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Wednesday 19 March 2025
Empyrean to acquire fellow Chinese EDA firm
Chinese electronic design automation (EDA) company Empyrean Technology has announced plans to buy its counterpart Xpeedic through the issuance of new shares and cash.
Wednesday 19 March 2025
TSMC board member dismisses Intel foundry takeover rumors, calls them unfounded
Paul Liu, head of Taiwan's National Development Council (NDC) and a TSMC board member, denied speculation that the company is considering acquiring Intel's struggling foundry business...
Wednesday 19 March 2025
BIWIN Mini SSD: Innovative storage expansion solution for edge AI era
As edge AI applications experience rapid proliferation, intelligent terminal devices, such as ultra-thin laptops, tablets, and AI edge computing terminals, are facing exponentially...
Tuesday 18 March 2025
New insulating materials key to unlocking next-gen AI chip performance
As AI continues to attract widespread attention, the race to build large-scale data centers is ongoing. Regarding energy consumption, the power demand of hyperscale data centers has...
Monday 17 March 2025
Airoha secures NT$1.4 billion in government grants alongside approvals for three others
In November 2024, Airoha Technology (Airoha) secured a NT$1.4 billion (approx. US$ 42.59 million) grant from Taiwan's Ministry of Economic Affairs (MOEA), drawing industry-wide attention...
Monday 17 March 2025
Innolux targets panel packaging mass production among delays
Innolux Corporation is pushing forward with fan-out panel-level packaging (FOPLP) technology, aiming for mass production in first-half 2025 despite previous delays. As the first quarter...
Friday 14 March 2025
Lithography tools viewed as final piece for China's semiconductor equipment supply chain
Naura Technology, which has been actively acquiring and restructuring since 2015, is gradually assembling a comprehensive supply chain system for domestic semiconductor equipment...
Friday 14 March 2025
Samsung reportedly advances development of glass interposers to boost semiconductor performance
Samsung Electronics has reportedly begun developing a next-generation packaging material, the "glass interposer," a move aimed at replacing the costly silicon interposers currently...
Friday 14 March 2025
TSMC could be key to Trump-backed Intel rescue plan
"Saving Intel" has been a subject of negotiation between TSMC and the Trump administration over the past two months, according to semiconductor industry sources. The project's scale...
Thursday 13 March 2025
Nvidia reportedly visits Samsung packaging plant amid HBM3E supply uncertainty
High bandwidth memory (HBM) major client Nvidia is said to have visited Samsung Electronics' advanced packaging plant again, just over a month after their last visit. Industry sources...
Thursday 13 March 2025
ASE, Ainos leverage AI-driven gas analytics to revolutionize semiconductor manufacturing
ASE Technology Holding, a global leader in semiconductor packaging and testing, is partnering with Ainos to integrate AI-powered scent digitization into semiconductor manufacturing...
Thursday 13 March 2025
'TSMC US expansion extends Taiwan strength, not exodus', NSTC chief reassure
TSMC plans to pour an additional US$100 billion into its US operations, lifting its total investment to US$165 billion. The move underscores the chip giant's deepening ties with Washington...
Thursday 13 March 2025
Samsung pins foundry revival hopes on 4nm
Samsung Electronics is ramping up its advanced foundry push, targeting mass production of its fourth-generation 4nm process (SF4X) by late 2024. Designed specifically for high-performance...
Tuesday 11 March 2025
Gudeng leads 18 Taiwanese companies in following TSMC 's US expansion
Benefiting from strong demand for wafer carriers and photomask carriers from clients such as TSMC, Gudeng reported a consolidated revenue of approximately NT$456 million (US$13.9...
Tuesday 11 March 2025
TSMC US$100 billion expansion highlights deepening Taiwan-US tech ties
TSMC Chairman C.C. Wei announced at the White House a US$100 billion expansion in the United States, adding three wafer fabs, two advanced packaging plants, and an R&D center...