Epson recently showed a 2.8-inch memory on glass (MOG) panel with power consumption level of 0.15μW at Display Taiwan 2007 (June 16-19) in Taipei.
The MOG panel adopts low-temperature polysilicon (LTPS) process and operates by integrating memory within the pixel, enabling images to be displayed even when the panel is at a standby mode, the maker said.
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- Silicon photonics set for takeoff (Oct 30) - EE Times
- TikTok founder becomes China's richest man (Nov 1) - BBC News
- Nvidia to take Intel's spot on Dow Jones Industrial Average (Nov 1) - Reuters
- Huawei's latest AI processors were made by TSMC (Oct 22) - Bloomberg
- Arm to scrap Qualcomm chip design license in feud escalation (Oct 23) - Bloomberg
- Embedded World brings 3,500 visitors to 1st US outing (Oct 11) - EE Times
- Preparing electronics engineering students for industry (Oct 8) - EETimes Europe
- Former Apple hardware chief Dan Riccio is retiring (Oct 11) - Ars Technica
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Microsoft's custom chip sets new industry benchmark while deepening AI partnerships across sectorsAs Microsoft transitions from a software giant to a cloud leader, with its cloud business now accounting...
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