At WWDC 2024, Apple announced "Apple Intelligence," adding its own branding to the terminology of artificial intelligence (AI)

Elephantech Inc., the first company in the world to successfully manufacture Printed Circuit Boards (PCBs) using metal inkjet printing, is seeking strategic partners to scale up manufacturing in light of rising demand

It is important to know how individual memory companies choose to develop their High Bandwidth Memory (HBM) technology for future competitions

Nvidia CEO Jensen Huang addressed the company's partnerships with Arm, High-Bandwidth Memory (HBM) manufacturers, Cloud Service Providers (CSP), and Taiwan's high-tech supply chains, which are led by TSMC, during a press Q&A session at Computex 2024 in Taipei. He also shared his vision for AI and commented on the competition. The following is a summary of the Q&A session

In March, China Resources announced the stunning news of acquiring SMIC's shares of JCET Group, a packaging and testing firm invested by China's National IC Industry Investment Fund (the "Big Fund"). The deal is a delicately calculated move rendering China Resources control over JCET and Sandisk

PC industry players are eagerly anticipating the arrival of AI PCs to drive a new wave replacement cycle, with Microsoft defining specifications for AI PCs under the Copilot+ PC label that includes the integration of NPUs and chip capabilities reaching 40+ TOPS

Intel CEO Pat Gelsinger's keynote at COMPUTEX 2024, specifically mentioned the collaboration with TSMC, which allowed Intel to realize the mass production of Lunar Lake in advancing AI PCs. This move raises questions about whether it is an attempt to repair the relationship with TSMC

Semiconductor foundry companies have started to compete in the 2nm process shortly after their 3nm production lines started humming to mass produce for customers. There is something to learn from Samsung's 6-month lead to producing 3nm wafers with Gate-All-Around (GAA) architecture in June 2022

The long-rumored third phase of China's national semiconductor fund, commonly known as "the Big Fund," has finally been officially announced. The fund scale of CNY344 billion (US$47.5 billion) makes it the largest funding project in China's chip history and far exceeds previous market expectations

Nvidia, founded in 1993, has established itself as a leading player in the Graphics Processing Unit (GPU) market

OwlTing, originally a Taiwanese startup using blockchain technologies for farm product resumes and hotelier payment systems, has made remarkable strides in transformation and acquisition and will start providing more cost-effective and faster cross-border financial services to Information Communications Technology (ICT) supply chains transitioning to the Americas

Announcing a US$47.5 billion funding for Phase 3 of the National IC Industry Investment Fund (the "Big Fund"), China's next move is under the eye of global chip players

High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU in Artificial Intelligence (AI) computing

The semiconductor industry is the lifeblood of South Korea, a country that heavily depends on its exports. In 2023, South Korea exported US$131 billion of semiconductors and imported US$106 billion, raking in US$25 billion in trade surplus. For Taiwan, when there is a trade deficit, it only amounts to a fraction of its foreign reserve, but that would be a heavy burden to South Korea, which is already shouldering US$663.6 billion in foreign debt

Micron Technology's High-Bandwidth Memory (HBM) sales will climb to several hundred million US dollars in the current fiscal year and then to several billion US dollars in the next fiscal year, which begins in September 2024, according to company EVP and chief business officer Sumit Sadana