High bandwidth memory (HBM) has become a hot keyword in the memory industry recently. As the demand for HBM is increasing due to the AI and HPC market expansion, HBM is likely to...
Tong Hsing Electronics, a major backend services provider for CMOS image sensors (CIS), expects the handset market to remain weak throughout 2023, with demand sliding faster than...
Taiwan-based ASIC manufacturer, Faraday Technology, has experienced a significant decline in profits in Q2 this year, influenced by the revenue decrease in its three major product...
TSMC is planning to invest nearly NT$90 billion (US$2.85 billion) to establish an advanced chip packaging plant in Miaoli, northern Taiwan with the facility scheduled to begin volume...
As GPUs become essential components for artificial intelligence (AI) computing, orders for Nvidia GPUs are also garnering attention. Recently, there have been reports that Nvidia...
According to Intel, Boeing and Northrop Grumman have joined phase two of the Department of Defense's RAMP-C program, which aims to facilitate a leading-edge US foundry ecosystem on...
Seeing demand for handsets and PCs likely to remain sluggish for the second half of 2023, many semiconductor suppliers are now eyeing a recovery in the second quarter of 2024, according...
Reports stated that due to Samsung Foundry's massive improvement in its 4nm process yield rate, it has already secured an AI chip foundry order from a major data center client.
TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
System vendors are seeking capacity support from IC analysis laboratories for 2024 through their contracted IP service providers, as they foresee high demand for advanced packaging,...
IC materials distributors have enjoyed a ramp-up in orders for heat sinks, thanks to strong advanced packaging demand for HPC chips, according to industry sources.
LED packaging house Harvatek is unlikely to see its revenue grow as strong as expected in the second half as its US-based clients were conservative about demand during the peak season,...
One of AMD CEO Lisa Su's priorities for her planned mid-July visit to Taiwan will be securing TSMC's available CoWoS packaging capacity, according to sources with knowledge of the...
Samsung Electronics plans to apply its in-house developed advanced packaging technology in 3nm GAA process manufacturing by 2025, but frontend manufacturing yields continue to play...
IC verification lab Materials Analysis Technology (MA-tek) plans to allocate NT$1.2 billion (US$38.6 million) in capital expenditures for 2023, of which nearly 80% will be used to...