A new semiconductor back-end process R&D alliance, US-JOINT, is set to launch in Silicon Valley in 2025. The alliance will focus on next-generation semiconductor packaging technologies...
Samsung Electronics has announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer-Cube...
Samsung Electronics is reportedly developing a new packaging technology to address the overheating of mobile application processors (APs), which may be applied to its next-generation...
Under the guidance of newly appointed head Young Hyun-Jun, Samsung Electronics' Semiconductor and Device Solutions (DS) division is reportedly enhancing its competitiveness in high-bandwidth...
The 34th Academia Sinica academician and honorary academician election recently welcomed 28 new members, including Douglas Yu, Vice President of Pathfinding for System Integration...
Innolux Corporation, a leading display panel manufacturer, is undergoing a significant transformation as it ventures into the semiconductor field with its Fan-Out Panel Level Packaging...
Glass core substrates (GCS) are poised to play a crucial role in next-generation advanced chip packaging. In response, Japanese and South Korean semiconductor supply chain players...
As Apple prepares to launch its first AI smartphone in September, the third quarter is expected to see a surge in stocking demand. This has not only pushed TSMC's market value to...
As more tech firms are developing their proprietary chips for AI servers, semiconductor manufacturers, including IC backend houses, are likely to benefit from the opportunities.
Japan's major semiconductor photoresist supplier, JSR, is set to expand into chip packaging and biotech materials with substantial capital support from the government-funded Japan...
As the global supply chain undergoes restructuring, Malaysia and Singapore have emerged as attractive destinations for semiconductor companies seeking to establish manufacturing operations...
Advanced packaging for Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) has emerged as an additional forward-thinking trend, following CoWoS, InFO, and SoIC.
Taiwan Semiconductor Manufacturing Company (TSMC) remains the world's sole provider capable of delivering a complete end-to-end Chip-on-Wafer-on-Substrate (CoWoS) packaging solution...
Rumors from various sources said Huawei is partnering with Wuhan XMC to develop high bandwidth memory (HBM) to meet the robust demand for Artificial Intelligence (AI).
At the urging of customers and incentives provided by countries vying for domestic semiconductor production, leading companies in the Taiwanese semiconductor supply chain have accelerated...
