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Chipbond Technology expects driver IC market to recover in 4Q

Max Wang, Taipei; Shih-wei Kao, DIGITIMES Asia Tuesday 19 June 2001 0

Chipbond Technology shipped 90,000 gold-bumped wafers and eight million tape carrier packaged (TCP) TFT LCD driver ICs in the first quarter and 8.3 million chip-on-glass (COG) TN/STN LCD driver ICs in May. The company expects shipments of the TCP products...

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