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NEWS TAGGED 2026
Monday 7 September 2026
Weekly news roundup: AI memory race heats up, Taiwan manufacturing rebounds, Nexperia rift deepens
AI infrastructure and semiconductor supply chains led reader interest this week, from Taiwan's manufacturing recovery and Nexperia's legal battle to Sandisk's HBF, Micron's HBM expansion,...
Monday 7 September 2026
Wah Lee sees faster growth in 2027 as supply stays tight
Wah Lee Industrial expects growth to accelerate in 2027 as advanced packaging capacity comes online and foundries continue building overseas fabs, while tight supplies of semiconductor...
Monday 7 September 2026
Every Chinese CPU maker grew in 1H26 but only one grew on processors
Revenue rose at every Chinese chip company examined in the first half of 2026 amid the domestic-substitution push, but the interim filings show three quite different businesses hiding...
Monday 7 September 2026
Exclusive: DIGITIMES' top 3 at K-Safety Expo 2026 shows where intelligent safety is heading — act 'before' disaster strikes
The most consequential safety technologies are often judged by what happens after something goes wrong: how fast an alarm sounds, how quickly rescuers arrive, or how effectively protective...
Monday 7 September 2026
No foundry price relief before 2027 as utilization nears 90%

AI demand is driving a broader repricing cycle across the foundry industry in 2026. Tightness that began at leading-edge nodes is spreading...

Monday 7 September 2026
SiliconAuto pushes AI chiplets as automotive SoC ties tighten
Taiwanese automotive microcontroller (MCU) maker SiliconAuto showcased its products at SEMICON Taiwan 2026, with CEO Gene Liu saying the company is now spotlighting AI chiplet architecture...
Monday 7 September 2026
Taiwan-Netherlands silicon photonics team targets 1.6T DR8 in 2026, 3.2T optical links next
AI data center demand is accelerating the shift to faster optical interconnects, putting transmission speed, power efficiency, and packaging integration at the center of next-generation...
Monday 7 September 2026
Machine builders flood SEMICON 2026 to grow local chip tools
Taiwan's machinery industry is pushing to turn its semiconductor advantage into a domestic equipment supply chain, as more than 100 member companies join SEMICON Taiwan 2026 and the...
Monday 7 September 2026
China NEV imports sink as local brands crowd out foreign cars
China’s new energy vehicle import market continued to shrink in July, hitting its lowest level since 2026, as foreign automakers localize production and Chinese brands keep expanding...
Sunday 6 September 2026
Hiwin Mikrosystem targets SiPh inspection gear as capacity expands 20%, order visibility extends to 2Q27
Driven by the shift from copper to optical interconnects, silicon photonics (SiPh) and co-packaged optics (CPO) are moving rapidly toward mainstream adoption, fueling demand across...
Sunday 6 September 2026
I-Chiun eyes Nvidia Vera Rubin supply chain as thermal business nears half of sales
I-Chiun Precision Industry is accelerating its shift from LED lead frames into high-end thermal solutions, with thermal products now accounting for 40-45% of revenue. The company expects...
Sunday 6 September 2026
K-Safety Expo 2026: Safety gets smarter as six innovators win foreign media honors
The BEST OF K-SAFETY EXPO Global Media Awards on September 3 offered a revealing snapshot of where safety technology is heading: away from passive protection and toward systems that...
Sunday 6 September 2026
TWM, SYSTEX debut at smart building expo
Taiwan Mobile announced that it is participating for the first time with Systex in the "2026 Build for NextGen – International Sustainable Intelligent Building & Intelligent...
Sunday 6 September 2026
Taiwan chip equipment maker Scientech sees orders into 2028, may turn away customers in 2027
AI and high-performance computing (HPC) demand is extending order visibility for Taiwanese semiconductor equipment supplier Scientech into 2028, while capacity constraints may force...
Sunday 6 September 2026
Podcast highlights: SoIC vs CoWoS, HBM5 hybrid bonding, and EMIB-T's yield problem
In a podcast, DIGITIMES analyst Luke Lin said hybrid bonding is drawing fresh attention at SEMICON Taiwan 2026 and could become a key driver of advanced packaging capacity expansion...