VIA Technologies has announced the latest addition to the VIA Modular Solutions portfolio, the VIA QSM-8Q90. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles, the vendor said.
The VIA QSM-8Q90 module measures just 70x70mm and is based on the new embedded QSeven form factor developed to meet the demands of various low-power and mobile applications. Featuring a VIA 1.0GHz VIA Nano E-series processor and the VIA VX900 MSP, the VIA QSM-8Q90 module is a building block for power constrained handheld application segments, including medical, advanced gaming, military and test and measurement equipment.
The VIA QSM-8Q90's on-board system memory includes 1GB of DDR3 RAM as well as support for two 1-lane PCIe expansion and an18/24-bit LVDS connector with resolutions up to 1366x768.
Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module...
Photo: Company
Nvidia GeForce RTX 30 series GPUs
Nvidia's GeForce RTX 30 series GPUs are powered by the company's Ampere architecture. The...
Photo: Company
Apple HomePod mini
Apple's HomePod mini is the newest addition to the HomePod family. At just 3.3 inches tall,...
Photo: Company
Apple 13-inch MacBook Pro with Magic Keyboard
Apple has updated the 13-inch MacBook Pro with the new Magic Keyboard for an improved typing...
Photo: Company
Apple iPad Pros
Apple's new iPad Pros comes with the latest A12Z Bionic chip, an ultra-wide camera, studio-quality...
Photo: Company
- Huawei's latest AI processors were made by TSMC (Oct 22) - Bloomberg
- Arm to scrap Qualcomm chip design license in feud escalation (Oct 23) - Bloomberg
- Embedded World brings 3,500 visitors to 1st US outing (Oct 11) - EE Times
- Preparing electronics engineering students for industry (Oct 8) - EETimes Europe
- Former Apple hardware chief Dan Riccio is retiring (Oct 11) - Ars Technica
- Key takeaways as China outlines plans to revive economy, end housing slump (Oct 11) - Bloomberg
- Taiwan's president vows to resist 'annexation' (Oct 10) - BBC News
- Indonesia asks Apple, Google to block China's Temu to protect small merchants (Oct 11) - Reuters
![]()
Microsoft's custom chip sets new industry benchmark while deepening AI partnerships across sectorsAs Microsoft transitions from a software giant to a cloud leader, with its cloud business now accounting...
![]()
Startups and innovationsTake a look at the innovative ideas, products and services that startups offer.
CSP in-house development of ASIC accelerators
Google TPUs will see a share of over 70% in the in-house developed cloud ASIC accelerator market in 2024; an all-optical network...
AI chip market outlook 2023-2028: Insights from demand and supply perspectives
The growing demand for AI computational power is accelerating advancements in hardware and chip technology, necessitating innovation...
Automotive CIS tech development, 2024
The popularization of autonomous driving is boosting demand for automotive CIS with LFM and HDR being mainstream development...
