Despite flat demand for most consumer electronics chips and a muted outlook for traditional wire bonding and packaging equipment, Singapore's semiconductor packaging equipment giant Kulicke & Soffa (K&S) has confirmed its close collaboration with Taiwan's semiconductor foundry leaders in the advanced packaging field for high-end chips
The Johor-Singapore Special Economic Zone (JS-SEZ), jointly established through contracts signed by Malaysia's Johor state and Singapore, has recently become a focal point for the entire Southeast Asian supply chain. This week, the JS-SEZ Business and Investment Forum was held in Johor Bahru, where stakeholders exchanged views on the future development of the economic zone
Generative AI is redrawing the tech landscape—from cloud to edge—while geopolitical tensions push countries to rethink their semiconductor strategies. As Taiwan, led by TSMC, navigates a shifting global order, the question is no longer whether it can lead but how it must evolve to stay ahead
The demand for humanoid robots is on the rise, driven in part by the optimism of industry leaders such as Nvidia. However, the practicality of adopting a humanoid form for robots remains a critical topic of discussion. Recent insights from Marc Raibert, founder of Boston Dynamics, shed light on various aspects of this burgeoning trend during an interview with DIGITIMES.
IP provider Ceva has been actively entering the edge AI sector in recent years. In an interview with DIGITIMES, CEO Amir Panush stated that edge AI presents significant market opportunities and will be a key growth engine for Ceva in the coming years
China is leading the charge in 5G technology, transforming factory efficiency standards. Countries like Indonesia must accelerate their innovative and digital transformation efforts to attract manufacturing investments, as this trend is becoming evident, said Julian Gorman, head of Asia Pacific at GSMA
As MWC 2025 concluded, industry observers are focusing on the evolution of next-generation communication technologies. This year's conference highlighted Non-Terrestrial Networks (NTN), with major telecom operators actively positioning themselves as related technologies continue to mature.
TSMC unveiled plans to nearly triple its investment in the United States to US$165 billion, a move that reshapes the global chip industry landscape amid surging artificial intelligence demand and intensifying US-China technological competition
Taiwan-based HCMF Group, a long-standing supplier of automotive parts and systems to global Tier 1 OEMs, operates nearly 30 sales, manufacturing, and R&D facilities worldwide. The company provides comprehensive automotive electromechanical system solutions and recently showcased its cross-industry collaborations at CES 2025. Partners such as AUO, AGC, Inventec, TMY Technology, BenQ Materials, and Kinpo Group contributed to HCMF's efforts to redefine intelligent mobility through groundbreaking innovations and seamless integration capabilities
