Following recent geopolitical tensions, concerns regarding the supply chain security of technology products have intensified globally. The United States has expressed intentions to impose restrictions on connected vehicles from China
SK Hynix is expediting the development of 16-layer HBM3E (High Bandwidth Memory) to reinforce its leading position in the competitive HBM market, as challenges from rivals like Samsung and Micron intensify. The company has successfully confirmed the operational stability of its 16-layer HBM3E, showcasing the robustness of its proprietary MR-MUF (Mass Reflow Mold Underfill) stacking technology
Samsung Electronics has reportedly delayed construction and equipment orders for its Pyeongtaek Phase 4 (P4) plant in South Korea and its second facility (T2) in Taylor, Texas. This move suggests a more cautious approach to semiconductor investments from the South Korean giant, potentially impacting its partner companies
A Chinese venture capital heavyweight Datong Chen has been appointed to the board of directors of China-based IC design company Unisoc. Chen, chairman of Investment Committee, Hua Capital Management, co-founded OmniVision in 1995, and Spreadtrum (now Unisoc) in 2001. Meanwhile, Unisoc has also stepped up its shipments of handset application processors (AP), with its market share now said to be on a par with Apple's
LG Display (LGD) and TCL China Star Optoelectronics Technology (TCL CSOT) have signed an agreement for the latter to buy LGD's 8.5G LCD facility in Guangzhou for CNY10.8 billion (US$1.54 billion), further solidifying the dominance of Chinese companies in the global TV panel market. The sale is expected to be completed by March 31, 2025
Taiwan-based MCU firms generally remain cautious about their sales prospects for the fourth quarter of 2024, primarily due to the slow recovery in demand in China, according to industry sources. But the MCU makers are still expecting sales momentum from emerging applications, such as those for edge AI and new energy cars
The subsidy program implemented by the Chinese government to encourage domestic consumers to replace old TVs with new ones is anticipated to stimulate overall TV demand in the fourth quarter of 2024, according to industry sources
South Korea's semiconductor stockpiles dwindled at the fastest clip since 2009 last month in a sign of sustained demand for high-performance memory chips used in artificial intelligence development
Beijing is stepping up pressure on Chinese companies to buy locally produced artificial intelligence chips instead of Nvidia Corp. products, part of the nation's effort to expand its semiconductor industry and counter US sanctions
The 2024 Tokyo Game Show (TGS), Japan's largest video game exhibition, was held from September 26 to 29, 2024, in Chiba, Japan. The main technological highlight this year was the application of generative AI (GenAI)
Taiwan's Minister of Economic Affairs J.W. Kuo led a delegation to Japan and visited the construction site of TSMC's Kumamoto plant (JASM) on September 24. He also met with the governor of Kumamoto, Takashi Kimura. During their discussions, it was revealed that significant issues related to transportation and talent only became apparent after the construction of the JASM plant began
Amid intensifying competition in the global semiconductor market, the Japanese government has relaunched its semiconductor industry revival plan, prioritizing advanced technology development and supply chain resilience. A key objective of this initiative is to re-establish Japan's position as a leader in the global semiconductor sector
China's leading outsourced semiconductor assembly and test (OSAT) companies, such as Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics, are intensifying R&D efforts on wafer-level and panel-level packaging solutions while expanding domestic advanced packaging capacity to maintain international competitiveness
In the wake of TSMC's establishment of a wafer fabrication facility in Japan, Taiwanese and Japanese companies are strengthening their collaboration, particularly within the semiconductor supply chain