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NEWS TAGGED 2025
Friday 6 September 2024
WinWay sees co-packaged optics ready for mass production by 2026
In the silicon photonics packaging and testing interface sector, WinWay Technology has intensified its efforts and anticipates that its co-packaged optics (CPO) product will be prepared...
Friday 6 September 2024
Advanced packaging material sales to skyrocket in 2025, says Topco Scientific
Topco Scientific, a supplier of semiconductor materials, anticipates substantial sales growth for advanced packaging materials in 2025 due to demand generated by AI applications.
Thursday 5 September 2024
IC material supplier Wah Lee sees robust demand for CoWoS packaging
Wah Lee Industrial, which distributes photoresist and CMP slurries, and other front-end process manufacturing materials, expects robust demand for CoWoS packaging to drive significant...
Thursday 5 September 2024
Taiwan's RF and baseband 6G chips entering tapeout by 2025
Since carriers adopted 5G, the technology has not stopped evolving. For example, the 5G Advanced Network Solutions and the research and development of radio frequency (RF) and baseband...
Thursday 5 September 2024
CHPT expects US customers for AI offering
At the SEMICON Taiwan 2024, Scott Huang, president of Chunghwa Precision Test (CHPT), a leading probe card manufacturer, remarked that the second half of 2024 is expected to outperform...
Thursday 5 September 2024
Notebook panel shipments peak in 3Q24, driven by back-to-school rush and entry-level boom
Global notebook (NB) panel shipments are expected to reach their highest point in the third quarter of 2024, propelled by the back-to-school season and increased orders from major...
Wednesday 4 September 2024
Cable maker VSO upbeat about AI server demand beginning in 2025
VSO Electronics, a specialist in the development, production, and distribution of connection cables, is targeting six major industries for future developments, and has begun developing...
Wednesday 4 September 2024
SEMICON Taiwan 2024: AI chipmaking, HBM in spotlight
Key AI chipmaking and high-bandwidth memory (HBM) technologies will be highlighted at SEMICON Taiwan 2024, where major manufacturers will gather to present their most recent develo...
Tuesday 3 September 2024
AI server boom to fuel PCB industry optimism in 2025
The second-quarter financial reports of tech giants have been gradually released, with Nvidia delivering results that exceeded expectations, maintaining year-over-year growth, quarter-over-quarter...
Tuesday 3 September 2024
ITE Tech optimistic about PD chip shipments in 2025
Taiwanese IC design firm ITE Tech has reported higher-than-expected gross margins in the second quarter of 2024, despite facing pressure to reduce prices and potential exchange rate...
Tuesday 3 September 2024
Semiconductor equipment spending in China to fall amid new rising forces
Semiconductor equipment spending in China is poised to fall throughout 2027 while new forces emerge in Europe, Japan, and the US, where spending will surge, according to SEMI.
Monday 2 September 2024
Samsung continues to push back construction on P4 and P5 to focus on Taylor site
Previously, Samsung Electronics reportedly decided to suspend the construction of its Phase 2 wafer foundry production line at the Pyeongtaek P4 fab.
Monday 2 September 2024
Intel Gaudi 3 welcomes first major cloud customer with adoption from IBM Cloud
Starting in early 2025, IBM Cloud will allow customers to use Intel's latest Gaudi 3 AI accelerators. This marks the first publically known, major cloud industry customer for Gaudi...
Friday 30 August 2024
Sonix Technology cautious about 2H24, pins hope on AI PC and automobiles
Sonix Technology, a microcontroller (MCU) manufacturer, reported that the notebook (NB) industry is actively advancing the AI PC market. Sonix plans to introduce its human presence...
Friday 30 August 2024
SMIC to launch four new 12-inch fabs after 2025, targeting 28nm and above for local demand
Semiconductor Manufacturing International Corporation (SMIC), China's leading foundry, is significantly expanding its production capacity with four new 12-inch wafer fabs in Beijing,...