Semiconductor plastic packaging materials market to top US$20 billion by 2011, says report

Press release, November 28; Rodney Chan, DIGITIMES Asia Wednesday 28 November 2007 0

The market for semiconductor packaging materials, including thermal interface materials, is expected to reach US$15.5 billion in 2007 and grow to US$20.2 billion by 2011, according to a new study by SEMI and TechSearch International.

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