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    Analysis: TSMC's Kumamoto fab unlikely to adopt 2nm process under N-2 export rules
    6h 8min ago
    Analysis: Why China chose multi-accelerator strategy in AI chip development
    6h 8min ago
    China cultivates emerging TPU firms to challenge US AI chips dominance
    6h 8min ago
    South Korea's semiconductor roadmap targets 0.2nm scale by 2040
    6h 8min ago
    Nvidia plans H200 chip delivery to China in 2026 with sixfold performance boost
    6h 8min ago
    Who's on the priority list of supply chains as memory supply shortage squeeze
    6h 8min ago
    NEWS TAGGED PACKAGING
    Friday 19 December 2025
    Tata Group invests additional US$170M in Tata Electronics to expand iPhone production and semiconductor capacity
    Tata Group has invested an additional INR15 billion (US$170 million) in Tata Electronics, the company that manufactures iPhones for Apple, bringing its total investment in the subsidiary...
    Friday 19 December 2025
    SK Hynix accelerates US$15B M15X expansion as equipment move-in kicks off
    SK Hynix is accelerating the build-out of its M15X memory chip plant in Cheongju, South Korea, as the company installs manufacturing tools and moves into the final engineering phase...
    Thursday 18 December 2025
    Niching targets multi-year vapor chamber upswing, insulates margins against metal costs
    Niching Industrial Corp., a supplier of semiconductor packaging and testing materials, said revenue in 2025 is likely to hit a record high, driven by rising cooling demand from AI...
    Thursday 18 December 2025
    Advanced packaging drives ABF substrate expansion as Taiwanese companies exit post-pandemic capacity cuts
    As more AI GPU, CPU, and ASIC customers ramp up their market push, advanced packaging capacity continues to face tight supply. This has prompted upstream IC packaging substrate makers...
    Thursday 18 December 2025
    Apple reportedly explores chip assembly in India, signaling supply chain diversification
    Apple is reportedly in preliminary talks with Indian chip manufacturers to assemble and package components for the iPhone, potentially marking a first step in shifting part of its...
    Wednesday 17 December 2025
    Taiwan academia advances E-band research for satellite communication applications
    E-band wireless communication, operating between 71-76 GHz and 81-86 GHz, offers extremely high data throughput and ultra-low latency. Beyond its current use in automotive radar,...
    Wednesday 17 December 2025
    Tokyo Ohka ramps up South Korea investment for advanced chip materials

    Tokyo Ohka Kogyo plans to accelerate investment in South Korea and expand production of materials critical to generative AI semiconductors,...

    Tuesday 16 December 2025
    China's chip resilience: Naura M&A, ACM's HBM push defy US export controls
    Escalating US-China tech rivalry and the politicization of the supply chain are accelerating a structural transformation in the global semiconductor equipment sector. While the US...
    Monday 15 December 2025
    TSMC to expand CoW Orders in 2H26 as OSAT CoWoS-like tech rises
    As major US CSPs are ramping up ASIC development, the capacity gap in TSMC's CoWoS advanced packaging continues to widen. Thus, the rise of "CoWoS-like" capacity by OSAT providers...
    Monday 15 December 2025
    Micron's DDR5 outsourcing ramp redraws memory packaging trajectories through 2026
    Memory demand remains overheated and supply tight, driving upstream manufacturers to lift utilization while majors such as Micron pivot toward customized, higher value-added output...
    Monday 15 December 2025
    Samsung pushes new thermal packaging to win back Qualcomm and Apple

    Samsung Electronics is positioning a proprietary thermal management technology for external clients as it seeks to reclaim foundry market...

    Friday 12 December 2025
    Exclusive: Ex-TSMC R&D VP on advanced packaging and Morris Chang's vision
    Douglas Yu, former TSMC R&D vice president, highlighted the development of TSMC's 3D Fabric platform, including challenges in early adoption and the impact of founder Morris Chang's...
    Friday 12 December 2025
    CPO tech and Taiwan player deployment

    Introduction

    Thursday 11 December 2025
    Ta Liang PCB and advanced packaging orders surge, equipment lead times hit 6 months
    PCB and semiconductor equipment manufacturer Ta Liang Technology reported a surge in orders as AI chip and AI server demand solidifies. Customers have been investing to expand capacity,...
    Wednesday 10 December 2025
    Scientech posts over NT$10B revenue in 11 months, order visibility extends to 2H26
    Advanced packaging equipment and wafer reclaim solutions provider Scientech reported consolidated revenue of NT$958 million (US$30.77 million) in November 2025, up 9% sequentially...
    2/39 pages
    AsiaAPE
    BIZ FOCUS
    Dec 24, 08:00
    InnoPad Taipei to debut in 2026 as Taipei's flagship hub for global startups
    Wednesday 24 December 2025
    Voice AI braille printer Nemonic Dot wins CES 2026 Innovation
    Wednesday 24 December 2025
    How Technology Is Changing How We Game Online
    Wednesday 24 December 2025
    GameSir to Showcase Next-Generation Gaming Hardware at CES 2026
    AI EXPO 2026