DIGITIMES Asia news

Monday 16 February 2026

Apple reportedly agrees to double NAND prices from Kioxia, shifts to quarterly contract pricing

Apple has reportedly agreed to double the unit price it pays for NAND flash from Japan's Kioxia starting in the January–March quarter, with supply contracts moving to quarterly price adjustments linked to market conditions

Sunday 15 February 2026

CXMT races to scale up as yield gaps and export curbs bite

CXMT, a leading Chinese DRAM maker, is expanding aggressively but faces significant production and regulatory hurdles, ChosunBiz reported, citing industry sources. Despite rising global memory demand, the company's wafer output has hit capacity limits, with yield issues and US export restrictions constraining further growth

Saturday 14 February 2026

ByteDance expands chip team to 1,000, advancing four major design lines

Chinese tech giant ByteDance is rapidly scaling its in-house chip development efforts, with its chip R&D team now exceeding 1,000 employees, signaling a strong push into AI hardware. According to a recent report by 36Kr, the company's investment in AI chip technology is accelerating quickly

Saturday 14 February 2026

China sets price guidelines to curb cutthroat EV competition

China's State Administration for Market Regulation (SAMR) issued a set of guidelines on February 12 aimed at regulating pricing throughout the automotive production process, as part of the government's efforts to curb destructive price slashing in the electric vehicle (EV) market

Saturday 14 February 2026

Nvidia deepens South Korea ties in smart factory push

Nvidia outlined its role in advancing two major manufacturing trends—AI Factory and Physical AI—at SEMICON Korea 2026, emphasizing that it views South Korea as an important strategic outpost for collaboration as the country accelerates AI-driven industrial transformation

Saturday 14 February 2026

HBM steals the show at SEMICON Korea despite Samsung, SK Hynix skipping the floor

Artificial intelligence-driven growth in the semiconductor industry has drawn increasing public attention. SEMICON Korea, organized by SEMI, continues to expand in scale. The 2026 exhibition featured 550 participating companies and more than 2,400 booths, with pre-registered attendance reaching 75,000

Friday 13 February 2026

Arm sharpens China AI strategy amid rising RISC-V activity

As China emerges as a major RISC-V hub shipping hundreds of billions of chips annually since 2024, Arm Holdings confronts heightened competition in a market where its architecture has powered over 300 billion chips across hundreds of licensees over 40 years. The trend is prompting Arm to accelerate efforts to secure its position in China's AI era

Friday 13 February 2026

Citi flags post-HBM shift as edge memory, HBF advance

A Citi analyst said the next phase of artificial intelligence (AI) memory demand will extend beyond high-bandwidth memory (HBM), pointing to emerging opportunities in physical AI devices and high-capacity flash architectures

Friday 13 February 2026

Analysis: China's AI models and chips align on day one

China's leading large model developers are accelerating flagship releases, while domestic AI chipmakers are responding almost simultaneously, announcing Day-0 adaptation and optimization as soon as new models are introduced

Friday 13 February 2026

Samsung's non-memory unit to turn profitable in 4Q26 as Exynos 2700 targets 50% share in Galaxy S27

Industry analysts indicate that Samsung Electronics' non-memory division is expected to return to profitability in the fourth quarter of 2026, with a full-year turnaround projected for 2027

Friday 13 February 2026

TSMC and memory makers boost capex to offset China export restrictions impact

TSMC raised its 2026 capital expenditure forecast to US$52-56 billion, driving strong demand in the global semiconductor supply chain amid AI growth. Memory giants SK Hynix, Micron, Nanya Technology, and Winbond also expanded capacity plans

Friday 13 February 2026

SK Hynix reportedly begins equipment orders for Cheongju HBM packaging line amid AI-driven capacity race

SK Hynix has started placing initial equipment orders to convert an idle Cheongju fab into a high-bandwidth memory (HBM) packaging and testing line, according to ET News, citing sources

Friday 13 February 2026

Naura rises to No. 5 in global semiconductor equipment rankings

China's semiconductor equipment makers are advancing rapidly even as the global chip supply chain undergoes restructuring and geopolitical decoupling

Friday 13 February 2026

Volkswagen leads way as EU replaces China BEV tariffs with minimum price commitment

As the European Union-China trade dispute over battery electric vehicles (BEVs) drags on, the EU is on track to replace punitive tariffs of up to 35% with a "minimum price commitment" mechanism starting in January 2026. Volkswagen Group has become the first automaker to formally engage with the new approach, applying the pricing scheme to its Cupra Tavascan model produced in Anhui, China—an early indication of how European manufacturers may adapt to the EU's evolving trade defense strategy

Friday 13 February 2026

SEMICON Korea: Samsung pushes hybrid bonding HBM, SK Hynix bets on platform AI

SEMICON Korea 2026, held in Seoul from February 11–13, brought senior executives from Samsung Electronics and SK Hynix to outline their AI-era memory R&D strategies. Samsung focused on cross-domain semiconductor integration to address bandwidth and energy-efficiency limits, while SK Hynix detailed a platform-based and AI-driven approach to compress development cycles

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BIZ FOCUS

Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook