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NEWS TAGGED 12-INCH
Tuesday 20 June 2017
GlobalWafers teaming up with Ferrotec to expand 8-inch wafer supply
Taiwan-based GlobalWafers is teaming up with Ferrotec to ramp up new 8-inch wafer capacity, according to company chairperson Doris Hsu.
Tuesday 20 June 2017
Powerchip to restart NOR flash manufacturing
Powerchip Technology has restarted its NOR flash production line amid tight supply of the memory.
Wednesday 14 June 2017
Winbond to expand 12-inch fab capacity
Winbond Electronics plans to expand its 12-inch fab capacity to 48,000 wafers per month by the end of 2017 from the current 44,000 units, according to the memory maker. The monthly...
Saturday 3 June 2017
SMIC eyeing top-3 spot in pure-play foundry segment
Semiconductor Manufacturing International (SMIC) is aiming to become a global top-3 pure-play foundry chipmaker by 2020, according to the China-based company. In addition to advanced...
Tuesday 30 May 2017
TSMC to start equipment move-in at Nanjing plant in September
Taiwan Semiconductor Manufacturing Company's (TSMC) new 12-inch plant in Nanjing, China will be ready for equipment move-in in September 2017, according to the Taiwan-based foundry...
Wednesday 24 May 2017
Hefei Chang Xin keeps low profile but DRAM ambition remains unchanged
Hefei Chang Xin's ambition to grow its DRAM business has seen some progress though the China-based firm has now chosen to keep a low profile. The company has been quietly renamed...
Monday 15 May 2017
Ardentec 1Q17 profits hike over 100%
Taiwan-based Ardentec, which specializes in testing services for logic and memory chips, has reported net profits surged 115% on year to NT$228 million (US$7.6 million) in the first...
Thursday 11 May 2017
Sumco lowering wafer shipments to XMC, say sources
Sumco has reportedly cut its wafer shipments to Wuhan Xinxin Semiconductor Manufacturing (XMC), and given priority to Taiwan Semiconductor Manufacturing Company (TSMC), Intel and...
Thursday 4 May 2017
Xintec reports 7th consecutive quarterly loss in 1Q17
Specialty-IC packaging specialist XinTec has reported a seventh consecutive quarterly loss in the first quarter of 2017, in which net losses came to NT$248 million (US$8.23 million)...
Tuesday 2 May 2017
Winbond planning new 12-inch fab
Specialty DRAM and NOR flash memory maker Winbond Electronics is planning a new 12-inch wafer plant which will be located in Tainan, southern Taiwan or Singapore.
Tuesday 2 May 2017
Acer unveils new 2-in-1 devices
Acer has announced two new 2-in-1 devices under its Switch series, the Switch 5 and 3, both using Windows 10. Both 2-in-1 devices feature Acer’s Active Pen, allowing users to...
Thursday 27 April 2017
UMC expects flat performance in 2Q17
United Microelectronics (UMC) expects its wafer shipments and ASPs to stay flat sequentially in the second quarter of 2017, when the foundry chipmaker's capacity utilization rate...
Wednesday 26 April 2017
Micron talks about its integrated global operations
Micron Technology has been actively allocating its global resources to enhance its DRAM and NAND flash product lines, according to Wayne Allan, VP of global manufacturing at the US-based...
Wednesday 26 April 2017
GlobalWafers seeing robust semiconductor wafer demand
Demand for semiconductor-grade silicon wafers has been robust, according to GlobalWafers, which expects the market to see tight supply through the end of 2018.
Tuesday 25 April 2017
Ardentec breaks ground for new plant in Nanjing
Taiwan-based Ardentec, which specializes in testing services for logic and memory chips, has recently broken ground for a new plant in Nanjing, China where Taiwan Semiconductor Manufacturing...