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Friday 26 July 2024
TSMC Foundry 2.0 illustrates growing importance of IC backend, says ASEH
OSAT ASE Technology Holding (ASEH) has stated its enthusiasm for "Foundry 2.0," a novel concept that is designed to transform the foundry industry, which was recently announced by...
Thursday 25 July 2024
US urges Mexico to boost semiconductor investment to keep pace with heated nearshoring race
A high official of the US Agency for International Development (USAID) has recently urged Mexico to significantly increase investment in its semiconductor industry over the next two...
Thursday 25 July 2024
Nexchip joins Chinese indigenization drive with photomask production, aiming for full-service foundry status
Nexchip is expanding into photomask production, aiming to achieve mass production by the fourth quarter. This move positions Nexchip as a full-service foundry, similar to TSMC and...
Thursday 25 July 2024
AMD delays Ryzen series launch due to quality issues
AMD has postponed the Ryzen 9000 series launch due to quality issues found in initial production units. The company is replacing affected chips and has confirmed a packaging, not...
Thursday 25 July 2024
KLA sees bright future in advanced packaging and HBM, expects flat growth in China
Due to the AI-driven surge in demand for semiconductor equipment, KLA reported better-than-expected financial results. The company expects to benefit from investments in advanced...
Wednesday 24 July 2024
IC packaging will be more important than foundry, says YMTC chairman
Chen Nanxiang, chairman of Chinese memory company Yangtze Memory Technology Corp (YMTC), recently said during an interview with China Global Television Network (CGTN) that he expects...
Wednesday 24 July 2024
PTI engaged in FOPLP, seeking collaboration
Powertech Technology (PTI) is currently developing fan-out panel-level packaging (FOPLP) and seeking collaboration with fabless chip vendors, according to the Taiwan-based memory...
Wednesday 24 July 2024
FOPLP steps forward as foundries compete for packaging talents
The shortage of talent in the semiconductor industry is no longer news. Still, the continuous growth in demand for advanced packaging has triggered a mid-to-long-term scarcity of...
Wednesday 24 July 2024
Will glass substrate packaging dominate?
Glass substrates are recognized as critical materials for next-generation advanced semiconductor packaging technologies needed to support the explosive growth of AI chips.
Wednesday 24 July 2024
TSMC said to adopt larger glass substrates for FOPLP
Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing. Because of that,...
Tuesday 23 July 2024
YMTC head expects explosive chip demand in China amid US restrictions
A senior executive from a leading China-based NAND flash provider expressed optimism about the explosive growth potential of the Chinese semiconductor market, attributing this surge...
Tuesday 23 July 2024
Taiwan-based semiconductor, PCB firms expect minimal impact from US election
Despite President Joe Biden's recent announcement of his withdrawal from the 2024 race and his endorsement of Vice President Kamala Harris, Taiwan-based supply chain companies remain...
Monday 22 July 2024
Advantest Taiwan opens new HQ amid surging AI chip demand
Advantest Taiwan recently opened its new headquarters at the Tai Yuen Hi-Tech Industrial Park in Chubei, northern Taiwan. According to Alex Wu, president and CEO of Advantest Taiwan,...
Monday 22 July 2024
FOPLP under advanced packaging spotlight after CoWoS
Demands for advanced packaging services have surged as every smartphone is expected to be equipped with generative AI applications in the future. Taiwan Semiconductor Manufacturing...
Monday 22 July 2024
ThinTech eyes advanced packaging opportunities
ThinTech Materials Technology (ThinTech) anticipates stronger performance in the second half of 2024, buoyed by warming demand for panels and the successful development of Fan-Out...