OCZ Technology Group recently launched the OCZ PC3-12800 Flex XLC kit featuring OCZ's Flex XLC (Xtreme Liquid Convention) heatsink, extending OCZ's Flex-series of heat sinks to high speed, enhanced latency DDR3.
OCZ's Flex XLC heatsink dissipates heat via a hybrid copper and aluminum design alterable between passive air or water cooling.
This unique "flexible" design gives enthusiasts the option to run the modules passively or water-cooled via an integrated liquid injection system.
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- Mature-node foundries face overcapacity from China (Jan 2) - EE Times
- Quobly forges strategic collaboration with STMicroelectronics (Dec 12) - Company release
- SemiKong, the first open-source semiconductor LLM, claims to bring new chips to market 30% faster (Dec 27) - TG Daily
- 2024: The year AI drove everyone crazy (Dec 26) - Ars Technica
- China becomes a contender in quantum computing (Dec 27) - EE Times
- NXP to acquire automotive networking pioneer Aviva Links (Dec 17) - Company release
- Luc Van den hove: Aim high, be ambitious, but stay humble (Dec 19) - EE Times
- Intel shortlists suitors for programmable chip arm Altera (Dec 20) - Bloomberg
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