After spending US$11.3 billion in semiconductor capex last year, Samsung announced that its 2017 outlays for the semiconductor group are expected to more than double to US$26 billion...
Samsung expects capital expenditure (capex) for 2017 to be approximately KRW46.2 trillion (US$41.5 billion), a significant increase from 2016. Capex for the semiconductor and display...
The global smartphone applications processor (AP) market declined 5% on year to reach US$9.4 billion in the first half of 2017, according to Strategy Analytics. Qualcomm maintained...
Taiwan Semiconductor Manufacturing Company (TSMC) has reported net profits of NT$89.93 billion (US$2.97 billion) on consolidated revenues of NT$252.11 billion for the third quarter...
Samsung Electronics' 8nm FinFET process technology, the 8LPP (Low Power Plus), has been qualified and is ready for production, according to the company.
HiSilicon Technologies is seeking a second-source supplier for the fabrication of its 7nm chips, with Samsung Electronics, Globalfoundries and Intel striving for orders from the China-based...
Intel has released its Coffee Lake-based 14nm desktop processors including Core i7-8700K/8700, Core i5-8600K/8400 and Core i3-8350K/8100, as well as the corresponding Z370 chipsets...
United Microelectronics (UMC) recently disclosed plans to expand its 28nm process offering by launching 28nm HPC and 28nm HPC Plus nodes, and introduce a further improved version...
A ramp-up of orders for communications chips, as well as TV panel-use driver ICs and TDDI (touch with display driver) chips, will enable Taiwan-based IC backend firms to enjoy a particularly...
Globalfoundries has announced plans to introduce a new 12nm leading-performance (12LP) FinFET semiconductor manufacturing process. The technology is expected to deliver better density...
In 2017, the 7% increase in the total pure-play foundry market is forecast to be almost entirely due to an 18% jump in sub-40nm feature size device sales, according to IC Insights.
Intel has reportedly rescheduled the releases for some of its next-generation Cannon Lake-based processors, mostly ones with an integrated GPU, to the end of 2018, which has already...
Intel has provided updates for its 10nm process and plans for 10nm FPGAs, as well as the availability of its 64-layer 3D NAND for data center applications. The disclosures were made...
China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...
IC testing solution provider Chunghwa Precision Test Technology (CHPT) expects to start mass shipments of solutions for the manufacture of 7nm chips in the second half of 2018. Shipments...
