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Monday 22 July 2024
US, IDB launch initiative to boost IC backend capability in key partner countries
To strengthen semiconductor production capabilities across the Western Hemisphere, the U.S. Department of State, in collaboration with the Inter-American Development Bank (IDB), has...
Thursday 18 July 2024
Key TSMC earnings takeaways: CoWoS supply-demand balance by 2025, N2 and A16 details
C. C. Wei, chairman and CEO of TSMC, introduced the concept of "Foundry 2.0" and provided additional information regarding the company's advanced 2nm and A16 process technologies...
Thursday 18 July 2024
SK Hynix on track to explore interposer-free HBM4 production
In vying for Nvidia's next-generation memory orders, SK Hynix is prioritizing cost reduction through a more radical approach: eliminating silicon interposers entirely from HBM4 production,...
Wednesday 17 July 2024
OSATs stepping up capex
OSATs have in recent years stepped up their capital expenditures and are actively implementing high-end packaging technology and chip heterogeneous integration, according to industry...
Tuesday 16 July 2024
SK Hynix reportedly partners with Amkor in supplying interposers
Amid the competition among SK Hynix and Samsung Electronics regarding HBMs, SK Hynix reportedly plans to team with Amkor to enter the interposer market to alleviate the interposer...
Tuesday 16 July 2024
TSMC to see 2H24 revenue boost from 3nm chip orders
A ramp-up in 3nm chip orders from Intel may serve as a significant catalyst for TSMC's revenue growth in the latter half of 2024, according to industry sources.
Monday 15 July 2024
Samsung leverages IDM status to differentiate HBM4 with optimal customization and performance gains
Samsung is set to launch its sixth generation of High-Bandwidth Memory (HBM), HBM4, in 2025 and will differentiate its HBM technology through customized optimization services by leveraging...
Monday 15 July 2024
Micron CEO meets Taiwan President, secures government support for local operations
Sanjay Mehrotra, CEO of US memory chip vendor Micron Technology, recently visited Taiwan accompanied by other senior executives from the company. During the tour, Mehrotra and Taiwan's...
Monday 15 July 2024
L&T Semiconductor eyes mid-term GaN fab development
L&T Semiconductor Tech, a subsidiary of Indian conglomerate Larsen & Toubro, plans to focus on semiconductor IC design in its initial phase, followed by the development of...
Friday 12 July 2024
Samsung bolsters South Korean AI, HPC chip design with expanded DSP support and advanced process technologies
Samsung has announced plans to expand its support for DSPs (Design Service Partners) to help South Korean IC design companies deepen their presence in the HPC (High-Performance Computing)...
Friday 12 July 2024
Samsung scores 2nm PFN orders, as TSMC preps GAA for iPhone 17 launch 2025
Samsung's recent announcement of securing a 2nm chip order from Japan's AI accelerator developer Preferred Networks (PFN) has sparked discussions about the actual production progress...
Friday 12 July 2024
Taiwan fab toolmakers grab major orders from TSMC and China
Taiwan-based semiconductor equipment manufacturers are increasingly involved in the supply chains of TSMC and Chinese foundries, according to industry sources. SEMI projects global...
Wednesday 10 July 2024
Screen targets doubling sales in a decade with expanded R&D and capital expenditure plans
Screen unveils its three-year mid-term business plan, aiming to increase its overseas R&D spending to address advancements in semiconductor process miniaturization, while also...
Wednesday 10 July 2024
US to invest up to US$1.6 billion to award domestic semiconductor advanced packaging R&D efforts
On July 9, the US Department of Commerce issued a Notice...
Wednesday 10 July 2024
TSMC, ASE offer sustainable supply chain carbon reduction solutions
Senior executives from key manufacturers, including ASE Technology Holding and Taiwan Semiconductor Manufacturing Company (TSMC), gathered at a summit forum on July 9 to discuss their...