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Wednesday 24 December 2025
InnoPad Taipei to debut in 2026 as Taipei's flagship hub for global startups
The Taipei City Government is rolling out a new phase of its innovation strategy. To advance the "Three Arrows for Startups" policy and strengthen the city's competitiveness within the global innovation ecosystem, the "InnoPad Taipei," located in Nangang and spanning approximately 5,300 square meters, has completed preliminary planning and is scheduled to officially launch in mid-2026. The hub will serve as the first landing point for international startups establishing operations in Taiwan
Wednesday 31 December 2025
Renouvo launches AI-driven low-carbon materials platform
Driven by the worldwide push for net-zero emissions and the rise of the circular economy, sustainability has become a central priority across the technology sector. The introduction of a dedicated sustainability zone at recent CES events further underscores how green materials and environmental innovation technologies have emerged as focal points at global tech exhibitions. Renouvo, a company with more than two decades of experience in biomaterials, is among the key players gaining increased attention in this industry shift.At CES 2026, Renouvo will unveil its new Low-Carbon Materials Platform, which integrates its proprietary negative-carbon technology with AI. The platform is designed to help global brands make measurable progress toward carbon-neutrality commitments, while expanding Renouvo's reach into the US consumer electronics supply chain.Founder and CEO Chris Huang noted that the company is honored to have been selected by TTA to participate in CES. He observed that major US consumer electronics brands are accelerating their ESG initiatives, actively seeking new materials with negative-carbon or low-carbon attributes - whether for device enclosures or protective packaging components. In recent years, several international brands have approached Renouvo for collaboration, aiming to reduce carbon emissions at the material source and achieve verifiable sustainability outcomes.Unique hydrogen-bonding patent and third-party verification strengthen material reliabilityRenouvo has long focused on plant-based materials, with a core mission of converting agricultural residues and biomass waste into market-ready low-carbon materials and plastic-free solutions. Beyond its own line of eco-friendly tableware, the company develops low-carbon and carbon-neutral materials for brand partners in the EU, Australia, and other regions, facilitating real-world adoption of circular-economy practices.According to Huang, although the number of companies offering recycled or "eco-friendly" materials has grown rapidly, truly durable, safe, and internationally deployable low-carbon materials remain scarce. Renouvo distinguishes itself by using agricultural waste - such as bagasse and spent coffee grounds - as primary feedstock, enhanced by its proprietary hydrogen-bonding technology. This innovation addresses the common limitations of plant-based materials, including softening and insufficient durability, while simultaneously delivering carbon-capture and carbon-sequestration benefits that reduce emissions at the source.To strengthen material credibility, Renouvo partners extensively with third-party verification bodies to establish comprehensive carbon footprint (CFP) reports, quantifying emissions across the entire product life cycle - from raw materials to manufacturing and final shipment. These transparent, verifiable datasets enable Renouvo's materials to be adopted in international supply chains and serve as a reliable foundation for brands evaluating ESG performance. Huang emphasized that the ability to provide clear, measurable carbon-reduction data is one of Renouvo’s most significant differentiators in the global materials marketplace.Negative-carbon materials integrated with AI strengthen adoption efficiency, with a focus on the US marketA major highlight of Renouvo's return to CES in 2026 is the debut of a new platform that integrates its carbon-negative material technology with AI. The platform analyzes key parameters - including material composition, process-level carbon emissions, durability, and cost structure - providing brands with comprehensive evaluation data prior to adoption. This significantly shortens material verification cycles and accelerates the transition from testing to mass production.Renouvo has participated in the TTA competition for two consecutive years and continues to seek CES exhibition opportunities, driven by the US market's increasingly stringent sustainability requirements for materials. Major US brands now demand verifiable evidence of carbon-neutral commitments and transparent supply-chain metrics. By leveraging visibility from CES and TTA, Renouvo aims to expand collaboration