Demand for foldable smartphones continues to surge as companies like Samsung Electronics, Huawei, and Oppo release new products, significantly boosting market sales and leading to...
Corning reportedly is set to exclusively supply ultra-thin tempered glass (UTG) for Samsung Electronics' Galaxy Z Flip 5. This move could potentially confirm the speculation that...
On October 11, Taiwan's National Yang Ming Chiao Tung University (NYCU) announced a groundbreaking research achievement in collaboration with TSMC, which has been published in the...
NeoGene Tech, a Guangzhou-based technology platform provider for mobile device thermal management, has unveiled a breakthrough solution for ultra-high-packaging-density power battery...
IC analysis and certification lab Material Analysis Technology (MA-tek) continues to enjoy a rapid rise in analysis demand for sub-7nm chips, particularly 3/2nm process now under...
Suzhou-based professional thermal module maker, Jieqiao Electronics Technology, announces it has reached a formal technology license agreement with NeoGene Tech to adopt MagicWick-Inside...
Taiwan-based digital paper solution provider, E Ink Holdings, and Ricoh have jointly unveiled an ultra-thin digital whiteboard, with applications across medical, construction, and...
YCTek, the world biggest micro heat pipe manufacturer, has reached a formal patent license agreement with NeoGene Tech to adopt PWS (Print Wick Structuring) approach and MagicWick-Inside...
Acer expects shipments into Asia Pacific to grow sequentially in the second quarter thanks to the stay-at-home economy driven by the coronavirus pandemic, according to the company's...
At CES 2021's online exhibition, many notebook brand vendors showcased gaming products featuring higher resolution panels, new type of Chromebooks and dual-screen models eyeing the...
NeoGene Tech has unveiled a breakthrough technology to fabricate a porous wick structure with thickness at only 10-micron, enabling ultrathin vapor chamber devices in large area with...
With 8-inch wafer fabrication demand rising rapidly for chips including ultra-thin fingerprint sensors, power management ICs, MOSFET chips and display driver ICs, second-tier foundries...
Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.
