Harvatek Corporation has introduced a new LED product in chip scale package (CSP). This LED has high brightness with low power dissipation and there are no wire bonding which reduces the processing time.
It has a high package density with a thickness of 0.15mm which is thinner than most LED products in the market. It can be use on a variety of applications that have tight space requirements.
The product has many unique features including using flip chip technology. This means the chip on the LED have low thermal resistance. CSP can provide wide viewing angle with great color uniformity. Harvatek wants to create a product that enables our customers to be more customizable with our LEDs. Therefore the product's specifications can be tailored and changed to the customer's content.
Harvatek Corporation new chip scale package
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