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NEWS TAGGED PACKAGING
Tuesday 11 August 2026
Trusval posts record profit on semiconductor fab and memory project demand
Trusval Technology posted record profit in the second quarter and first half of 2026 as demand from global semiconductor fabs, memory makers, and AI data centers drove orders for capacity...
Tuesday 11 August 2026
ViTrox showcases AI packaging inspection solutions at SEMICON Taiwan 2026.

ViTrox, which aims to be the World's Most Trusted Technology Company, is excited to announce its participation in SEMICON Taiwan 2026, one of the world's leading semiconductor...

Tuesday 11 August 2026
MA-tek reports record July revenue on glass-substrate testing demand
Materials Analysis Technology, or MA-tek, said its first-half 2026 results reached record levels and July revenue set a monthly record for a fifth straight month, while demand grew...
Tuesday 11 August 2026
China's AMIES lands repeat orders for 350nm lithography system

Shanghai-based AMIES Technology has secured repeat volume orders for its domestically developed AST6200 350nm stepper projection lithography...

Monday 10 August 2026
SK Hynix weighs stake sale in US$3B Chongqing chip packaging plant

SK Hynix is considering options for its semiconductor packaging and testing facility in Chongqing, China, including bringing in an...

Monday 10 August 2026
Samsung HBM4 yield nears 80% as production race with SK Hynix heats up

Samsung Electronics has reportedly pushed the production yield of its sixth-generation high-bandwidth memory (HBM4) close to 80%, marking...

Monday 10 August 2026
Semiconductor material prices surge across silicon wafers, specialty gases and advanced packaging
Demand for advanced processes and packaging continues to rise, while the Middle East conflict is lifting energy and raw-material costs and tighter Chinese controls on strategic-mineral...
Monday 10 August 2026
Interview: Nvidia sees Taiwan as more than an assembler — an engineering partner

Taiwan's role in the global AI supply chain is shifting from manufacturing toward engineering, Nvidia networking senior vice president...

Monday 10 August 2026
Weekly news roundup: AI infrastructure race spans HBM, DRAM, EMIB, optical transceivers and next-gen lithography
AI infrastructure, memory supply, advanced packaging and US-China tech restrictions led this week's industry agenda. Below are the most-read DIGITIMES stories from the week...
Monday 10 August 2026
India roundup: Chip push broadens as localization and capacity remain works in progress
India is accelerating its bid to build a broader semiconductor and electronics ecosystem, combining new packaging capacity, longer-term tax incentives and deeper localization with...
Monday 10 August 2026
Aurotek profit jumps on embodied AI and semiconductor automation demand
Aurotek Corporation reported stronger second-quarter and first-half 2026 results on August 6 as demand rose for embodied AI solutions, semiconductor foundry and advanced packaging...
Sunday 9 August 2026
Ajinomoto rides advanced packaging boom as ABF demand surges

Ajinomoto raised its full-year forecast on August 6 as growing demand for AI servers and high-performance computing lifted sales of...

Saturday 8 August 2026
TSMC vs. UMC and beyond: the hostile bids that forged Taiwan's chip dominance

Powerchip chairman Frank Huang, who spent much of his career mirroring the trajectory of Taiwan's memory and foundry industries and...

Saturday 8 August 2026
Nova Technology posts record second-quarter and first-half profit on strong order recognition
Nova Technology posted record second-quarter and first-half 2026 profit as orders from semiconductor, memory, and advanced packaging customers continued to drive revenue recognition...
Friday 7 August 2026
WinWay revenue jumps as AI test socket orders drive growth
WinWay Technologies said orders from AI customers and stronger demand for advanced testing products lifted shipments in the second quarter of 2026, with revenue rising for a fourth...