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    China's optical supply chain gains ground in smart glasses
    Sep 16, 18:39
    Exclusive: China's CAS microelectronics institute unveils DUV-based 3nm GAA development path
    Sep 16, 18:39
    Samsung expands SRAM and IP support as memory shortages reshape chip design
    Sep 16, 18:39
    AMD shifts China strategy from chips to developer ecosystems as Nvidia retreats
    Sep 16, 18:39
    SK Hynix passes new performance bonus plan with cash and stock split evenly
    Sep 16, 18:39
    NEWS TAGGED PACKAGING
    Tuesday 15 September 2026
    Beyond H100: China's GPU makers chase scale, not just parity

    China's domestic GPU industry is entering a tougher phase: matching high-end accelerator performance is no longer enough. Vendors must...

    Tuesday 15 September 2026
    Samsung's Cheonan plant reallocates packaging capacity from Exynos to HBM
    Samsung Electronics is accelerating the restructuring of its semiconductor packaging footprint. Its Cheonan facility is gradually phasing out packaging operations for the Exynos mobile...
    Tuesday 15 September 2026
    TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
    TSMC's 3nm, 2nm, and CoWoS advanced packaging capacity remained in short supply in late 2026's third quarter, as changes in major customer orders and front-end and back-end supply...
    Tuesday 15 September 2026
    XPeng's Turing chip expands beyond cars
    XPeng Motors is extending its self-developed Turing AI chip from intelligent electric vehicles (EVs) into humanoid robots, broadening the processor's role in the company's Physical...
    Monday 14 September 2026
    DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up
    Taiwanese chip packaging firms are advancing fan-out panel-level packaging (FOPLP) and glass-substrate development as AI processors demand ever-larger reticle sizes and more complex...
    Saturday 12 September 2026
    ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs
    Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.
    Saturday 12 September 2026
    Interview: Resonac maps five PLP hurdles, eyes 510x515mm pilot line
    Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains...
    Friday 11 September 2026
    AUO, Innolux accelerate shift from displays to AI, CPO, advanced packaging
    Taiwan's panel makers posted mixed August results as the industry's strategic focus shifts beyond monthly revenue toward AI, advanced packaging and co-packaged optics (CPO). AUO and...
    Friday 11 September 2026
    Taiwan govt boosts EDA R&D to target global gaps
    Taiwan's National Science and Technology Council (NSTC) briefed Premier Jung-tai Cho on September 10, 2026, at an Executive Yuan meeting on the Chip-Driven, Taiwan-wide semiconductor...
    Friday 11 September 2026
    AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle
    Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical...
    Friday 11 September 2026
    Apple's new chip packaging boosts A20 Pro AI power, pushing MediaTek, Qualcomm to follow suit
    Apple has unveiled its latest iPhone 18 Pro and the A20 Pro, its first 2nm chip. According to Apple's official specifications, the A20 Pro features a six-core CPU, seven-core GPU,...
    Friday 11 September 2026
    Taiwan tech minister in Europe to advance semiconductor cooperation

    National Science and Technology Council (NSTC) Minister Cheng-Wen Wu visited the UK and Belgium in early September to advance Taiwan-Europe...

    Friday 11 September 2026
    China's Shenzhen Kaifa plans CNY1.85 billion expansion for high-end memory packaging and testing
    Chinese electronics manufacturer Shenzhen Kaifa Technology, also known as Shenzhen Kaifa or Kaifa, plans to invest CNY1.85 billion (about US$260 million) to expand high-end memory-chip...
    Friday 11 September 2026
    Samsung 2nm push gains momentum as Synopsys cuts NPU die area by 22%
    Synopsys has reported a 22% reduction in die area for a neural processing unit (NPU) implemented with its Fusion Compiler design tool on Samsung Foundry's SF2P process, providing a...
    Friday 11 September 2026
    Global IC substrate market to surge 32% to US$19.5 billion in 2026 as Taiwan, Korea lead ABF, BT
    Rising demand for generative AI, high-performance computing (HPC), and data center buildouts is pushing the global IC substrate industry into a new phase marked by upgrades in high-end...
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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
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