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Wednesday 10 July 2024
Rising HBM demand to benefit SK Hynix supplier in China
Yoke Technology, a China-based semiconductor and chemical material supplier, has disclosed its preliminary financial results for the first half of 2024. The company expects a net profit of CNY512-580 million (US$70-79 million), representing a 50% to 70% year-on-year increase
Wednesday 10 July 2024
Baidu CEO slams China's 'War of a Hundred Models' as resource-wasting
Robin Li, Chairman and CEO of Baidu has not minced words regarding the over-proliferation of AI models in China, lambasted the " war of a hundred models" as a substantial waste of societal and computational resources
Wednesday 10 July 2024
Battery maker SK On strives to stem losses
The prospect of South Korean battery maker SK On returning to profitability anytime soon looks dim, judging from the uncertainty in the market, according to industry sources
Tuesday 9 July 2024
Beijing legislates for robotaxis as backlash against them climbs
Beijing will support the introduction of robotaxis in ride-hailing and car rental fleets in the city as advanced driver assistance systems become more commonplace in China
Tuesday 9 July 2024
Honda to consolidate Thai car plants amid electrification push
Honda Motor Co. will consolidate its two car plants in Thailand by 2025 to deal with overcapacity and focus resources on electrification as battery electric vehicles gain popularity in the Southeast Asian nation with Chinese automakers entering the market
Tuesday 9 July 2024
Resonac forms alliance developing advanced packaging in US
A new semiconductor back-end process R&D alliance, US-JOINT, is set to launch in Silicon Valley in 2025. The alliance will focus on next-generation semiconductor packaging technologies to verify the latest concepts and innovations in the field
Tuesday 9 July 2024
Samsung to make 2nm chips for Japan AI firm
Samsung Electronics has announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer-Cube S (I-Cube S) to Preferred Networks, a leading Japanese AI company
Tuesday 9 July 2024
Japan invests in AI translation to boost ACGN export
The Japanese government's intellectual property export strategy, known as the "Cool Japan" strategy, proposed its latest amendment in 2024. It identified translation as the primary obstacle in developing overseas markets for Japan's ACGN (Anime, Comic, Game, Light Novel) industry. To address this challenge, industry players are actively investing in AI translation technology, sparking controversy within the translation industry
Tuesday 9 July 2024
EU tariff on Chinese EVs stirs industry waters, MG holds steady
The European Union's temporary tariff on Chinese electric vehicles (EVs) kicked in on the 5th, sparking varied reactions among automakers. Despite initial assurances from Chinese manufacturers that their European operations would remain unaffected and prices stable, there are signs of a shift in their stance
Tuesday 9 July 2024
Computing clusters with at least 10,000 GPUs become basic requirement for Chinese Gen-AI LLMs

The keen competition of large-language models (LLMs) is pushing various Generative AI operators in China to find alternatives to achieve higher computing power without Nvidia's advanced GPU cards such as A100

Tuesday 9 July 2024
SoftBank to acquire British AI chip designer Graphcore for US $500 million
SoftBank offered to acquire Graphcore, which designs AI chips for data centers, for US$500 million. The deal is subject to review by the UK, while SoftBank's massive stake in Arm likely smooths the way for the acquisition
Tuesday 9 July 2024
Nvidia's H20 to go head-to-head with Chinese AI chips; procurement intent from major CSPs will be key
The rapid development of large language models (LLMs) in China has led to various development bottlenecks for AI, including complex computing power management, high training and inference costs for LLMs, and task scheduling difficulties
Tuesday 9 July 2024
Samsung develops FOWLP-HPB packaging solution to curb mobile AP overheating
Samsung Electronics is reportedly developing a new packaging technology to address the overheating of mobile application processors (APs), which may be applied to its next-generation Exynos processors by the end of 2024
Tuesday 9 July 2024
Wafer Works ramps up cross-strait 12-inch production, eyes strong second half
Wafer Works, a veteran semiconductor silicon wafer foundry in China, made its debut on Shanghai's STAR Market in February 2024. Simultaneously, the company launched a major expansion project for 12-inch wafer production across facilities in Taiwan's Erlin and China's Zhengzhou, with completion expected by late 2025. Each site aims for a monthly capacity of 200,000 wafers, and construction is already underway
Tuesday 9 July 2024
Chinese EVs accelerate global expansion despite trade barriers
China's electric vehicle (EV) industry is aggressively pushing into overseas markets, navigating trade barriers from Europe and the US designed to stall its progress. However, these obstacles are only temporarily hindering China's EV exports while accelerating the relocation of its global supply chain
Next-Gen Retail Revolution: The Power of Edge AI and Cloud Surveillance
Summary of Tech Supply Chain News!
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research