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NEWS TAGGED PACKAGING
Thursday 20 February 2025
Siemens streamlines design flows for TSMC 3DFabric technologies
Siemens Digital Industries Software announced the readiness of an automated and certified workflow for TSMC's InFO packaging technology, leveraging Siemens' advanced packaging integration...
Wednesday 19 February 2025
Packaging firm Xintec cautious about 1H25 prospects
Xintec, a TSMC-affiliated semiconductor packaging house, anticipates that increased geopolitical uncertainties, declining market demand, and shifts in customer-supplier strategies...
Wednesday 19 February 2025
ASE and PTI step up FOPLP investments to tap AI boom
ASE Technology Holdings (ASE) and Powertech Technology (PTI) are ramping up investments in fan-out panel-level packaging (FOPLP) to capitalize on surging artificial intelligence (AI)...
Wednesday 19 February 2025
SK Hynix taps VP to lead US HBM packaging facility
SK Hynix has reportedly appointed Vice President Woong-sun (William) Lee to head its newly established semiconductor packaging facility in the US. His leadership will be closely watched...
Tuesday 18 February 2025
ASE to increase spending in 2025 for expansion, new Malaysia plant reportedly set to open
Global packaging and testing leader ASE Technology Holdings (ASE) expects total capital expenditure (capex) for the year to grow significantly by over 60%, primarily allocated for...
Tuesday 18 February 2025
ASE CEO optimistic about semiconductor industry hitting US$1 trillion scale no later than 2032
Tien Wu, CEO of ASE, stated that while Taiwan-based companies excel in developing the "brain" of robots, key sensor technologies such as those related to vision, hearing, speech,...
Tuesday 18 February 2025
NEG expands glass substrate production amid HBM and semiconductor packaging boom
Nippon Electric Glass (NEG) is increasing its production of carrier glass for advanced memory and semiconductor packaging due to the growing demand for generative AI, which has boosted...
Monday 17 February 2025
TSMC weighs first US advanced packaging fab as leadership shift looms
Facing mounting pressure to strengthen semiconductor production in the US, TSMC is considering establishing the country's first advanced packaging facility. This move could reshape...
Friday 14 February 2025
JDI exits LCD production, pivots to OLED and advanced packaging with Taiwan partnership
Japan Display Inc. (JDI) announced a major restructuring plan that includes ending LCD production, transitioning to OLED manufacturing through partnerships, and expanding into advanced...
Friday 14 February 2025
PanelSemi partners with Japan Display to advance ceramic semiconductor packaging
PanelSemi signed a memorandum of understanding (MOU) with Japan Display (JDI) to collaborate extensively in advanced ceramic semiconductor packaging. This development follows PanelSemi's...
Friday 14 February 2025
ASE forecasts packaging market growth despite sluggish 1Q25
OSAT ASE Technology Holding (ASE) reported its advanced packaging sales exceeded US$600 million in 2024 and projects reaching nearly US$1 billion in 2025. However, citing seasonal...
Thursday 13 February 2025
Benefiting from urgent AI and PC demand, ASE sees robust start in 1Q25
OSAT leader ASE expects to enjoy a particularly strong first quarter of 2025, thanks to an influx of urgent orders for AI and PC applications. Advanced packaging is expected to drive...
Thursday 13 February 2025
TSMC US board secret talks: Trump floats three options to boost Intel
TSMC's first board of directors meeting in the US on February 12 did not reveal any new fab expansions or high-level personnel adjustments, as previously speculated. Nevertheless,...
Wednesday 12 February 2025
CWE enjoys robust demand for advanced packaging with order visibility until 2026
Chang Wah Electromaterials (CWE), a leading Taiwan-based semiconductor materials distributor, is witnessing a buoyant period driven by strong demand for advanced packaging. This demand...
Wednesday 12 February 2025
Chinese IC firms may shift 14nm orders to SMIC following TSMC's enforcement of BIS whitelist
TSMC has notified several Chinese IC design companies that their chips at 16/14 nanometers or smaller nodes lack "approved OSAT" status on the US BIS whitelist and proper certification...