Mitsubishi Materials has announced the development of the world's largest rectangular silicon substrate, a technology gaining attention due to advancements in advanced packaging....
Taiwanese IT and semiconductor equipment maker Hauman Technologies expects record revenue from its IT network division in 2024, driven by increasing demand for digital transformation...
After approving four IC backend manufacturing facilities earlier this year, India reportedly plans to provide more incentives for compound semiconductor and silicon photonics proje...
Printed circuit board (PCB) and IC substrate equipment specialist Group Up Industrial (GP) has stepped up the development of its glass substrate offering, eyeing robust demand for...
TSMC recently acquired Innolux's 5.5G LCD fab at the Southern Taiwan Science Park (STSP) for NT$17.14 billion (US$530.8 million), which includes factory buildings and associated facilities...
TSMC has received an influx of orders for CoWoS and other chipmaking equipment, the majority of which require super hot runs (SHR), according to industry sources.
Taiwanese equipment manufacturer C Sun, originally focused on the panel and PCB industries, has strategically pivoted toward the semiconductor sector. About fourteen years ago, C...
Semiconductor materials supplier Topco Scientific is keenly promoting the use of new materials for CoWoS and other advanced packaging technologies, confident in its operations and...
Packaging firm Xintec Technology is optimistic about upcoming demand for 3D sensing components packaging and 12-inch wafer testing in the third quarter, the traditional peak season...
Applied Materials reported growth across all segments, driven by AI-fueled demand and advancements in semiconductors, including gate-all-around (GAA), high-bandwidth memory, and advanced...
The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60,000 wafers per month in 2025, with a projected increase to 70,000-80,000...
