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NEWS TAGGED PACKAGING
Thursday 2 December 2021
ASE to sell part of factory operations in China
OSAT company ASE Technology has disclosed plans to sell part of its factory operations in China for over US$1 billion.
Wednesday 1 December 2021
Supply chain cooperation crucial to address SiP challenges, says ASE VP
Different types of SiP (system in package) solutions are facing diverse challenges, and can be materialized only through close cooperation among related semiconductor supply chain...
Wednesday 1 December 2021
TSMC advanced packaging enters next phase of development, says company VP
TSMC's 3DFabric family of 3D silicon stacking and advanced packaging technologies is in the next stage of its development, advancing from system integration to system scaling, according...
Thursday 25 November 2021
TSMC outsources part of CoWoS packaging production to OSATs
TSMC has outsourced part of its chip-on-wafer-on-substrate (CoWoS) packaging to OSATs including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and...
Wednesday 24 November 2021
Leadframe supplier CWTC optimistic about demand from OSATs in 2022
Leadframe supplier Chang Wah Technology (CWTC) remains optimistic about demand from the IC backend sector in 2022, despite market concerns about recent corrections in OSATs' capacity...
Wednesday 24 November 2021
Metaverse applications to bring new opportunities for memory supply chain
Looming metaverse applications are expected to generate massive data drastically triggering storage demand, which will generate new business opportunities for memory vendors and backend...
Friday 19 November 2021
Taiwan COF packaging/testing service providers positive about 4Q21 demand
Taiwan-based COF (chip on film) OSAT (outsourced semiconductor assembly and test) service providers such as ChipMOS Technologies and Chipband Technology as well as COF substrate supplier...
Thursday 18 November 2021
Niching cuts into China 3rd-gen semiconductor supply chain
Niching Industrial with its in-house developed low-temperature sintering Ag paste materials has cut into China's third-generation semiconductor industry supply chain, according to...
Thursday 18 November 2021
Taiwan keen on investing in semiconductor; electric bike sales growing
In the coming years, the semiconductor industry is expected to see a strong market, and TSMC and other foundries are expanding their facilities and investments. All upstream and downstream...
Tuesday 16 November 2021
Taiwan eyeing disruptive innovations for next-generation ICs
Taiwan is set to implement a spate of next-generation semiconductor R&D programs in the next few years looking to break through physical limits of ICs and support diverse AI applications,...
Monday 15 November 2021
OSATs for handset 3D sensors, CIS see revenues fall in October
Taiwan-based backend houses Xintec and VisEra, both in the supply chain of 3D sensors for iPhone 13 series, saw their October revenues fall sequentially on a slowdown in shipments...
Wednesday 10 November 2021
Semiconductor material distributors remain upbeat about demand
Despite a recent cutback in demand for large-size display driver ICs, Taiwan-based IC material distributors remain upbeat about the overall demand that will buoy their sales performance...
Wednesday 10 November 2021
TSMC, Sony to form JV foundry in Japan
TSMC and Sony Semiconductor Solutions (SSS) have jointly announced plans to establish a joint-venture foundry in Kumamoto, Japan to initially provide 22nm and 28nm process manufacturing...
Thursday 4 November 2021
Apple may adopt TSMC 4nm process in next-gen iPhone chips, sources say
Apple may use TSMC's 4nm process technology for its next-generation iPhone processors, according to sources at backend houses.
Tuesday 2 November 2021
Former US fab head rejoins TSMC
KC Hsu will rejoin TSMC as a director at the company's integrated interconnect and packaging department, with the appointment effective immediately, according to the pure-play foun...