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Tuesday 6 August 2024
Infineon completes sale of Philippines and South Korea backend sites to ASE
Infineon Technologies has completed the sale of its two backend manufacturing sites, one in Cavite, Philippines, and one in Cheonan, South Korea, to two fully owned subsidiaries of...
Tuesday 6 August 2024
TSMC to raise quotes for 5nm, 3nm process manufacturing in 2025
TSMC has notified clients of a 3-8% price increase for its 5nm and 3nm process manufacturing in 2025 to reflect escalating costs, according to sources at IC design houses.
Monday 5 August 2024
Eyeing surging demand for AI accelerator testing, Advantest revises upward financial guidance
Advantest has significantly raised its profit forecast for the current fiscal year.
Monday 5 August 2024
Global OSAT industry revenue projected to rebound by 8%, says DIGITIMES Research
The global semiconductor market is experiencing strain as inventory adjustments across the electronics sector weigh heavily on growth. According to DIGITIMES Research, the...
Friday 2 August 2024
ASEH to set up advanced packaging fab in Japan, say sources
ASE Technology Holding (ASEH) plans to follow in TSMC's footsteps by establishing an advanced packaging fab in Kyushu, Japan, according to industry sources.
Thursday 1 August 2024
CWE, CWTC drive growth through panel-level packaging and miniLED solutions
Chang Wah Electromaterials (CWE), a Taiwanese supplier of semiconductor and electronics materials and equipment, is transitioning from 12-inch wafer-level packaging to panel-level...
Thursday 1 August 2024
CHPT forecasts Q3 growth driven by HPC demand and smartphone replacement season
Chunghwa Precision Test (CHPT), a leading probe card manufacturer, anticipates strong performance in the second half of 2024, with growth driven by increasing demand for high-performance...
Wednesday 31 July 2024
ACM launches Ultra C vac-p flux cleaning tool for chiplets, breaking into FOPLP market
ACM Research has introduced its Ultra C vac-p flux cleaning equipment, specifically designed for fan-out panel-level packaging (FOPLP). This new tool employs vacuum technology to...
Wednesday 31 July 2024
Biden administration responds to packaging and testing industry as Amkor receives subsidies from CHIPS Act
The Biden Administration has announced that the CHIPS and Science Act will subsidize US$400 million to help Amkor, the largest semiconductor packaging and testing company in the US,...
Wednesday 31 July 2024
PTI gearing up for AI SoC boom with FOPLP
Backend house Powertech Technology (PTI), with its fan-out panel-level packaging (FOPLP) technology, is targeting AI SoC market potential, and expects AI-related revenue to account...
Tuesday 30 July 2024
Amkor expects to mass produce organic interposers in early 2025
Amkor reported modest sales growth, primarily driven by surging demand for AI data centers and growth in the smartphone market. These positive factors offset declining sales in the...
Tuesday 30 July 2024
SK Hynix launches GDDR7 with up to 40Gbps speed
SK Hynix has introduced what it claims to be the industry's best-performing GDDR7, a next-generation graphics memory product.
Monday 29 July 2024
OSATs expect sales growth in 2H24
Semiconductor backend services providers generally believe sales will improve in the second half of 2024, but the strength of the growth momentum remains to be seen.
Monday 29 July 2024
Amkor granted CHIPS Act incentives for Arizona plant
Amkor Technology has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed funding as part of the CHIPS and Science Act, according...
Monday 29 July 2024
Japan bets on back-end processes to resurrect chip industry, attracting investments from TSMC, Samsung, and Intel
Japan is actively striving to revive its semiconductor industry and develop cutting-edge chips by leveraging its expertise in materials and equipment for back-end processes to venture...