with leading US technology and consumer electronics companies, accelerate global adoption of negative-carbon materials, and position itself as a key partner in supporting multinational brands' sustainability strategies.Looking ahead, Renouvo plans to continue enhancing its AI-enabled materials platform, expand its carbon-footprint database, and strengthen customized service capabilities. The company's objective is to become a strategic partner for North America's top green-materials supply chains within the next three years. Huang emphasized that sustainability cannot remain at the level of slogans or declarations - it must be verifiable and quantifiable. Only when brands can clearly track and measure carbon-reduction outcomes will sustainable materials become mainstream, which is the core message Renouvo aims to deliver worldwide.Renouvo's diverse product portfolio. Credit: Renouvo
Tuesday 30 December 2025
HUA TEC advances Nano CAST for global liquid biopsy
Cancer is no longer considered untreatable, yet improving the accuracy and timeliness of diagnostics and treatment remains one of the most pressing challenges in clinical practice. Traditional cancer detection methods carry inherent limitations: tissue biopsies are highly invasive, causing discomfort and risk for patients, while blood-based biochemical tumor markers often lack specificity and fail to clearly differentiate between pathological signals and normal physiological fluctuations. As a result, liquid biopsy - valued for its safety, convenience, and ability to complement traditional pathology - has rapidly emerged as a global trend in cancer diagnostics.Developed by CytoAurora and distributed and supported by HUA TEC International, the Nano CAST AI semiconductor liquid tumor imaging system integrates semiconductor processes, AI imaging analysis, optical engineering, molecular pathology, and precision mechanics. The next-generation cancer cell detection platform will officially make its public debut at CES 2026, drawing significant attention from both medical and semiconductor communities.Chung-Er Huang, Chairman of HUA TEC International, noted that CytoAurora has long focused on single-cell biotechnology and device development, offering highly accurate solutions for genomic and protein-level analysis. To support the specialized needs of medical equipment deployment - installation, training, and maintenance - HUA TEC was established to lead Nano CAST's commercialization and technical support, helping hospitals and health examination centers rapidly adopt the system. The platform is already in clinical use at institutions such as Tzu Chi Hospital and Taipei Tzu Chi Hospital.According to Chien-Hsiang Tang, Vice President of HUA TEC International, Nano CAST utilizes semiconductor wafer-level surface modification to efficiently capture target cells circulating in the bloodstream. The system integrates precision mechanics and optical modules to automate cell capture, staining, and imaging. AI-driven image analysis then identifies and differentiates cancer cells from other cell types, enabling clinicians to execute targeted cell isolation, image interpretation, and downstream diagnostic analysis directly from blood samples.Nano CAST Supports the Full Cancer Care CycleAs semiconductor processes continue to advance, complex biochemical analyses that once required large laboratory setups can now be executed through highly integrated semiconductor biochips - making real-time testing more accessible and scalable. While genomic sequencing remains the most common application of such semiconductor-enabled medical technologies, HUA TEC is one of the few Taiwanese companies to extend semiconductor-based diagnostics into protein and biomarker analysis, particularly demonstrating strong breakthroughs in the field of liquid biopsy for oncology.Huang explained that Nano CAST is built upon two core components: the Cell Reveal Series and the CMS 200. The Cell Reveal Series uses semiconductor biochip technology to isolate specific or abnormal cells, forming nanoscale structures through plasma treatment, etching, and chemical modification that significantly enhance cell capture efficiency. The CMS 200 serves as the AI-driven imaging system that rapidly and objectively interprets captured cell and tissue images.Together, the system covers the complete clinical pathway of cancer care - from early detection of rare circulating tumor cells in blood, to monitoring treatment response, to identifying minimal residual disease (MRD) after therapy. By providing clinicians with earlier, more precise, and more actionable insights into disease progression, Nano CAST strengthens decision-making across the continuum of cancer management.TTA's High-Impact Global Pavilion Strategy Helps Drive Expansion into Central Asia, Europe, and the USAfter achieving notable milestones in Taiwan and obtaining BSI ISO 