RM23608 features a tool-less installation and flexible fan configuration. It's equipped with eight 3.5" hot-swap drive bays for storage capacity in data centers and anti-vibration mechanism of middle fans for minimum of unwanted noise.
RM23612 helps conquer the challenges faced in the era of cloud computing. It supports motherboard of up to 12" x 13" and twelve 3.5" hot-swap hard drive bays. The 12-port 6Gb/s mini-SAS backplane is available to optimize performance from the hard drives operation and thus provides the fastest response for users.
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- Huawei's latest AI processors were made by TSMC (Oct 22) - Bloomberg
- Arm to scrap Qualcomm chip design license in feud escalation (Oct 23) - Bloomberg
- Embedded World brings 3,500 visitors to 1st US outing (Oct 11) - EE Times
- Preparing electronics engineering students for industry (Oct 8) - EETimes Europe
- Former Apple hardware chief Dan Riccio is retiring (Oct 11) - Ars Technica
- Key takeaways as China outlines plans to revive economy, end housing slump (Oct 11) - Bloomberg
- Taiwan's president vows to resist 'annexation' (Oct 10) - BBC News
- Indonesia asks Apple, Google to block China's Temu to protect small merchants (Oct 11) - Reuters
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