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The TMS320C6474 integrates three of TI's TMS320C64x+ cores running at 1 GHz each on a single die, delivering 3 GHz of raw DSP performance that consumes 1/3 less power at 2/3 less DSP cost over discrete processing solutions. The C6474 provides significant system integration for customers currently utilizing DSP farms for communications infrastructure, medical imaging, military communications and industrial vision inspection end equipments and markets.

The C6474 integrates three C64x+™ cores running at 1 GHz each on a single die to deliver 3 GHz of raw DSP performance, or 24,000 MMACS (16-bit) or 48,000 MMACS (8-bit) of measured performance. In addition it is 100% code compatible with TI's single core DSPs based on the C64x+ core (e.g. TMS320C6452, TMS320C6455), as well as those based on the predecessor TMS320C64x core, such as TMS320C641x devices.

The C6474 achieves this system integration due in part to a process shrink to 65nm feature size, which means the C6474 can be packaged in a 23x23mm ball grid array (BGA) and is comparable in size to TI's existing single core DSP solutions fabricated in 90 nm technology.