Powerchip Technology, in line with its corporate restructuring, has transferred all its fab and business assets to its 8-inch foundry subsidiary Powerchip Semiconductor Manufacturing...
China-based foundries including Hua Hong Semiconductor, CanSemi Technology, and memory startup ChangXin Memory Technologies (CXMT) have recently started operating their new 12-inch...
DRAM chipmaker Nanya Technology, specialty DRAM and flash memory specialist Winbond Electronics and mask ROM and flash chipmaker Macronix International are expected to post substantial...
Winbond Electronics has announced its new LPDDR4X memory series designed for the emerging AI and 5G applications, such as ADAS, smart speakers, 8K TVs, 5G mobile phones and security...
China's move to improve self-sufficiency for semiconductors is gaining momentum - in line with the country's national policy and in the wake of the trade war with the US - with DRAM...
China-based DRAM chipmaker ChangXin Memory Technologies (CXMT, formerly Innotron) has kicked off 12-inch fab equipment move-in in the third quarter, aiming to start commercial runs...
Both Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) saw losses from their 12-inch wafer fabs in China during the first half of 2019, while fellow...
China's state-owned Tsinghua Unigroup has clinched a deal with the Chongqing municipal government to build its DRAM operations headquarters, R&D and manufacturing facilities in...
Taiwan-based memory modules packagers Orient Semiconductor Electronics (OSE) and ChipMos Technologies are expected to see their revenues pick up month by month in the second half...
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) expects to have its more-advanced 14nm FinFET process ready for volume production by the end of 2019.
Jiangsu Changjiang Electronics Technology (JCET), the largest China-based IC backend service provider, has announced that volume production is kicking off at its new 12-inch wafer...
Specialty DRAM and flash memory maker Winbond Electronics has seen its 12-inch fab run at full capacity starting July, thanks to the arrival of new orders and seasonal factors.
Pure-play foundry United Microelectronics (UMC) expects to post a 2-4% shipment increase sequentially in the third quarter of 2019, with a 1% rise in wafer ASPs.