13485:2016 certification for medical device quality management, HUA TEC has accelerated its international expansion in recent years, establishing a presence in Thailand, Singapore, Japan, and Hong Kong. The company plans to further extend its footprint into Central Asia in 2026 as part of its broader global medical collaboration strategy.Huang emphasized that HUA TEC's consecutive participation in CES is driven by the strong curatorial and matchmaking capabilities of Taiwan Tech Arena (TTA). TTA's expertise in pavilion design, international outreach, and cross-border business facilitation significantly elevates the global visibility of Taiwanese startups. This enables companies such as HUA TEC to directly engage with major medical distributors, technology corporations, and investment groups across Europe and the United States, accelerating their path to market adoption.He stressed that Nano CAST demonstrates proven clinical performance, verifiable technical foundations, and scalability for commercial manufacturing - making CES the most important launchpad for HUA TEC's entry into the US and European markets. Through CES, the company aims to pursue strategic partnerships, initiate local clinical validations, and expand cross-border commercial activities, ultimately establishing a solid international presence. HUA TEC seeks to ensure that Taiwan's advanced semiconductor-enabled liquid biopsy technologies gain broader adoption across global clinical settings.The Nano CAST Cancer Solution for cancer cell detection. Credit: HUA TEC
Monday 29 December 2025
BOS Semiconductors Presents AI Box for Mobility at CES 2026
SEOUL, South Korea—December 24, 2025—BOS Semiconductors, a fabless semiconductor company specializing in automotive and physical AI semiconductors, today announced that it will participate in CES 2026, the world's largest technology exhibition, taking place in Las Vegas, USA from January 6–9, 2026. At the event, BOS will unveil an AI Box demo designed for next-generation mobility.At CES 2026, BOS will highlight its strategy aligned with major industry trends, including the advancement of autonomous driving, the shift toward Software Defined Vehicles (SDVs), and the expansion of Physical AI. Through the demonstrations, BOS will present how to anticipate emerging needs in mobility AI environments - such as: Support for a wide range of AI models based on CNN and Transformer architectures, Flexible scalability and integration with existing automotive electronic systems, Real-time perception and decision-making enabled by physical AI.To support these capabilities, BOS will showcase AI model demos powered by its AI Box integrating the high-performance AI accelerator Eagle-N. The AI Box is an external AI computing module that allows automakers (OEMs) to add an "AI brain" to vehicles without replacing existing in-vehicle infotainment (IVI) systems, enabling fast AI expansion with minimal platform change.With the AI Box, OEMs can minimize changes to their existing systems while extending high-performance AI functionality independently. This approach accelerates adoption of advanced AI capabilities not only in new vehicles but also in facelift models - updated versions of existing vehicles with enhanced design and features - reducing development cost and time while improving long-term product competitiveness.The AI Box is based on an on-device AI architecture, delivering several advantages. Sensitive data such as voice and video can be processed directly inside the vehicle rather than being transmitted to the cloud, strengthening privacy protection and data security. It also ensures stable AI operation regardless of network connectivity, improving overall reliability. Over the long term, the AI Box can reduce total cost of ownership (TCO) by lowering cloud traffic, inference, and storage costs. In addition, it offers strong scalability without requiring server expansion as the number of users increases.BOS' AI Box is designed to integrate flexibly with existing vehicle systems through multiple interfaces, enabling an efficient AI vehicle architecture based on clear role separation: AI-intensive functions are handled by the AI Box, while existing systems continue performing their original roles. At the booth (Venetian Expo, Hall A, Booth #50017), BOS will demonstrate on-device AI models that combine Vision-Language Models (VLMs) and Large Language Models (LLMs) based on the AI Box architecture. The demo will also be showcased at the Tenstorrent Demo Room as well."Through our AI Box demo with Eagle-N at CES 2026, we will present a practical approach for effectively scaling AI capabilities even on existing mobility system," said Jason (Jeongseok) Chae, Vice President and Head of Strategic Marketing & Sales at BOS. "We aim to evolve beyond automotive semiconductors and become a core semiconductor company leading the era of Physical AI."