Semiconductor equipment spending in China is poised to fall throughout 2027 while new forces emerge in Europe, Japan, and the US, where spending will surge, according to SEMI.
It was previously reported that Meta Platforms has canceled its planned high-end mixed reality (MR) headset project, internally codenamed "La Jolla," originally slated for release...
Rapidus, aiming to begin mass production of 2-nanometer chips in Japan by 2027, is seeking significant financial support for its trial production and eventual mass production.
Following investments in wafer fabs in the US and Japan, TSMC is scheduled to hold a groundbreaking ceremony for its wafer fab in Dresden, Germany, on August 20. The fab is expected...
TSMC has been placing large volumes of orders for production equipment and factory engineering projects in support of its fast capacity expansion, dispelling skepticism about the...
TSMC Chairman C.C. Wei is set to lead the groundbreaking ceremony for the European Semiconductor Manufacturing Company (ESMC) in Dresden, Germany, on August 20, 2024.
Asus has released its operating performance for the second quarter of 2024, revealing profits that exceeded market expectations. Co-heads Jackie Hsu and Samson Hu expressed optimism...
Luca Rossi, president of Lenovo's Intelligent Devices Group (IDG), stated that all Lenovo PC products will feature AI functions by 2027. Additionally, Lenovo aims to enhance its smartphone...
SK Hynix has announced board approval for a KRW9.4 trillion (approximately US$6.77 billion) investment to construct its first plant and related operational facilities at the Yongin...
TSMC has made a production roadmap for using high-NA EUV lithography equipment to make 1.4nm chips starting as early as 2028, according to industry sources.
TSMC is expected to break ground on its new wafer fab in Germany around the end of 2024, with volume production to begin by the end of 2027, according to sources at semiconductor...
In July 2022, Thailand unveiled its national AI strategy and action plan, outlining the government's roadmap through 2027 to enhance its AI infrastructure and spur economic growth...
Samsung Electronics is introducing the 1.4 nm process, BackSide Power Delivery Network (BSPDN), and Silicon Photonics (SiPh) technologies by 2027 to enhance its AI solution strategy...
Volkswagen said on May 28 that it plans to roll out a low-cost EV for the European market in 2027, a move that will help it counter Chinese rivals' offense. In addition, Magna Steyr...
