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NEWS TAGGED 12-INCH
Thursday 14 November 2019
Powerchip sees improvement in order visibility
Powerchip Semiconductor Manufacturing (PSMC), a foundry subsidiary of Powerchip Technology, has seen its order visibility improve and managed to return to monthly profits in the second...
Thursday 14 November 2019
TSMC, UMC to allocate more 12-inch fab capacity for display driver IC
TSMC and UMC are set to allocate more of their available 12-inch fab capacities for the fabrication of display driver ICs in 2020 to satisfy growing demand for applications such as...
Wednesday 13 November 2019
Chinese DRAM maker CXMT ramping 19nm process output
China-based DRAM chipmaker ChangXin Memory Technologies (CXMT, formerly Innotron) has managed to improve its 19nm process manufacturing yield rates to satisfactory levels, and is...
Tuesday 12 November 2019
Silicon wafer makers see chipmakers reluctant to strike LTA contracts
Silicon wafer manufacturers have seen their clients become more reluctant to sign long-term agreements (LTA) particularly those for 8-inch and smaller size products, according to...
Monday 11 November 2019
Silicon wafer shipments in low gear for 4Q19
Silicon wafer shipments are expected to stay in low gear in the fourth quarter of 2019 as clients have decelerated their shipment pull-in to facilitate year-end financial settlements,...
Tuesday 29 October 2019
IC design rises as largest segment in China semiconductor industry
China's semiconductor industry has experienced a more reasonable structural adjustment with IC design replacing packaging and testing as the largest segment in terms of revenue contribution...
Tuesday 29 October 2019
China DRAM rise looming, may reshape global market in 5-10 years
The global DRAM market, now over 90% controlled by three major players Samsung Electronics, SK Hynix and Micron, is likely to experience a structural shakeup in the next 5-10 years,...
Monday 28 October 2019
Winbond posts profit growth in 3Q19
Specialty DRAM and flash memory maker Winbond Electronics has announced net profit increased 27.9% sequentially to NT$591 million (US$19.3 million) in the third quarter of 2019. EPS...
Thursday 24 October 2019
TSMC to accelerate 3nm fab construction
TSMC is expected to step up the construction of its advanced 3nm wafer fab after securing 30 hectares of land in the Southern Taiwan Science Park (STSP) by the end of 2019, according...
Tuesday 15 October 2019
Powerchip eyeing return to Taiwan stock market
Powerchip Technology, in line with its corporate restructuring, has transferred all its fab and business assets to its 8-inch foundry subsidiary Powerchip Semiconductor Manufacturing...
Wednesday 25 September 2019
More 12-inch wafer fabs come online in China
China-based foundries including Hua Hong Semiconductor, CanSemi Technology, and memory startup ChangXin Memory Technologies (CXMT) have recently started operating their new 12-inch...
Monday 23 September 2019
TSMC to volume produce 5nm chips as early as March 2020
TSMC is expected to move its more advanced 5nm process technology to volume production as early as March, according to industry sources.
Monday 23 September 2019
Taiwan memory chipmakers to see sales peak in 3Q19
DRAM chipmaker Nanya Technology, specialty DRAM and flash memory specialist Winbond Electronics and mask ROM and flash chipmaker Macronix International are expected to post substantial...
Friday 20 September 2019
Winbond launches LPDDR4X memory
Winbond Electronics has announced its new LPDDR4X memory series designed for the emerging AI and 5G applications, such as ADAS, smart speakers, 8K TVs, 5G mobile phones and security...
Tuesday 10 September 2019
Highlights of the day: China DRAM maker moves in equipment at 12-inch fab
China's move to improve self-sufficiency for semiconductors is gaining momentum - in line with the country's national policy and in the wake of the trade war with the US - with DRAM...