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TSMC speeds up AI chip packaging expansion despite Nvidia's order cuts, targets future growth through collaboration with Intel

Monica Chen, Hsinchu; Elaine Chen, DIGITIMES Asia Friday 4 April 2025 0

Credit: DIGITIMES

Despite rumors of reduced orders for advanced packaging capacities, Taiwan Semiconductor Manufacturing Company (TSMC) is ramping up its advanced packaging capacity to meet the growing demand for AI chips.

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