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Chinese officials reportedly ask domestic EV makers to halt expansion in EU

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ASEH steps up advanced packaging capacity expansion

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BYD quarterly sales top Tesla for 1st time

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AUO Tainan plant sale underway

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Astera Labs joins UALink alliance for US$5 billion market

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China SiC industry faces restructuring; Taiwan firms seek differentiation

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Packaging materials supplier CWE optimistic about future growth momentum

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Taiwan-Europe Chip Innovation Forum debuts, top-3 EDA firms meet in Prague

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Data centers in great demand, says Microsoft

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Intel CEO to visit TSMC in November, say sources

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Analysis of Supermicro's financial chaos; supply chain focuses on 2 things

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Home Tech Semiconductors

FitTech bets on advanced packaging, silicon photonics CPO to drive 2025 growth

Siu Han, Taipei; Willis Ke, DIGITIMES Asia Thursday 15 August 2024 0

Credit: DIGITIMES

LED equipment manufacturer FitTech is gearing up to begin contract production of CoWoS advanced packaging equipment in the fourth quarter of 2024.

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