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Micron, TE Connectivity announce new reduced-height memory solution for ultra-thin market

Press release; Jessie Shen, DIGITIMES Asia Friday 8 February 2013 0

Micron Technology and TE Connectivity have jointly announced the availability of a single-sided SODIMM and a low-profile single-sided DDR3 SODIMM connector solution to take advantage of the burgeoning market for ultrabook devices, convertibles, tablets...

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