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Monday 30 October 2023
Winbond upbeat about 2024 prospects
Winbond Electronics, a specialty DRAM and flash memory maker, has expressed optimism about its business and market prospects for next year, noting the resolution of the majority of...
Thursday 21 July 2022
NOR flash prices to fall 10-15% in 3Q22
NOR flash memory prices are poised to drop 10-15% in the third quarter of 2022, as China-based suppliers scale up their output and offer more competitive prices, according to industry...
Wednesday 22 June 2022
Top suppliers enjoy big gains in small NOR flash market
NOR flash memory sales surged 63% on year to US$2.9 billion in 2021, representing only 4% of the total flash memory market last year, according to IC Insights.
Wednesday 30 March 2022
Samsung to stop taking DDR3 orders after 2022
Samsung Electronics has notified customers that the company will take DDR3 chip orders until the end of 2022 and fulfill the orders for deliveries until the end of 2023, according...
Wednesday 23 March 2022
NOR flash supply stays tight
The supply of NOR flash memory particularly high-density chips remains tight, but suppliers are only capable of raising prices for part of their high-end products, according to industry...
Friday 3 September 2021
DDR3 contract prices likely to drop in 4Q21
DDR3 contract prices for the fourth quarter will be under downward pressure, as spot prices have been falling recently, according to industry sources.
Friday 13 August 2021
Winbond to generate additional output for specialty DRAM starting 4Q22
Winbond Electronics expects to kick off production for specialty DRAM memory in small volume at its new plant in Kaohsiung, southern Taiwan in the fourth quarter of 2022, according...
Wednesday 16 December 2020
High performance and low power consumption give Winbond's 1Gb LPDDR3 DRAM the edge in Tsing Micro's new AI image-processing SoC
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced that a high-performance, low-power Winbond 1Gb LPDDR3 DRAM product has achieved...
Tuesday 22 September 2020
High-bandwidth 1Gb LPDDR3 from Winbond helps latest Kneron KL720 SoC achieve new industry-high 1.4 TOPS throughput in edge AI applications
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today revealed that the latest system-on-chip (SoC) from artificial intelligence (AI)...
Thursday 30 April 2020
Winbond powering AIoT and 8K TV applications with 1Gb LPDDR3 DRAM to embrace new growth opportunities
With the rapid rise of Internet of Things (IoT) combining with artificial intelligence (AI) technologies, the emerging application w/ AI engine boosting to be powerful and popular...
Monday 17 February 2020
Winbond, Macronix to enhance SLC NAND offerings for profitability
Winbond Electronics and Macronix International are both looking to further enhance their SLC NAND flash chip offerings for industrial and other niche-market applications in 2020,...
Tuesday 10 December 2019
Macronix gearing up for 3D NAND flash
Macronix International is poised to kick off commercial shipments of 48-layer 3D NAND flash chips in the second half of 2020, followed by volume shipments of 96-layer 3D NAND products...
Thursday 25 July 2019
Everspin, Phison partner to bring STT-MRAM to SSD controllers
Everspin Technologies, a developer and manufacturer of magnetoresistive RAM (MRAM) persistent memory solutions, has announced Phison Electronics will provide native support for Everspin's...
Tuesday 15 May 2018
Bitmain reportedly places DRAM orders with ESMT, Etron
Bitmain has reportedly placed DRAM orders mainly for low-capacity DDR3 chips with Taiwan-based memory design specialists Elite Semiconductor Memory Technology (ESMT) and Etron Technology,...
Tuesday 18 July 2017
Macronix launches AEC-Q100 full compliant NAND flash memory
Macronix International has launched an AEC-Q100 Grade 2/3 compliant NAND flash memory product. The company added its NAND flash memory has passed all the stringent AEC-Q100 reliability...