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Highlights of the day: TSMC to detail chip development at upcoming forum

DIGITIMES staff

TSMC is going to disclose more about the development of its sub-3nm manufacturing processes and SoIC at its upcoming technology forum on August 25. The foundry is building 3nm fabricaion lines at the Southern Taiwan Science Park, and it has acquired substantial amounts of facilities there, the latest being a plant from E-Ton Solar. Nan Ya PCB has delivered samples of SiP substates to clients for processing 5nm chips, and volume shipments may begin by the end of 2020.

TSMC to talk about sub-3nm process, SoIC at upcoming tech forums: TSMC at its upcoming technology symposiums will disclose more details about the foundry's 3nm and 2nm process nodes, and advanced 3D heterogeneous integration technology, such as SoIC (system-on-integrated chips) packaging.

TSMC acquires factory building in southern Taiwan: TSMC has announced the acquisition of a factory building and related facilities owned by E-Ton Solar Tech at the Southern Taiwan Science Park (STSP) for NT$860 million (US$29.2 million), according to a company filing with the Taiwan Stock Exchange (TWSE).

Nan Ya delivers sample SiP substrates for 5nm chips: Nan Ya PCB has delivered samples of SiP substrates for processing 5nm chips for validations by clients and expects to kick off shipments of such substrates by the end of 2020 at the earliest, which will boost the revenue contribution from high-end applications.