中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    NEWS TAGGED PACKAGING
    Thursday 27 August 2026
    Nvidia reportedly shifts HBM4 mix toward 8-high as memory supply stays tight

    Nvidia has reportedly asked Samsung Electronics and SK Hynix to increase the share of 8-high products...

    Thursday 27 August 2026
    Samsung Galaxy A1 DDI packaging shifts to Chipbond
    Rising gold prices are squeezing Samsung Electronics' entry-level smartphone supply chain, with South Korean media reporting that back-end packaging and testing orders for display...
    Thursday 27 August 2026
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026

    Global technology and innovation leader ASMPT will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, taking place from September 2 to 4 in Taipei. At...

    Thursday 27 August 2026
    Beijing's AI4Chip plan puts AI to work on EDA, fabs, advanced packaging
    Beijing is extending artificial intelligence deeper into semiconductor production, targeting chip design, wafer fabrication, packaging, testing, equipment, and materials under what...
    Thursday 27 August 2026
    AI glass substrate race shifts toward reliability and mass production
    The competition to develop glass substrates for artificial intelligence (AI) semiconductor packaging is intensifying, with Japanese and South Korean manufacturers pursuing different...
    Wednesday 26 August 2026
    TSMC packaging shift could boost AMD CoWoS share and trim Nvidia's allocation
    Morgan Stanley said TSMC's advanced packaging allocation is expected to shift in 2027, as processor demand tied to agentic AI lifts AMD's CoWoS usage and reduces Nvidia's share. The...
    Wednesday 26 August 2026
    Google's TPU v10 turns multi-vendor, deepening MediaTek's ASIC role
    Google's expanding list of TPU partners has sparked widespread industry discussion, centering on whether current IC design suppliers Broadcom and MediaTek will see their orders imp...
    Wednesday 26 August 2026
    Eternal Materials reports July revenue gain as advanced packaging demand strengthens
    Eternal Materials said July marked the start of its traditional peak season, with stronger shipments across its three main business units lifting monthly revenue to NT$4.093 billion...
    Wednesday 26 August 2026
    Samsung, Intel widen AI chip battle into memory, packaging
    Samsung Electronics and Intel are pushing into each other's core businesses as AI semiconductor competition shifts from individual chips to full-system integration. South Korean reports...
    Wednesday 26 August 2026
    TSMC's 310mm push threatens Samsung's PLP lead
    Samsung Electronics commercialized fan-out panel-level packaging (FOPLP) before rivals, using the technology in mobile and wearable chips and now preparing to extend it into AI and...
    Tuesday 25 August 2026
    Tesla senior chip engineer joins DensityAI as in-house plans face more strain
    Tesla's senior director of AI hardware design, Shishuang Sun, joined DensityAI in July 2026, taking charge of packaging and system hardware development. The move came as Tesla continued...
    Tuesday 25 August 2026
    Nexperia China rebuilds 12-inch local supply chain after 330 days
    Nexperia China said it has rebuilt a domestic 12-inch wafer supply chain after 330 days of overseas wafer supply disruptions, unveiling the new platform at a press conference outlining...
    Tuesday 25 August 2026
    Samsung pushes HBM toward logic, SK Hynix targets packaging at Hot Chips 2026
    Samsung Electronics and SK Hynix outlined different areas of emphasis for overcoming the next high-bandwidth memory (HBM) bottleneck at Hot Chips 2026, with Samsung pushing more logic...
    Tuesday 25 August 2026
    Applied Materials executive says data centers set new AI competition standard

    Commenting on the current surge in artificial intelligence (AI), Erix Yu, group vice president of Applied Materials and president of...

    Monday 24 August 2026
    Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials
    As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, advanced packaging substrates face mounting challenges: larger...
    2/69 pages
    BIZ FOCUS
    Aug 27, 08:00
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Tuesday 25 August 2026
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
    reportAIglasses