HBM continues to be a critical resource as the AI boom is further tightening supply and demand in the memory industry. Memory leader Samsung Electronics is fixated on reclaiming its dominance, reportedly launching a 30% price cut strategy in an attempt to catch up after delays in its 12-layer HBM3E certification

Huawei Cloud CEO Zhang Ping'an and several top executives were recently demoted and had their salaries reduced, officially due to "performance falsification." The punishment, however, reflects a broader shift in the AI era: the inseparable link between large models, AI applications, and AI infrastructure. ByteDance's Volcengine has emerged as a key disruptor representing this integrated vision in China's cloud ecosystem

In the face of policy and capital competition pressure from Chinese companies, LG Energy Solution (LGES) is implementing a strategy that combines time compression and accumulation. The "compression" of time refers to AI and digital transformation, while the "accumulation" of time refers to differentiated technology and patents

High-bandwidth memory (HBM) has become the latest competitive front for global DRAM manufacturers. As Samsung, SK Hynix, and Micron gear up for HBM4 mass production in 2026, China's CXMT has reportedly delivered 16nm HBM3 samples to Huawei and its partners, a prelude to large-scale manufacturing slated for the same year

The Ethernet for Scale-Up Networking (ESUN) Alliance officially launched at the 2025 Open Compute Project (OCP) Global Summit, uniting North America's AI heavyweights, including OpenAI, Meta, AMD, Nvidia, Microsoft, and Broadcom. Its goal is to create an open Ethernet interconnect standard to address AI chip connectivity fragmentation and redefine global AI infrastructure. The collaboration marks a rare alignment across major rivals in pursuit of interoperability

Automotive electronics manufacturer THN grabbed a Top Innovation Technology Award here on October 23 at the Future Innovation Technology Expo (FIX 2025) for its breakthrough transparent antenna technology. Dubbed 'FlexClear,' the system aims to enable high-speed, low-latency 5G and 6G connectivity for vehicles without using traditional external antennas. THN was one of nine top winners among thirty companies honored at the Daegu event

Samsung Electronics' Device Solutions (DS) division CTO Song Jae-hyuk expressed strong confidence in the revival of Samsung's foundry business and reported smooth progress on the company's 2nm process during a semiconductor industry briefing hosted by South Korea's chief presidential secretary for policy, Kim Yong-beom

Samsung Electronics and SK Hynix unveiled their next-generation high-bandwidth memory (HBM4) at SEDEX 2025 in South Korea, marking Samsung's first public display of an HBM4 sample domestically. The launch drew strong attention as the two memory leaders showcased contrasting strategies for the next stage of AI memory development

BMW's all-new iX3 — the first SUV on its Neue Klasse electric platform — is drawing strong early blind orders in Germany. But the model's fate will be decided in China, not Europe. And that reckoning begins in 2026

Samsung Electronics is reportedly set to start production of its AI-powered home assistant robot, Ballie, at its facility in Ho Chi Minh City, Vietnam, suggesting that the long-delayed device is finally nearing mass production

As the CHIPS and Science Act drives a shift in global semiconductor investments from Asia to the US, whether South Korean giants Samsung Electronics and SK Hynix can emerge successfully amid rising US–China tensions will depend on their ability to quickly establish stable production in the US, and on government efforts in navigating tariffs and other policies, according to South Korean media reports

China's Shenzhen Sapo Photoelectric will invest CNY1.334 billion (US$186 million) to build a new LCD and OLED polarizer production line in Shenzhen, worsening an already oversupplied market. With the global display supply chain increasingly concentrated in China, Taiwanese polarizer makers face intensifying pressure to transform

SK Hynix is positioned to thoroughly capitalize on the ongoing memory supercycle, driven by its superior DRAM technology and mass production capabilities, according to analysts

Teco and Foxconn are advancing their strategic partnership, focusing on AI data centers (AIDC), with plans to initiate concrete collaboration as early as 2026. Teco chairman Morris Li said in an interview on October 22, 2025, that both sides have established a dedicated project team communicating daily, steadily advancing the initiative