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    China submits 96 papers to top chip design conference, nearly double US and South Korea
    1h 58min ago
    Nvidia sparks AI data center power architecture revolution, Taiwan's top wire bonding firms poised to benefit
    2h 3min ago
    0.18-micron process emerges as sweet spot for Chinese IC design research
    2h 3min ago
    Exclusive: China unveils 3D heterogeneous integration chip to challenge Nvidia's 4nm AI computing power
    2h 3min ago
    Commentary: ASML denies spying on China for US as geopolitics erodes supply chain neutrality
    2h 3min ago
    TSMC's lawsuit against ex-SVP walks a US-Taiwan tightrope
    2h 3min ago
    HomeRegionsEast Asia
    Monday 27 October 2025
    LG Electronics advances HBM and glass substrate equipment for advanced packaging
    LG Electronics is aggressively entering the advanced semiconductor packaging equipment market to meet the surging demand driven by AI. The company plans to gradually localize production of AI semiconductors, high-bandwidth memory (HBM), and related process equipment in South Korea, aiming to expand its business footprint
    Monday 27 October 2025
    Korea's thinnest parking robot steals the show at FIX 2025

    At the Future Innovation Technology Expo (FIX 2025) in Daegu, one of the busiest booths belongs to HL Robotics, whose live demonstration of its autonomous parking robot "PARKIE" has drawn steady crowds

    Monday 27 October 2025
    Xiaomi 17 series challenges Apple’s dominance in China’s high-end market
    Xiaomi partner and president Weibing Lu is spearheading the company's push into the premium smartphone segment, marking the Xiaomi 17 series in 2025 as a critical battle for the price tier above CNY6,000 (US$842.51). This range has long been dominated by Apple's iPhone
    Monday 27 October 2025
    Nexperia dispute threatens legacy chips critical to basic car functions for automakers worldwide
    The largest US auto-parts trade group has warned that domestic carmakers may see major production disruptions within two to four weeks, as the escalating dispute over Nexperia risks cutting off supplies of essential automotive semiconductors
    Monday 27 October 2025
    Weekly news roundup: TSMC tightens China orders; Micron sees DRAM market tightening; CXMT, Huawei advance HBM3 chips
    Below are the top DIGITIMES Asia stories from October 20 to 26, 2025
    Monday 27 October 2025
    Nexperia export ban rattles carmakers from Seoul

    China's recent order banning exports from the Chinese factories of Dutch semiconductor firm Nexperia has sent shockwaves through the global automotive supply chain, raising fears of a new wave of disruptions reminiscent of the chip shortages that paralyzed carmakers during the pandemic

    Monday 27 October 2025
    China's semiconductor reckoning: YMTC chairman on 5 shifts that will redefine sector
    As China gears up for its Fifteenth Five-Year Plan, Chen Nanxiang, chairman of the China Semiconductor Industry Association (CSIA) and YMTC, said the country's semiconductor industry must fast-track efforts to build a self-reliant supply chain, drive integration and upgrades, and advance into a new phase of growth. He identified five defining shifts reshaping the sector: segmentation, integration, optimisation, expansion, and deficiency
    Monday 27 October 2025
    Taiwan turns China's export curbs into a test of industrial resilience

    As Energy Taiwan and Net-Zero Taiwan 2025 open on October 29, Beijing has completed its second wave of export restrictions on lithium batteries and rare-earth materials. This move has jolted global clean-energy supply chains and forced industries worldwide to prepare for another round of structural reshuffling

    Monday 27 October 2025
    Samsung launches aggressive price-cut strategy to catch up in HBM competition
    HBM continues to be a critical resource as the AI boom is further tightening supply and demand in the memory industry. Memory leader Samsung Electronics is fixated on reclaiming its dominance, reportedly launching a 30% price cut strategy in an attempt to catch up after delays in its 12-layer HBM3E certification
    Monday 27 October 2025
    As Huawei stumbles, ByteDance quietly rewrites China’s AI cloud order
    Huawei Cloud CEO Zhang Ping'an and several top executives were recently demoted and had their salaries reduced, officially due to "performance falsification." The punishment, however, reflects a broader shift in the AI era: the inseparable link between large models, AI applications, and AI infrastructure. ByteDance's Volcengine has emerged as a key disruptor representing this integrated vision in China's cloud ecosystem
    Sunday 26 October 2025
    LGES approaches China's battery market with time compression, accumulation strategy
    In the face of policy and capital competition pressure from Chinese companies, LG Energy Solution (LGES) is implementing a strategy that combines time compression and accumulation. The "compression" of time refers to AI and digital transformation, while the "accumulation" of time refers to differentiated technology and patents
    Sunday 26 October 2025
    CXMT, Huawei align on HBM3 ahead of China's 2026 AI memory leap
    High-bandwidth memory (HBM) has become the latest competitive front for global DRAM manufacturers. As Samsung, SK Hynix, and Micron gear up for HBM4 mass production in 2026, China's CXMT has reportedly delivered 16nm HBM3 samples to Huawei and its partners, a prelude to large-scale manufacturing slated for the same year
    Saturday 25 October 2025
    OpenAI, AMD, Broadcom unite behind Ethernet to reshape AI infrastructure
    The Ethernet for Scale-Up Networking (ESUN) Alliance officially launched at the 2025 Open Compute Project (OCP) Global Summit, uniting North America's AI heavyweights, including OpenAI, Meta, AMD, Nvidia, Microsoft, and Broadcom. Its goal is to create an open Ethernet interconnect standard to address AI chip connectivity fragmentation and redefine global AI infrastructure. The collaboration marks a rare alignment across major rivals in pursuit of interoperability
    Friday 24 October 2025
    Korean firm wins top innovation award for transparent 5G/6G antenna technology
    Automotive electronics manufacturer THN grabbed a Top Innovation Technology Award here on October 23 at the Future Innovation Technology Expo (FIX 2025) for its breakthrough transparent antenna technology. Dubbed 'FlexClear,' the system aims to enable high-speed, low-latency 5G and 6G connectivity for vehicles without using traditional external antennas. THN was one of nine top winners among thirty companies honored at the Daegu event
    Thursday 23 October 2025
    Samsung expresses confidence in 2nm development, reports solid progress
    Samsung Electronics' Device Solutions (DS) division CTO Song Jae-hyuk expressed strong confidence in the revival of Samsung's foundry business and reported smooth progress on the company's 2nm process during a semiconductor industry briefing hosted by South Korea's chief presidential secretary for policy, Kim Yong-beom
    23/132 pages
    Research Report Database
    BIZ FOCUS
    Oct 2, 10:32
    SK Group partners with OpenAI to advance global AI infrastructure
    Thursday 30 October 2025
    Asian Power Devices Officially Launches New Vietnam Factory, Setting a New Global Production Milestone
    Thursday 30 October 2025
    BIWIN Mini SSD Named to TIME's 'Best Inventions of 2025'
    Thursday 23 October 2025
    APD: Technology-Driven Innovation Powering Global Growth
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