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    Resonac develops 12-inch SiC substrate to target AI and EV demand
    2h 33min ago
    High-end GPUs may be slowing China’s AI compute expansion
    2h 33min ago
    2026 smartphone SoC battle centers on NPU as vendors boost cores and memory for agentic AI
    2h 33min ago
    LGES and Samsung SDI ESS orders reportedly fill two years of North America capacity
    2h 33min ago
    Analysis: China's 15th five-year plan spotlights diamond materials for AI cooling
    2h 33min ago
    NEWS TAGGED PACKAGING
    Wednesday 16 September 2026
    Apple, Intel links sharpen focus on Lens Technology's next glass growth markets
    Lens Technology is pushing its precision-glass expertise into two higher-value markets that could reshape its growth profile: Apple-linked foldable devices and Intel-linked through-glass-via...
    Wednesday 16 September 2026
    US-based Teradyne opens Bengaluru office to support India's semiconductor push
    Teradyne has opened a new office in Bengaluru as India expands its chipmaking ambitions, which could affect supply chains, pricing, and manufacturing capacity worldwide. The move gives...
    Wednesday 16 September 2026
    Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec
    The global surge in AI demand is accelerating change across the semiconductor industry, and as Moore's Law scaling faces physical limits, chipmaking is no longer only about shrinking...
    Wednesday 16 September 2026
    FSC teams with South Korean maker on TGV equipment for glass substrates
    Fu Chun Shin Machinery Manufacture (FSC), a major plastic injection molding machine maker, is expanding further into semiconductors by teaming up with Korean-Chinese joint venture...
    Tuesday 15 September 2026
    Interview: Corning sees CPO, glass core as new semiconductor battlegrounds

    As artificial intelligence applications accelerate, surging global semiconductor demand is pushing advanced packaging, co-packaged optics...

    Tuesday 15 September 2026
    Beyond H100: China's GPU makers chase scale, not just parity

    China's domestic GPU industry is entering a tougher phase: matching high-end accelerator performance is no longer enough. Vendors must...

    Tuesday 15 September 2026
    Samsung's Cheonan plant reallocates packaging capacity from Exynos to HBM
    Samsung Electronics is accelerating the restructuring of its semiconductor packaging footprint. Its Cheonan facility is gradually phasing out packaging operations for the Exynos mobile...
    Tuesday 15 September 2026
    TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
    TSMC's 3nm, 2nm, and CoWoS advanced packaging capacity remained in short supply in late 2026's third quarter, as changes in major customer orders and front-end and back-end supply...
    Tuesday 15 September 2026
    XPeng's Turing chip expands beyond cars
    XPeng Motors is extending its self-developed Turing AI chip from intelligent electric vehicles (EVs) into humanoid robots, broadening the processor's role in the company's Physical...
    Monday 14 September 2026
    DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up
    Taiwanese chip packaging firms are advancing fan-out panel-level packaging (FOPLP) and glass-substrate development as AI processors demand ever-larger reticle sizes and more complex...
    Saturday 12 September 2026
    ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs
    Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.
    Saturday 12 September 2026
    Interview: Resonac maps five PLP hurdles, eyes 510x515mm pilot line
    Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains...
    Friday 11 September 2026
    AUO, Innolux accelerate shift from displays to AI, CPO, advanced packaging
    Taiwan's panel makers posted mixed August results as the industry's strategic focus shifts beyond monthly revenue toward AI, advanced packaging and co-packaged optics (CPO). AUO and...
    Friday 11 September 2026
    Taiwan govt boosts EDA R&D to target global gaps
    Taiwan's National Science and Technology Council (NSTC) briefed Premier Jung-tai Cho on September 10, 2026, at an Executive Yuan meeting on the Chip-Driven, Taiwan-wide semiconductor...
    Friday 11 September 2026
    AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle
    Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical...
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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
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