatspreader output for advanced packaging, according...
Amkor Technology is ramping up its capacity for advanced packaging production, with monthly output for 2.5D packaging expected to reach 5,000 wafers in the first half of 2024, up...
Semiconductor materials distributor Wah Lee Industrial has enjoyed robust orders catering to customers' advanced packaging needs, such as TSMC's CoWoS, as a result of the AI server...
Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed...
TSMC has recently initiated a new round of orders with advanced packaging equipment suppliers including Apic Yamada, Disco, Gudeng Precision Industrial and Scientech, according to...
AMD plans to incorporate TSMC's 3D SoIC (system on integrated circuits) stacking and chiplet packaging technology into its gaming notebook processors, following the company's implementation...
Conventional wirebonding packaging demand remains sluggish, and OSATs are extremely cautious regarding the demand outlook for this year, according to industry sources.
