Cooler Master recently introduced its Hyper 212 CPU cooler, which offers a unique dual-fin design, LED sickle fan blade, universal fit, and silent operation. The Hyper 212 is designed for both Intel and AMD CPUs.
The dual-fin heat sink design leaves space in the middle for excess airflow to pass through without the usual resistance of traditional heat sinks, allowing hot airflow out of the chassis at an even faster rate.
Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module...
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Nvidia GeForce RTX 30 series GPUs
Nvidia's GeForce RTX 30 series GPUs are powered by the company's Ampere architecture. The...
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Apple HomePod mini
Apple's HomePod mini is the newest addition to the HomePod family. At just 3.3 inches tall,...
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Apple 13-inch MacBook Pro with Magic Keyboard
Apple has updated the 13-inch MacBook Pro with the new Magic Keyboard for an improved typing...
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Apple iPad Pros
Apple's new iPad Pros comes with the latest A12Z Bionic chip, an ultra-wide camera, studio-quality...
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- Mature-node foundries face overcapacity from China (Jan 2) - EE Times
- Quobly forges strategic collaboration with STMicroelectronics (Dec 12) - Company release
- SemiKong, the first open-source semiconductor LLM, claims to bring new chips to market 30% faster (Dec 27) - TG Daily
- 2024: The year AI drove everyone crazy (Dec 26) - Ars Technica
- China becomes a contender in quantum computing (Dec 27) - EE Times
- NXP to acquire automotive networking pioneer Aviva Links (Dec 17) - Company release
- Luc Van den hove: Aim high, be ambitious, but stay humble (Dec 19) - EE Times
- Intel shortlists suitors for programmable chip arm Altera (Dec 20) - Bloomberg
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The Kumamoto model's potential: ex-MITI official urges Japan-Taiwan-US chip allianceJapan's semiconductor revival must not only involve Taiwan but also include strategic cooperation with...
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2024 ReviewAs 2024 comes to a close, we look back at the major topics and events across multiple industry sectors, including EVs, AI, semiconductors, servers, and...
Global investment plans of Japanese IDMs
Geopolitical tensions prompt Japanese IDMs to gather capacities in Japan's Kyushu and Tohoku regions and prioritize their OSAT...
CSP in-house development of ASIC accelerators
Google TPUs will see a share of over 70% in the in-house developed cloud ASIC accelerator market in 2024; an all-optical network...
AI chip market outlook 2023-2028: Insights from demand and supply perspectives
The growing demand for AI computational power is accelerating advancements in hardware and chip technology, necessitating innovation...
