Over the past 70 years of semiconductor industry development, there has been a significant shift towards deconstructing the industrial value chain into individual value chain nodes...
Surging demand for artificial intelligence (AI) is pushing TSMC to expand its advanced packaging capacity. As a key testing partner, Xintec—a TSMC-affiliated outsourced semiconductor...
Siemens Digital Industries Software announced the readiness of an automated and certified workflow for TSMC's InFO packaging technology, leveraging Siemens' advanced packaging integration...
Xintec, a TSMC-affiliated semiconductor packaging house, anticipates that increased geopolitical uncertainties, declining market demand, and shifts in customer-supplier strategies...
ASE Technology Holdings (ASE) and Powertech Technology (PTI) are ramping up investments in fan-out panel-level packaging (FOPLP) to capitalize on surging artificial intelligence (AI)...
SK Hynix has reportedly appointed Vice President Woong-sun (William) Lee to head its newly established semiconductor packaging facility in the US. His leadership will be closely watched...
Global packaging and testing leader ASE Technology Holdings (ASE) expects total capital expenditure (capex) for the year to grow significantly by over 60%, primarily allocated for...
Tien Wu, CEO of ASE, stated that while Taiwan-based companies excel in developing the "brain" of robots, key sensor technologies such as those related to vision, hearing, speech,...
Nippon Electric Glass (NEG) is increasing its production of carrier glass for advanced memory and semiconductor packaging due to the growing demand for generative AI, which has boosted...
Facing mounting pressure to strengthen semiconductor production in the US, TSMC is considering establishing the country's first advanced packaging facility. This move could reshape...
Japan Display Inc. (JDI) announced a major restructuring plan that includes ending LCD production, transitioning to OLED manufacturing through partnerships, and expanding into advanced...
PanelSemi signed a memorandum of understanding (MOU) with Japan Display (JDI) to collaborate extensively in advanced ceramic semiconductor packaging. This development follows PanelSemi's...
OSAT ASE Technology Holding (ASE) reported its advanced packaging sales exceeded US$600 million in 2024 and projects reaching nearly US$1 billion in 2025. However, citing seasonal...
OSAT leader ASE expects to enjoy a particularly strong first quarter of 2025, thanks to an influx of urgent orders for AI and PC applications. Advanced packaging is expected to drive...
TSMC's first board of directors meeting in the US on February 12 did not reveal any new fab expansions or high-level personnel adjustments, as previously speculated. Nevertheless,...
