Mirle has achieved significant progress in its semiconductor equipment systems operations recently. As the semiconductor sector has experienced a notable surge in growth momentum,...
With the consumer electronics market approaching saturation, panel manufacturers from Taiwan and China are seeking new avenues for growth. Firms like BOE and Innolux are shifting...
In a key move to advance its assembly, testing, marking, and packaging (ATMP) facilities in Vemagal, Karnataka, and Jagiroad, Assam, Tata Electronics has signed an MoU with ASMPT...
Ahead of Semicon India 2024, scheduled from September 11-13, 2024 in New Delhi, Manharsinh Laxmanbhai Yadav, Director General of the India Taipei Association, spoke with DIGITIMES...
A major focus of SEMICON Taiwan 2024 that concluded last week was advanced packaging, with CoWoS, 3D IC, and FOPLP being the leading technologies. CoWoS has caught more attention...
SEMICON Taiwan 2024 has just concluded, and industry observers have noted one key difference compared to previous years: the number of equipment manufacturers participating, which...
ACM Research has received orders for wafer-level packaging equipment from a US-based customer and a leading US research center, according to the equipment manufacturer, which serves...
As SK Hynix and Samsung Electronics compete for dominance in high bandwidth memory (HBM), each is championing different technical solutions. Meanwhile, Samsung continues to address...
Several Dutch companies showcased cutting-edge technologies at SEMICON Taiwan 2024, contributing to advancements in semiconductor manufacturing and data center infrastructure.
Foxconn Chairman Liu Young-way revealed on September 4, 2024, that in addition to their existing investments in IC design and applications, the company is currently evaluating the...
Taiwan's Favite, a leading supplier of automated optical inspection (AOI) equipment for LCD, OLED, and mini/microLED displays, has begun shipping microOLED AOI equipment to the Chinese...
In the silicon photonics packaging and testing interface sector, WinWay Technology has intensified its efforts and anticipates that its co-packaged optics (CPO) product will be prepared...
Chinese Outsourced Semiconductor Assembly and Test (OSAT) companies, including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics (TFME), and Tianshui Huatian...
China-based display solutions supplier BOE Technology has unveiled a roadmap for diversification into making glass substrates for semiconductor packaging.
