Although Samsung has been the subject of market rumors regarding Nvidia's placement of its 2.5D packaging orders, industry sources recently said there is no information regarding...
TSMC's advanced packaging CoWoS capacity continues to have strong demand. Even after doubling its capacity in 2024 and collaborating with OSAT companies, it can still not fully meet...
The US Department of Commerce (DOC) and Samsung Electronics signed a non-binding preliminary memorandum of terms (PMT) on April 15 to provide up to US$6.4 billion in direct funding...
Advanced chip manufacturing and advanced packaging have now become the focus of attention in China. SMIC already confirmed that it had adopted deep ultraviolet (DUV) lithography machines...
According to TSMC's announcement of a third fab for 2nm and more advanced chips, as well as Amkor Technology's intentions to develop an advanced packaging fab in Arizona, advanced...
Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging...
SK Hynix recently announced plans to invest an estimated US$3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.
As we enter the second quarter, AI remains a focal point in the market. Nvidia, AMD, and Intel have successively released high-end chips, and with the gradual recovery of consumer...
In the burgeoning Low-Earth Orbit (LEO) satellite market, Taiwanese manufacturers have traditionally found their niche in subcontracting component assembly and antenna integration,...
SK Hynix is expanding the High Bandwidth Memory (HBM) contribution to its DRAM revenues and expects a deepening effect of the customization trend of HBM.
Following the plan to construct an advanced semiconductor packaging facility in Indiana, United States, SK Hynix recently detailed its site selection in West Lafayette, as reported...
Chang Wah Electromaterials (CWE) has signed a five-year syndicated loan agreement for NT$3 billion (US$94 million) with 12 local banks in Taiwan, according to the semiconductor materials...
