The global foundry industry's revenue grew about 9% sequentially and 23% year on year in the second quarter of 2024, according to Counterpoint Research. The sequential growth was...
Thermal management specialist Forcecon Tech is actively expanding into liquid cooling solutions for AI servers. The company's in-row coolant distribution units (CDUs) are slated to...
Generalplus, a leading microcontroller (MCU) manufacturer, anticipates steady revenue growth despite ongoing global economic fluctuations. Yixing Jia, General Manager of Generalplus,...
James Huang, Chairman of Getac Technology (Getac), announced that by the end of 2025, all of Getac's rugged industrial computers will be equipped with NPUs (Neural Processing Units)...
Due to several factors such as inventory de-stocking and investment delays caused by weak economic environments, many industrial PC (IPC) companies faced declines in the first half...
In response to robust demand for servers that has resulted in capacity constraints, major DRAM manufacturers have significantly increased the prices of DDR5 memory in the third quarter,...
Latest rumors have it that Apple is ready to equip the iPhone with its in-house developed modem chip in 2025, but industry sources remain skeptical. Even if Apple was able to roll...
The second half of the year is traditionally the peak season for the launch of flagship smartphones, which is expected to boost demand for key components such as PCBs (Printed Circuit...
Rumors indicate that Apple is developing a foldable iPhone, with speculation about a larger device that could be a hybrid between a Mac and an iPad. Recent reports suggest that Apple's...
Packaging firm Xintec Technology is optimistic about upcoming demand for 3D sensing components packaging and 12-inch wafer testing in the third quarter, the traditional peak season...
Intel has been hit with a string of misfortunes of late, as the PC processor giant's brand image is severely tarnished by irrevocable defects in its products, not to mention corporate...
The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60,000 wafers per month in 2025, with a projected increase to 70,000-80,000...
