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Thursday 6 June 2024
Taiwan's GenAI ecosystem unrivaled for next decade, says former tech minister
Taiwan boasts a comprehensive Generative AI (GenAI) ecosystem, with deep deployments in AI chips, packaging, and heat dissipation technologies, and no other place in the world is...
Tuesday 4 June 2024
Laying groundwork for panel-level packaging processes, Manz deepens deployment in advanced semiconductor packaging blue ocean
As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced...
Thursday 30 May 2024
Samsung boosts workforce at Japan R&D lab to drive chips packaging innovations
Samsung Electronics has recently expanded its workforce deployment at its new packaging R&D base in Yokohama, Japan, to expedite construction and support the development of next-generation...
Thursday 30 May 2024
HBM competition (1): advanced packaging technology divergence explained
High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU...
Thursday 30 May 2024
Malaysia plots US$5.3 billion roadmap to build advanced chip ecosystem
Malaysian Prime Minister Anwar Ibrahim announced the National Semiconductor Strategy (NSS), with the government allocating MYR25 billion (US$5.3 billion) to foster industry develop...
Wednesday 29 May 2024
Nvidia jumps to FOPLP for AI server chips amid CoWoS capacity strain
Nvidia is reportedly planning to adopt Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips ahead of schedule, aimed at addressing the tight production capacity...
Tuesday 28 May 2024
Sigurd expands global customer portfolio
IC testing house Sigurd Microelectronics is growing its global customer base, actively expanding into markets beyond Taiwan.
Thursday 23 May 2024
TSMC-backed VisEra cautiously optimistic about 2024, with Longtan plant to reach full capacity in 3Q24
Optical film packaging and CMOS image sensor (CIS) back-end manufacturer VisEra held its shareholder meeting and board of directors election on May 22.
Wednesday 22 May 2024
Research Insight: G2 creates opportunities for diversified development of Vietnamese chip industry, but challenges remain
While the US-China technology rivalry and the resultant G2 framework have prompted the semiconductor industry to diversify production risks, Vietnam is emerging as an attractive location...
Wednesday 22 May 2024
Csun contributes to advanced packaging supply chain, says company president
PCB and semiconductor equipment specialist Csun Manufacturing plays an important role in the supply chain for advanced 2.5D and 3D IC packaging, said company president Frank Liang...
Monday 20 May 2024
TSMC mass produces Tesla's Dojo AI training tiles, eying 40x power boost by 2027
TSMC has started producing Tesla's next-generation Dojo AI training tiles with its InFO_SoW (Integrated Fan-Out System-on-Wafer) technology, aiming for a 40x increase in computing...
Friday 17 May 2024
Nanoimprint lithography, Canon's entry ticket into advanced semiconductor market?
Canon's semiconductor equipment business, despite representing only 7.5% of its revenue in the fiscal year 2023 (January 2023 to December 2023), achieved a profit margin of 18.6%,...
Friday 17 May 2024
Intel steps up equipment and material orders for advanced packaging
Intel has stepped up orders with several equipment and material suppliers for its next-generation advanced packaging based on glass substrate technology, which is expected to go into...
Thursday 16 May 2024
India reportedly contemplates IP pool for chip startups
Amidst endeavors to cultivate a semiconductor ecosystem, India is purportedly contemplating creating an IP pool for semiconductor startups, mirroring the approach adopted by Taiwan...
Wednesday 15 May 2024
PCB industry moves up the ladder as silicon photonics packaging demand grows
As the AI and HPC markets develop, high-performance computing is rapidly growing, driving the demand for high-speed transmission. Naturally, the complexity of chip design has also...